Method for depositing vanadium dioxide thin film on glass under low temperature
A deposition method, a technology of vanadium dioxide, applied in the field of building energy conservation, can solve problems such as obstacles to the industrialization of smart glass and increase the difficulty of industrialization, which have been started as early as the early 1970s, so as to reduce the difficulty and save energy. Effects of energy consumption and low crystallization temperature
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Embodiment 1
[0021] The multilayer film was prepared by magnetron sputtering, and the magnetron sputtering system included a transition chamber and a main sputtering chamber (45 cm in diameter). The main sputtering chamber is connected with a molecular diffusion pump, and the ultimate vacuum is 2.0×10 -6 Pa. The sputtering chamber has three target positions for three different 2-inch diameter targets. Each target position is inclined upward at an angle of 30°, and can be co-sputtered upwards in a confocal manner or sputtered upwards in a three-target independent manner. The sample stage can be heated up to over 600°C and can keep rotating continuously during the sputtering process.
[0022] In the experiment, the substrate was float glass. The substrate was ultrasonically cleaned in anhydrous alcohol and acetone for 5 minutes, then dried with nitrogen, fixed on the sample stage and placed in a transitional vacuum chamber for vacuuming. After 10 minutes, transfer to the sputtering vacuu...
Embodiment 2
[0028] The vacuum deposition system and substrate cleaning and installation process are the same as those in Embodiment 1. Before thin film sputtering, the glass substrate was heated to 300 °C and kept constant.
[0029] Preparation of silica diffusion barrier layer. Silicon is used as the cathode sputtering material, radio frequency sputtering, and the sputtering power is set to 100W. When the sputtering chamber is fed with Ar gas, it is also fed with O 2 Gas (purity higher than 99.9%), the flow velocity of Ar gas is 30sccm, O 2 The gas flow rate was 7.5 sccm. Sputtering for 20 minutes, deposited Si0 2 The thickness of the film layer is about 60nm.
[0030] Preparation of ZnO seed layer. The preparation conditions are as follows: use metal zinc as the target material (purity: 99.9%), and the working atmosphere is high-purity Ar gas (purity: 99.9995%) and high-purity O 2 Gas (purity: 99.9%) mixed gas. Ar gas is injected into the sputtering chamber with a flow rate of 3...
Embodiment 3
[0034] The vacuum deposition system and substrate cleaning and installation process are the same as those in Embodiment 1.
[0035] Before thin film sputtering, the float glass substrate was heated to 250 °C and kept constant.
[0036] The preparation of the silicon dioxide diffusion barrier layer is exactly the same as in Example 1.
[0037] The preparation of the zinc oxide seed layer was the same as in Example 2, and the sputtering was performed for 50 minutes. At this time, the thickness of the ZnO film deposited on the glass substrate is about 200nm.
[0038] The last is the preparation of vanadium dioxide thermochromatography. Preparation conditions are as follows: adopt vanadium dioxide to make sputtering target material (purity 99.5%), in Ar gas (flow velocity 30sccm) and O 2 Reactive deposition was carried out in a mixed gas of gas (flow rate 1.5 sccm). RF power is set to 100W, sputtering for 100 minutes, VO 2 The film thickness is about 35nm.
[0039] X-ray dif...
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