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Pd/Sn colloid catalyst adsorption enhancer

A technology of adsorption promotion and catalyst, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of decreased adhesion between raw materials and electroplating film, and achieve the effect of improving precipitation and good coating

Inactive Publication Date: 2008-10-08
EBARA-UDYLITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, methods such as improving the throwing property of copper sulfate electroplating by adding a polyol compound to the solution in the metal coating step after the catalyst is also proposed (for example, refer to Patent Document 2), but, for example, in a chromic acid etching solution Addition of palladium reduces the etching (roughening) ability, resulting in other problems such as a decrease in the adhesion between the raw material and the plating film.

Method used

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  • Pd/Sn colloid catalyst adsorption enhancer
  • Pd/Sn colloid catalyst adsorption enhancer
  • Pd/Sn colloid catalyst adsorption enhancer

Examples

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Embodiment 1

[0038] Using the solution of the present invention and the comparison solution described below, the following to-be-treated objects were subjected to catalyst imparting treatment, and the surface thereof was subjected to electroplating treatment.

[0039] (1) Objects to be processed

[0040] Processed object 1:

[0041] Adopt a surface area of ​​about 8dm 2 ABS rearview mirror cover (mirror cover) for automobiles. A jig made of sol-baked varnish made of vinyl chloride is used as a jig for plating to support the object to be processed at three contact points.

[0042] Processed object 2:

[0043] The surface area used is about 6dm 2 ABS molded parts for automobiles. A jig for plating is used that supports the object to be processed at two contact points, and other than the contact points are made of vinyl chloride sol-baked varnish.

[0044] (2) Catalyst treatment

[0045] First, place the object fixed on the jig in an etching solution composed of an aqueous solution con...

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Abstract

Disclosed are: a Pd / Sn colloid catalyst adsorption enhancer which can be used for the formation of a metal coating film on the surface of a non-conductive material (e.g., plastic) by plating with good efficiency; a catalyst-addition solution comprising the adsorption enhancer; and a method for plating a non-conductive material. The adsorption enhancer can be used for the plating onto a non-conductive material and comprises a bromine compound of any one selected from a typical metal element, a typical non-metal element and a transition metal element with bromine. The bromine compound may be lithium bromide, sodium bromide, aluminum bromide, potassium bromide, calcium bromide, strontium bromide, tin (II) bromide, cesium bromide, barium bromide, hydrobromic acid, silicon (IV) bromide, vanadium (III) bromide, manganese (II) bromide, iron (II) bromide, cobalt (II) bromide, nickel (II) bromide, palladium (II) bromide, gold (III) bromide, or the like. The non-conductive material may be an ABS resin, a PC resin-blended ABS resin, or the like.

Description

technical field [0001] The present invention relates to an adsorption promoter for a palladium-tin colloidal catalyst for promoting the adsorption of a palladium-tin colloidal catalyst on the surface of a non-conductive material when a metal coating is formed by electroplating on a non-conductive material such as plastic, and an adsorption promoter containing the adsorption promoter. Catalyst-donating solution of agent and electroplating method of non-conductive material. Background technique [0002] Conventionally, in order to form a metal coating on non-conductive materials such as plastics, the method adopted is the following so-called plastic plating method: that is, a palladium-tin colloidal catalyst (hereinafter referred to as "Pd / Sn colloidal catalyst") is deposited on The so-called catalytic treatment of depositing on the surface of the non-conductive material is followed by conductive treatment such as electroless plating or metal coating treatment as necessary, an...

Claims

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Application Information

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IPC IPC(8): C25D5/56C23C18/18
CPCC23C18/28C23C18/30
Inventor 衣幡和男横山景
Owner EBARA-UDYLITE CO LTD
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