Base metal copper electrode paste and preparation of obtained capacitor

Abstract

The invention relates to base metal copper electrode slurry and a preparation method of a capacitor from the same. The base metal copper electrode slurry comprises the following components (wt%): 30-65 wt% of spherical copper, 10-30 wt% of sheet copper, 1.52-10 wt% of glass powder, 2-15 wt% of inorganic non-metallic additive, and 10.5-24 wt% of organic carrier, wherein the glass powder is a ZnO-B2O3-SiO2-Bi2O3 glass system; the inorganic non-metallic additive is one or more selected from CuO, Cu2O, ZnO and B2O3; and the organic carrier is polymer resin and a solvent. The base metal copper electrode slurry can be used in a ceramic disc capacitor and a semiconductor disc ceramic capacitor chip, the sintering temperature is 600-800 DEG C, and after sintering, the copper electrode slurry is converted to a copper electrode. The base metal copper electrode slurry has the characteristics of low cost, uniform material, uniform particle size distribution, high dispersibility, good forming process, and environmental friendliness.

Description

technical field [0001] The invention relates to a ceramic disc capacitor, a base metal copper electrode slurry for a semiconductor disc ceramic capacitor and a preparation method for the obtained capacitor. Background technique [0002] Ceramic disc capacitors are widely used in electronic equipment, instruments, and household appliances. They play the roles of coupling, bypass, resonance, timing differentiation, integration, filtering, energy storage, and DC isolation in the circuit. They are indispensable for electronic and electrical products. The missing basic element. Copper terminal electrode paste is suitable for electrode materials of ceramic capacitors, but when it is used in ceramic disc capacitors and semiconductor disc ceramic capacitors, the appearance and performance of capacitor products with copper electrodes will be uneven after stacking and firing. At present, companies such as TDK in Japan and Dazhou in Korea are actively developing base metal copper elec...

AI Technical Summary

Problems solved by technology

However, both TDK in Japan and Dazhou in South Korea failed to solve the technical bottleneck of uneven appearance and electrical properties of copper electrodes after stacking and firing, and failed to apply copper electrode paste as base metal electrodes on ceramic wafer capacitors.

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