Unlock instant, AI-driven research and patent intelligence for your innovation.

Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof

A technology of light-emitting diodes and refractive index, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as low refractive index and low light extraction efficiency

Inactive Publication Date: 2009-04-22
洪绢欲
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the shortcomings of low light extraction efficiency caused by the low refractive index of the existing LED packaging materials, the inventors invented a method and structure that can improve the light extraction efficiency of various LED components, and has excellent mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof
  • Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof
  • Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0042] Consider an existing flip-chip LED component, please refer to image 3 , the so-called flip-chip packaging is a packaging method in which the chip is flipped over, with the transparent epitaxial alumina substrate 12 on the bottom facing up, as the light-emitting surface. In this manner, the light is generated by the epitaxial light emitting layer 11 , and enters the air through the substrate 12 and the conventional transparent encapsulation layer (not shown).

[0043] Please refer to image 3 As shown, firstly, a high-power blue light-emitting diode chip 1 is packaged on the packaging base 2 by the flip-chip method, and then a commercially available anatase with an average particle size of 10 nm and an electrostatic repulsion dispersion treatment with a concentration of 5wt% is taken. Phase nano-titanium dioxide transparent dispersion water sol, first slowly volatilize part of its water, make it concentrated to a colloid of about 40vol% titanium dioxide particles, at t...

Embodiment approach 2

[0045] According to the structure of a low-power light-emitting diode component with traditional front-side packaging, the die 1 is bonded on the package base 2 first, please refer to Figure 5 shown. Get an average particle diameter again and be 20nm, and the commercially available 10wt% concentration nano zirconium dioxide transparent dispersion hydrosol that has been through dispersion treatment, prepare a high-purity 75wt% potassium silicate (K 2 SiO 3 ) aqueous solution, according to the volume dosage ratio of zirconium dioxide: potassium silicate of 40:60, stir and mix the nano zirconium dioxide hydrosol and potassium silicate aqueous solution, first evaporate part of the water, make it concentrated until it is operable Viscosity of the colloid, while vacuuming to remove air bubbles, and then the colloid is applied to the periphery of the LED chip 1 by dispensing, so that it completely encapsulates the LED chip 1 and the conductive gold wire 23 . After slow drying, the...

Embodiment approach 3

[0048] According to the structure of a low-power light-emitting diode module with traditional front-side packaging, the die 1 is bonded on the package base 2 first, please refer to Figure 5 shown. Then take a commercially available nano-titanium dioxide powder of rutile crystal phase with an average particle size of 15nm without dispersion treatment, use a commonly used methoxysilane coupling agent as a surface grafting dispersion method, and first complete monodispersion in n-butylene alcohol. According to the volume dose ratio of titanium dioxide: epoxy resin main agent: n-butanol is 30:15:55, the nano-titanium dioxide n-butanol sol is stirred and mixed with the existing light-emitting diode sealing epoxy resin, so that the nano-titanium dioxide particles are dispersed In the epoxy resin n-butanol solution for later use. When using, stir and mix the epoxy resin hardener according to the dosage ratio of epoxy resin: hardener: 1:1. At this time, the volume ratio of titanium...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method which can improve light extraction efficiency of an LED packaging assembly and a structure thereof. In the method, nano-sized particles which are essentially optically transparent and has high refractive index are taken as main bodies; and a nano euphotic layer with the high refractive index is formed and is optically contacted with an LED chip to guide the light emitted by the chip by certain even stacking process, or further by the assistance of filling other substances into gaps among the nano particles. As the refractive index between the nano euphotic layer material and the light emitting chip material is reduced and even equals zero in the LED assembly made of the materials, critical total reflection angle of light on the material surface can be largely improved, i.e. the internal total reflection of the light is reduced, which largely improves the light extraction efficiency of the LED assembly.

Description

technical field [0001] The present invention relates to a light-emitting diode packaging component, in particular to a light-emitting diode component installed with high-refractive-index transparent nanoparticles and a manufacturing method thereof. Background technique [0002] In recent years, the application field of Light Emitting Diode (LED) has been continuously developed. Due to the advantages of small size, vibration resistance, environmental protection and long life, light emitting diodes have been widely used in information, communication and consumer products. The indicator lights and display devices of electronic products have become indispensable and important components in daily life. In particular, the high-brightness (High Power) light-emitting diode products used in general lighting are the research and development targets that various major manufacturers are competing to invest in. When it comes to this lighting product, the main technical obstacles to be o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/00H01L25/075H01L21/50H01L33/58
CPCH01L2224/16245H01L2224/48091H01L2224/48247H01L2224/8592H01L2924/181
Inventor 洪绢欲
Owner 洪绢欲