Heat curing in-situ forming high-conductivity silicon rubber composition and application thereof

A silicone rubber composition and thermal curing technology, applied in the field of chemical materials, can solve the problem of inability to adapt to the high-speed growth requirements of automated conductive elastomers, and achieve the effects of improving production efficiency and product cost-effectiveness, simplifying production processes, and reducing costs.

Inactive Publication Date: 2010-01-13
SHANGHAI RELAND PHOTOVOLTAIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Traditional solid conductive rubber sheets and rubber strip profiles cannot meet the high-speed growth requirements of conductive elastomers in narrow-walled enclosures in automation and mass production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Mix the following components evenly in a dry and clean environment: 70 parts by weight of 50000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 15 parts by weight of dimethylpolysiloxane with structural formula, and 400 parts by weight of average particle size 50 microns of silver-plated copper powder as metal-based conductive filler, 13 parts by weight of vinyl hydrogen-containing polysiloxane, 0.1 parts by weight of catalyst 1,3-divinyl-1,1,3,3-tetramethyldisilazol Oxaneplatinum(0). Add reinforcing fillers as needed: 3 parts by weight The specific surface area is 130m 2 / g of hydrophobic fumed silica to obtain a heat-cured field-molded high-conductivity silicone rubber combination with a tensile strength greater than 1.7MPa, a Shore A hardness of 65, an elongation greater than 100%, and a conductivity of 0.008Ohm.cm The composition is stored in a SEMCO sealing rubber container, and when the composition needs to be used, it is taken out from the container and cu...

Embodiment 2

[0016] Mix the following components evenly in a dry and clean environment: 60 parts by weight of 20000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 10 parts by weight of 3600mPa.S viscosity methyl hydrogen silicone oil mixture, 5 parts by weight of dimethicone Methyl polysiloxane, 300 parts by weight of flake silver powder with an average particle size of 20 microns, 0.1 parts by weight of H2PtCl6 6H2O, 3 parts by weight of hydrophobic fumed white carbon black with a specific surface area of ​​130 m2 / g and 2 to 5 parts by weight Xylene, to obtain a heat-cured field-molded high-conductivity silicone rubber composition with a tensile strength greater than 1.5MPa, a Shore A hardness of 70, an elongation greater than 100%, and a conductivity of 0.005Ohm.cm. The composition is stored in SEMCO In the sealed rubber cartridge container, when the composition needs to be used, it is taken out from the container, and cured at a high temperature of 150 degrees Celsius to form the ...

Embodiment 3

[0018] Mix the following components evenly in a dry and clean environment: 70 parts by weight of 50000mPa.S viscosity vinyl-terminated dimethylpolysiloxane, 15 parts by weight of dimethylpolysiloxane with structural formula, and 400 parts by weight of average particle size 50 microns of silver-plated copper powder as a metal-based conductive filler, 13 parts by weight of vinyl hydrogen-containing polysiloxane and 0.1 parts by weight of catalyst 1,3-divinyl-1,1,3,3-tetramethyldisilazol Oxaneplatinum(0). Add functional fillers as required: 3 parts by weight of polyether modified silicone oil and 1.5 parts by weight of vinyltrimethoxysilane coupling agent to obtain a thermal conductivity of 0.008Ohm.cm and an aluminum substrate adhesion greater than 12N / cm Curing on-site molding of high-conductivity silicone rubber composition, the composition is stored in SEMCO’s sealing rubber cartridge container, when the composition needs to be used, it is taken out of the container, and cure...

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Abstract

The invention relates to a heat curing in-situ forming high-conductivity silicon rubber composition and application thereof. The composition is composed of the following components: (1) 60-90 parts by weight of mixture of ethylene end-blocked polyorganosiloxane in the same or different viscosities; (2) 10-35 parts by weight of silicone oil containing hydrogen; (3) 1-25 parts by weight of one or multiple R<6>cSiX4-c or partial hydrolytic condensation product thereof; (4) 100-500 parts by weight of metal base conductive filler with the average particle size of 10-150 Mum; (5) 0.01-10 parts by weight of organic metal compound or chelate which contains chloroplatinic acid or contains platinum or palladium and is used as metal base catalyst of heat curing; (6) 1-30 parts by weight of reinforcing filler or functional filler. The invention is applied to the shielding case part of RF equipment requiring electromagnetic shielding and sealed environment. The invention reduces material consumption, simplifies production technology and improves production efficiency and cost performance of product.

Description

technical field [0001] The invention relates to the technical field of chemical materials, and in particular discloses a thermosetting on-site molding high-conductivity silicone rubber composition. Background technique [0002] A new generation of mobile communication base stations with operating frequencies ranging from 110MHz to 40GHz has become a mainstream product in the field of base stations along with the rapid deployment and commercialization of 3G around the world. [0003] In order to support high-speed data services, high capacity will become one of the main features of the new generation of base stations. At the same time, base stations must improve processing capabilities; due to dense distribution, base stations will tend to be more miniaturized and integrated. Open interfaces and modular structures have become the latest trends in the development of base stations. [0004] The high-integration performance characteristics of the new generation base station mee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K13/02C08K5/541C08K3/24C08K5/56C08K3/36C08K3/08
Inventor 贾付云柴莹
Owner SHANGHAI RELAND PHOTOVOLTAIC MATERIAL
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