Unlock instant, AI-driven research and patent intelligence for your innovation.

Electroless gold plating solution

An electroless gold and metal technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of reduced deposition speed of gold-plated film and reduced dissolution speed of nickel film

Inactive Publication Date: 2012-11-07
ROHM & HAAS ELECTRONICS MATERIALS LLC
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although these electroless gold plating solutions can reduce the corrosion of the nickel film as the base metal layer to a certain extent, there is still the problem that the deposition rate of the gold plating film is reduced because the dissolution rate of the nickel film is reduced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electroless gold plating solution
  • Electroless gold plating solution
  • Electroless gold plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-22

[0058] For the test piece, a known electroless nickel plating solution (Ronamax (trademark) SMT-115, a product of Rohm and Haas Electronic Materials Co. Ltd. was used in the electroless nickel plating solution) was used at A 5 cm x 10 cm patterned copper-clad foil was deposited with an electroless nickel coating approximately 5 microns thick.

[0059] An electroless gold plating solution in aqueous solution was prepared by adding the following components to water: 1.5 g / L potassium dicyanatoate, 50 mg / L potassium cyanide, 150 g / L ethylenediaminetetramethylene Phosphonic acid, 10 g / L potassium formate, 94.3 g / L potassium hydroxide and 0.5 g / L sodium 1-benzyl-pyridinium-3-carboxylate chloride in 48% aqueous solution. The pH of the electroless gold plating solution was adjusted to 5.3 by additional addition of potassium hydroxide.

[0060] The above-mentioned test piece was immersed in the electroless gold plating solution for 10 minutes at a liquid temperature of 90° C. to form...

Embodiment 23

[0070] Solder bond strength test

[0071] The test piece on which the electroless gold plating film was formed was reflowed three times at a preheating temperature of 170° C. and a reflowing temperature of 240° C., and then rolled under the conditions shown in Table 4 below. Bowl mount to measure solder bond strength. Ten test pieces were used for testing under various conditions, and the average value was calculated as the bonding strength. The results are listed in Table 5.

[0072] Table 4

[0073] pad diameter

0.50 mm

solder ball

0.76 mm diameter lead-free solder (96.5% tin, 3% silver, 0.5% copper)

warm up

170℃

Remelt

240℃ / 30s

the peak

270℃

flux

Sparkle Flux ES-1061 (Senju Metal Industry Co., Ltd.)

[0074] table 5

[0075]

[0076] Plating Bath Stability Test

[0077] Pour 100 ml of electroless gold plating solution into a threaded tube without a cap, heat the liquid temperature to 90°C...

Embodiment 24

[0079] An aqueous solution with a pH of 6.5 was prepared as an electroless gold plating solution by adding the following components: 1.5 g / L potassium dicyanate, 50 mg / L potassium cyanide, 150 g / L ethylenediaminetetramethylenephosphine acid, 3.5 g / L hydrazine, 20 g / L 1-benzyl-pyridinium-3-carboxylate sodium chloride in 48% aqueous solution, and 94.3 g / L potassium hydroxide.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an electroless gold plating solution, which comprises (i) a water-soluble gold cyanide compound; (ii) a complexing agent; (iii) at least one compound selected from pyridinium carboxylate compounds having phenyl or aralkyl. The electroless gold plating solution can form a gold-plated film with very strong adhesiveness and does not corrode substrate metal films such as nickel, copper, cobalt or palladium films and other films.

Description

technical field [0001] The present invention relates to an electroless gold plating solution. The present invention further relates to electroless gold plating solutions that can be used to deposit gold on metal surfaces such as nickel or copper. Background technique [0002] Conventionally, gold plating is used as the final surface treatment of electronic industry components, such as printed circuit boards, ceramic IC components, ITO boards and IC cards, etc., because of the conductivity, solderability, Physical characteristics such as connectivity by thermal crimp and oxidation resistance. For most of these electronics industry components, electroless plating is preferred over electroplating because of the need to plate electrically independent components with complex shapes. [0003] Printed circuit boards typically have electroless nickel plating on the surface of the base metal (eg copper wiring) and often also electroless gold plating on the nickel surface. For such...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44
Inventor 蓬田浩一
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC