Thermosetting resin composition and prepreg and laminate for printed circuits thereby

A technology of resin composition and prepreg, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc. It can solve the problems of plate layer explosion, limited improvement, and degradation of moisture and heat resistance, and achieve good thermal stability. And heat and humidity resistance, low dielectric loss factor, and the effect of optimizing dielectric properties

Inactive Publication Date: 2010-02-10
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the copper-clad laminate composition uses cyanate resin and styrene maleic anhydride and its derivatives to improve the glass transition temperature of the epoxy resin system and has excellent high-frequency dielectric properties, but the system used There are acid anhydride groups in the molecular structure of the styrene-maleic anhydride copolymer, which can generate carboxyl groups with poor thermal stability and heat and humidity resistance; Used together, it will further deteriorate the heat and humidity resistance
Although the resistance to heat and humidity has been improved to a certain extent by adding epoxy resin, the improvement is limited and cannot be fundamentally eliminated. In this way, during the PCB manufacturing process, the board is easily corroded by moisture and delaminated and exploded, and the product is qualified. very low rate
[0009] In addition, in the above technical solutions, styrene maleic anhydride and its derivatives are used as the curing agent to improve the epoxy resin composition, so that the epoxy resin as the main component in the system has more options for the curing agent The reduction in size also limits the modification in improving the dielectric properties and heat and humidity resistance

Method used

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  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby
  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby
  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby

Examples

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specific Embodiment approach

[0084] The following examples illustrate various embodiments of the invention. However, these examples do not limit the invention in any way. The specific implementation method is as follows.

Synthetic example 1

[0086] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and dioxane, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:5. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 4300. Above-mentioned mixture is heated under nitrogen protection, and heating temperature is at 80 degree, and constantly stirs, and dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 3 hours. During the reaction process, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropic, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and dioxane were distilled off under reduced pressure, methyl isobutyl keton...

Synthetic example 2

[0088] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and toluene, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:10. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 30000. Above-mentioned mixture is heated under the protection of nitrogen, heating temperature is at 100 degree, and constantly stirs, dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 2 hours. During the reaction, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropy, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and toluene were distilled off under reduced pressure, methyl isobutyl ketone was a...

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Abstract

The invention relates to a thermosetting resin composition and a prepreg and a laminate for printed circuits thereby. The thermosetting resin composition comprises at least an epoxy resin of the structural formula (I) and a cyanate resin. The thermosetting resin composition of the invention has high heat resistance, low dielectric constant and low dielectric dissipation factors, thus being used for manufacturing the resin sheets, resin composition copper foils, the prepregs, the laminate and the printed circuit boards. R is (a), and n and m are natural numbers.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermosetting resin composition and a prepreg and a laminated board for printed circuits made of the thermosetting resin composition. Background technique [0002] Among conventional printed circuit board materials, epoxy resins excellent in adhesive properties are widely used. Epoxy resin generally refers to molecules containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton, and can be cured by appropriate chemical reagents (curing) through epoxy groups. A general term for compounds that react to form a three-dimensional network cured product in the presence of an agent). It is one of the most important varieties of thermosetting polymer materials. Epoxy resins are widely used in adhesives, coatings, laminates, molding materials, casting materials, printed circuit boards due to their good chemical stability, electrical insulat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L79/04B32B15/092B32B15/20H05K1/03
Inventor 苏民社陈勇杨中强
Owner GUANGDONG SHENGYI SCI TECH
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