Method for manufacturing halogen-free FR-4 copper-clad laminate
A manufacturing method, technology of copper foil layer, applied in the direction of adhesive heating bonding method, lamination, lamination device, etc., can solve the problems of ozone layer destruction, human and environmental hazards, etc., and achieve improved processing performance, good resistance The effect of flammability
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[0053] Example 1
[0054] 1. Mixing formula:
[0055] Phosphorus-containing epoxy resin (P: 2.0%) 133
[0056] Dicyandiamide 3.0
[0057] Dimethylformamide 30
[0058] Dimethylimidazole 0.070
[0059] Aluminum hydroxide 35
[0060] Silica 5
[0061] 2. Control parameters of prepreg
[0062] Gluing machine oven temperature: 180℃
[0063] Gluing speed: 10m / min
[0064] Resin content: 43%
[0065] Gel time: 95s
[0066] Liquidity: 22%
[0067] Volatile matter: 0.30%;
[0068] 3. Arrangement
[0069] 4 sheets of 7628 prepreg (0.8mm board material amount), and the copper foil is H OZ.
[0070] 4. Hot pressing
[0071] Hot pressing temperature: 190℃
[0072] Pressure: 30kg / cm 2
[0073] Hot pressing time: 60min
[0074] 5. Basic performance parameters (table 1)
[0075] Table 1
[0076]
Example Embodiment
[0077] Example 2
[0078] 1. Mixing formula:
[0079] Phosphorus-containing epoxy resin (P: 4%) 143
[0080] Dicyandiamide 3.6
[0081] Dimethylformamide 36
[0082] Dimethylimidazole 0.060
[0083] Aluminum hydroxide 15
[0084] Silica 10
[0085] 2. Control parameters of prepreg
[0086] Gluing machine oven temperature: 200℃
[0087] Gluing speed: 17m / min
[0088] Resin content: 46%
[0089] Gel time: 90s
[0090] Liquidity: 22%
[0091] Volatile matter: 0.35%;
[0092] 3. Arrangement
[0093] 8 7628 prepregs (1.6mm board material amount), copper foil is 1OZ.
[0094] 4. Hot pressing
[0095] Hot pressing temperature: 200℃
[0096] Pressure: 30kg / cm 2
[0097] Hot pressing curing time: 60min
[0098] 5. Basic performance parameters (table 2)
[0099] Table 2
[0100]
[0101]
Example Embodiment
[0102] Example 3
[0103] 1. Mixing formula:
[0104] Phosphorus-containing epoxy resin (P: 3%) 133
[0105] Dicyandiamide 3.2
[0106] Dimethylformamide 34
[0107] Dimethylimidazole 0.065
[0108] Aluminum hydroxide 25
[0109] Silica 15
[0110] 2. Control parameters of prepreg
[0111] Gluing machine oven temperature: 210℃
[0112] Gluing speed: 18m / min
[0113] Resin content: 43%
[0114] Gel time: 100s
[0115] Liquidity: 22%
[0116] Volatile matter: 0.30%;
[0117] 3. Arrangement
[0118] 6 7628 prepregs (1.2mm board material amount), copper foil is 2OZ.
[0119] 4. Hot pressing
[0120] Hot pressing temperature: 210℃
[0121] Pressure: 30kg / cm 2
[0122] Hot pressing time: 60min
[0123] 5. Basic performance parameters (table 3)
[0124] table 3
[0125]
[0126] Studies have shown that in the field of flame retardants, nitrogen, phosphorus, and aluminum flame retardants are environmentally friendly flame retardants. For epoxy resin systems, the present invention preferentially selects phosphoru...
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