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Method for manufacturing halogen-free FR-4 copper-clad laminate

A manufacturing method, technology of copper foil layer, applied in the direction of adhesive heating bonding method, lamination, lamination device, etc., can solve the problems of ozone layer destruction, human and environmental hazards, etc., and achieve improved processing performance, good resistance The effect of flammability

Active Publication Date: 2010-02-24
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When brominated substances burn below 1000°C, a carcinogen, dioxin, will be produced. At the same time, dioxin will seriously damage the ozone layer in the atmosphere; it can be seen that the FR-4 board of brominated epoxy will indirectly harm humans and humans. environmental hazard

Method used

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  • Method for manufacturing halogen-free FR-4 copper-clad laminate
  • Method for manufacturing halogen-free FR-4 copper-clad laminate
  • Method for manufacturing halogen-free FR-4 copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 1. Mixing formula:

[0055] Phosphorus-containing epoxy resin (P: 2.0%) 133

[0056] Dicyandiamide 3.0

[0057] Dimethylformamide 30

[0058] Dimethylimidazole 0.070

[0059] Aluminum hydroxide 35

[0060] Silica 5

[0061] 2. Prepreg control parameters

[0062] Gluing machine oven temperature: 180°C

[0063] Gluing speed: 10m / min

[0064] Resin content: 43%

[0065] Gel time: 95s

[0066] Liquidity: 22%

[0067] Volatile matter: 0.30%;

[0068] 3. Arranging boards

[0069] 4 pieces of 7628 prepreg (0.8mm board material), the copper foil is H OZ.

[0070] 4. Thermoforming

[0071] Hot pressing temperature: 190°C

[0072] Pressure: 30kg / cm 2

[0073] Hot pressing time: 60min

[0074] 5. Basic performance parameters (Table 1)

[0075] Table 1

[0076]

Embodiment 2

[0078] 1. Mixing formula:

[0079] Phosphorus-containing epoxy resin (P: 4%) 143

[0080] Dicyandiamide 3.6

[0081] Dimethylformamide 36

[0082] Dimethylimidazole 0.060

[0083] Aluminum hydroxide 15

[0084] Silica 10

[0085] 2. Prepreg control parameters

[0086] Gluing machine oven temperature: 200°C

[0087] Gluing speed: 17m / min

[0088] Resin content: 46%

[0089] Gel time: 90s

[0090]Liquidity: 22%

[0091] Volatile matter: 0.35%;

[0092] 3. Arranging boards

[0093] 8 pieces of 7628 prepreg (1.6mm board material), copper foil is 1OZ.

[0094] 4. Thermoforming

[0095] Hot pressing temperature: 200°C

[0096] Pressure: 30kg / cm 2

[0097] Hot pressing curing time: 60min

[0098] 5. Basic performance parameters (Table 2)

[0099] Table 2

[0100]

[0101]

Embodiment 3

[0103] 1. Mixing formula:

[0104] Phosphorus-containing epoxy resin (P: 3%) 133

[0105] Dicyandiamide 3.2

[0106] Dimethylformamide 34

[0107] Dimethylimidazole 0.065

[0108] Aluminum hydroxide 25

[0109] Silica 15

[0110] 2. Prepreg control parameters

[0111] Gluing machine oven temperature: 210°C

[0112] Gluing speed: 18m / min

[0113] Resin content: 43%

[0114] Gel time: 100s

[0115] Liquidity: 22%

[0116] Volatile matter: 0.30%;

[0117] 3. Arranging boards

[0118] 6 pieces of 7628 prepreg (1.2mm board material), copper foil is 2OZ.

[0119] 4. Thermoforming

[0120] Hot pressing temperature: 210°C

[0121] Pressure: 30kg / cm 2

[0122] Hot pressing time: 60min

[0123] 5. Basic performance parameters (Table 3)

[0124] table 3

[0125]

[0126] Studies have shown that in the field of flame retardants, nitrogen, phosphorus, and aluminum-based flame retardants are environmentally friendly flame retardants. For epoxy resin systems, the presen...

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Abstract

The invention relates to a method for manufacturing a halogen-free FR-4 copper-clad laminate. The method is realized by the following steps: glue mixing, sizing, plate arrangement, hot-press molding,disassembly, processing and inspecting, wherein an adhesive system in the step of the glue mixing is prepared from the following materials in mass ratio (kg): 125 to 143 kg of phosphorus-containing epoxy resin, 2.6 to 3.8 kg of dicyandiamide, 30 to 38 kg of dimethyl formamide, 0.060 to 0.080 kg of dimethyl imidazole, 10 to 40 kg of aluminium hydroxide, and 5 to 20 kg of silicon dioxide, wherein the phosphorus-containing epoxy resin is epoxy resin containing 2.0 to 4.0 mass percent of phosphorus. The method has the advantages of improving the manufacture performance of sheet materials on one hand, ensuring that the phosphorus and aluminum achieve synergistic flame retardant effect to endow the sheet materials with excellent flame retardant performance on the other hand, and meeting the standard requirement of IPC-4101B / 92 item (base material specification for rigid and multi-layer printed boards / 92 item) of RoHS environment-friendly directives (restriction of the use of certain hazardous substances in electric and electronic devices).

Description

technical field [0001] The invention relates to a method for manufacturing a copper-clad laminate, in particular to an adhesive used in the method. Background technique [0002] The improvement of global awareness of environmental protection marks a step forward for human civilization. The development of industry marks the progress of society, however, it brings immeasurable damage to the earth environment on which human beings live. Electronic and electrical products are no exception. [0003] As electronic and electrical products become more and more popular in human life, they become more and more common in the living space of human beings, and human beings become more and more dependent on them. is slowly approaching. [0004] PCB boards, the heart of electronic and electrical products, often contain or add a certain amount of flame retardant substances. The more commonly used flame retardant materials include halogen-containing compounds, antimony compounds, phospho...

Claims

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Application Information

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IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B37/14B32B38/16C09J163/00C09J5/06H05K1/02
Inventor 韩涛
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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