Method for preparing icing-resistant copper surface with super hydrophobicity and low adhesiveness

A technology of copper surface and adhesion, applied in the field of anti-coated matte surface preparation, can solve the problems of poor rolling performance of water droplets, difficulty in large-scale production, unbalanced ratio, etc., and achieve excellent superhydrophobicity, low adhesion, and contact area The effect of reducing and increasing energy

Inactive Publication Date: 2010-04-28
SOUTHEAST UNIV
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  • Abstract
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  • Claims
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Problems solved by technology

Although the simple etching method or oxidation method builds a certain roughness on the copper surface, due to the unbalanced proportion of the surface micro-scale structure and nano-scale structure, some even have no micron or nano-structure, so there are two kinds of roughness in micron and nanometer. The structure cannot be effectively coordinated, so that the copper surface is only super-hydrophobic, but the rolling performance of water drop

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  • Method for preparing icing-resistant copper surface with super hydrophobicity and low adhesiveness
  • Method for preparing icing-resistant copper surface with super hydrophobicity and low adhesiveness
  • Method for preparing icing-resistant copper surface with super hydrophobicity and low adhesiveness

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preparation example Construction

[0016] A preparation method of a super-hydrophobic low-adhesion anti-icing copper surface, the preparation method comprising the following steps:

[0017] (1) Sandblasting the copper surface with micron brown corundum sand pellets to form a micron rough structure on the copper surface; the number of sand pellets is 36-150, the air pressure is 0.2-0.8MPa, and the spraying time is 1 -5min; In this embodiment, the number of sand pellets is 36 mesh, 150 mesh or 60 mesh, the air pressure is 0.2MPa, 0.8MPa or 0.45MPa, and the injection time is 1min, 5min or 4min;

[0018] (2) Ultrasonic cleaning and drying of the copper surface after sandblasting, and then adopting the surface oxidation method to obtain a micro / nano composite structure on the copper surface; the surface oxidation method is: immersing the sandblasted copper into a water bath and heating it to 50 In the mixed aqueous solution at -90℃, take out and rinse with water after 20-60min in the water bath, and then dry in a constan...

example 1

[0021] 1. Use pneumatic sand blasting equipment to spray 80 mesh brown corundum sand shots on the copper surface for 3 minutes at a blast pressure of 0.8 MPa to build a micron-level structure on the surface ( figure 1 ). Then put the blasted copper sheet into clean water for ultrasonic cleaning for 3 minutes.

[0022] 2. The concentration of potassium persulfate in the aqueous solution for surface oxidation is 0.065 mol / L, and the concentration of potassium hydroxide is 2.5 mol / L. The sand-blasted and cleaned copper sheet is immersed in the above-prepared aqueous solution to construct a nano-scale structure on the basis of the micro-scale structure constructed by the sandblasting treatment. The temperature of the water bath is controlled at 60°C, the sample is placed for 30 minutes and then taken out, then placed in clean water for ultrasonic cleaning for 3 minutes, and dried in a constant temperature oven at 180°C for 2 hours.

[0023] 3. The solvent of the fluorosilane solution ...

example 2

[0031] 1. Use pneumatic sandblasting equipment to spray 36-mesh brown corundum sand pellets on the copper surface for 5 minutes at a sandblasting pressure of 0.6MPa to build a micron-level structure on the surface. Then put the blasted copper sheet into clean water for ultrasonic cleaning for 3 minutes.

[0032] 2. The concentration of potassium persulfate in the aqueous solution for surface oxidation is 0.05 mol / L, and the concentration of potassium hydroxide is 3 mol / L. The sand-blasted and cleaned copper sheet is immersed in the above-mentioned prepared aqueous solution to construct a nano-scale structure on the basis of the micro-scale structure constructed by the sand-blasting treatment. The temperature of the water bath is controlled at 80°C, the sample is placed for 45 minutes and then taken out, then put in clean water for ultrasonic cleaning for 3 minutes, and dried in a constant temperature oven at 200°C for 1 hour.

[0033] 3. The solvent of the fluorosilane solution fo...

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Abstract

The invention discloses a method for preparing an icing-resistant copper surface with super hydrophobicity and low adhesiveness, comprising the steps: jetting sand to the copper surface with micron-sized sand pill to construct a micron-sized coarse structure, wherein mesh number of the sand pill is 36-150 meshes, pressure of air flow is 0.2-0.8MPa, and jetting time is 1-5 min; immersing the cleaned and dried sand-jetted copper surface into mixed water solution under 50-90 DEG C, taking off and cleaning with clean water after water bathing for 20-60 min, and drying in a thermostatic oven for 0.5-2 hours under 150-200 DEG C to obtain a micro/nano composite structure at the copper surface, wherein mixed water solution comprises potassium persulfate and potassium hydroxide, the molar concentration of the potassium persulfate is 0.04-0.3 mol/L, and the molar concentration of the potassium hydroxide is 1-4 mol/L; and evaporating and plating the copper plate with micro/nano structure in alcohol solution of fluorosilane to modify the fluorosilane, wherein the evaporating and plating temperature is 200-35 DGE C, time is 1-2 hours, and the weight percent of the weight of the fluorosilane to that of the alcohol solution in the alcohol solution of fluorosilane is 1-4%.

Description

Technical field [0001] The invention relates to a method for preparing an anti-icing copper surface with super-hydrophobicity and low adhesion characteristics. Background technique [0002] Copper and its alloys are the earliest and most widely used non-ferrous metals. They have good electrical and thermal conductivity. The output is second only to steel and aluminum and ranks third. It is widely used in electrical, light industry, machinery manufacturing, and construction. Industry, defense industry and other fields. However, the surface energy of copper is high, and water molecules are easy to adsorb and aggregate, which makes it easy to freeze. Icing is widely found in copper parts used in refrigeration, low-temperature operation and outdoor use. For example, icing on products such as condensers, coolers, heat exchangers, outdoor electrical copper, etc. seriously affects the heat conduction of copper products And electrical conductivity, it also brings greater harm to the st...

Claims

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Application Information

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IPC IPC(8): C23C28/00C23C8/42C23C14/24C23C14/06
Inventor 余新泉张友法陈锋李康宁周荃卉
Owner SOUTHEAST UNIV
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