Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof

A technology of fluorine-containing imine matrix and advanced composite materials, which is applied in the field of fluorine-containing imide matrix resin and its preparation for advanced composite materials, and can solve the problems that have not yet been published in literature or patent reports.

Inactive Publication Date: 2010-05-12
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The fluorine-containing imide matrix resin for advanced composite materials disclosed in the pr

Method used

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  • Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof
  • Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof
  • Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0048] Example 1

[0049] 54.6 g (0.1 mole) of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy) phenyl] propane fluorine-containing diamine monomer, 292.0 g (1.0 mole) of 1, The non-fluorine-containing diamine monomer of 3-bis(4-aminophenoxy)benzene and the strong polar aprotic organic solvent of 6042 milliliters of N, N-dimethylacetamide are put into reaction kettle, under room temperature, stir After dissolving completely, add 257.6 grams (0.8 moles) of 3,3',4,4'-tetracarboxybenzophenone dianhydride solid powder of aromatic dianhydride, and stir and react at room temperature for 1 hour to obtain a homogeneous transparent Fluorine-containing polyamic acid oligomer resin solution.

[0050] Add 8.0 moles of acetic anhydride dehydrating agent and 0.8 moles of triethylamine catalyst to the resin solution of the above-mentioned fluorine-containing polyamic acid oligomers, stir and react at room temperature for 1 hour, heat up to 80°C-100°C, and react with high-speed stirring After 3...

Example Embodiment

[0057] Example 2

[0058] 71.4 grams (0.1 moles) of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane and 42.8 grams (0.1 moles) of 1,3-bis(4 -Amino-2-trifluoromethylphenoxy) fluorine-containing diamine monomer of benzene, 4.1 grams (0.01 moles) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 2.0 Gram (0.01 mole) 3, the non-fluorinated diamine monomer of 4 '-diaminodiphenyl ether and the strong polar aprotic organic solvent of 1120 milliliters of N-methyl-2-pyrrolidone are put into reaction kettle, at room temperature After stirring and dissolving completely, add 62.0 grams (0.2 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride and 41.6 grams (0.08 moles) of 2,2-bis[4-(3,4- The aromatic dianhydride solid powder of dicarboxyphenoxy)phenyl]propane dianhydride is stirred and reacted at room temperature for 1 hour to obtain a homogeneous and transparent fluorine-containing polyamic acid oligomer resin solution.

[0059] Add 0.9 moles of acetic anhydri...

Example Embodiment

[0066] Example 3

[0067]71.4 grams (0.1 moles) of 2,2-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]hexafluoropropane and 51.8 grams (0.1 moles) of 2,2-bis[4 -(4-aminophenoxy)phenyl]hexafluoropropane fluorinated diamine monomer, 41.0 grams (0.1 moles) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 29.2 grams (0.1 moles) of 1,4-bis(3-aminophenoxy)benzene non-fluorinated diamine monomer and 1240 milliliters of N,N-dimethylformamide 2000 milliliters of N-methyl-2-pyrrolidone The strong polar aprotic organic solvent is put into the reactor, at room temperature, after stirring and dissolving completely, add 29.4 grams (0.1 mole) 3,3 ', 4,4'-tetracarboxy biphenyl dianhydride and 182.2 grams (0.35 mol) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride aromatic dianhydride solid powder, after stirring and reacting at room temperature for 1 hour, a homogeneous transparent fluorine-containing Polyamic acid oligomer resin solution.

[0068] Add 2.7 moles of acetic anhydrid...

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Abstract

The invention relates to a fluorine-containing imine matrix resin used for advanced composite material, which comprises the following components: 1wt%-15wt% of fluorine-containing polyimide low polymer powder, 5wt%-20wt% of fluorine-containing active polyimide powder, 60wt%-70wt% of multifunctional epoxy resin and 5wt%-20wt% of curing agent; the preparation method comprises the steps of feeding fluorine-containing diamine monomer, fluorine-free diamine monomer and strong-polar aprotic organic solvent, adding aromatic dianhydride solid powder, stirring and reacting at room temperature, adding a dehydrating agent and a catalyst, heating and reacting for 3 hours, adding a precipitant to precipitate out solid powder, cooling to room temperature, filtering, washing and drying, thus obtaining the fluorine-containing polyimide low polymer powder; preparing the fluorine-containing active polyimide powder in a same way; leading the two materials and the multifunctional epoxy resin to conduct bulk polymerization reaction, and then adding the curing agent after dissolution. The method has simple process, low cost and environmental protection effect, can finish the preparation process in standard equipment, and is applicable to industrial production.

Description

technical field [0001] The invention belongs to the field of polymer resin materials and preparation thereof, in particular to a fluorine-containing imide matrix resin for advanced composite materials and a preparation method thereof. Background technique [0002] The application of composite materials is considered to be an important solution to reduce the weight of aircraft, rockets, missiles and other aircraft, so it is widely used in the field of aerospace. With the increase of flight speed, higher requirements are placed on the comprehensive performance of composite materials, especially high temperature resistance. [0003] Fiber-reinforced resin-based composites have the advantages of high specific strength, low hygroscopicity, good dimensional stability, excellent dielectric properties, high microwave transmittance, and strong product structure design. The high temperature resistance of composite materials mainly depends on the matrix resin, therefore, the developme...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/08C08G59/62C08G73/10
Inventor 虞鑫海徐永芬赵炯心
Owner DONGHUA UNIV
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