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Soybean oil-based dimeric acid type polyamide hot melt adhesive and preparation method thereof

A technology of polyamide hot-melt adhesive and base dimer acid type, which is applied in the direction of adhesives, etc., can solve the problems of high crystallinity, unfavorable processing and molding, difficulty of semi-aromatic polyamide, poor low temperature resistance, etc., and achieve environmental protection , Good dimensional stability, and the effect of reducing raw material costs

Active Publication Date: 2010-05-12
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyamide hot-melt adhesive prepared by the above-mentioned patents has poor low temperature resistance, and the melting point is too high, so it is not suitable for use in industries such as clothing. High crystallinity is not conducive to processing and forming, so its application range is greatly limited

Method used

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  • Soybean oil-based dimeric acid type polyamide hot melt adhesive and preparation method thereof
  • Soybean oil-based dimeric acid type polyamide hot melt adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment example 1

[0044] 112g soy-based dimer acid (97%), 87.6g adipic acid, 65.8g azelaic acid, 11.9g acetic acid, 103.2g decanediamine, 69.3g 4,4'-diaminodiphenylmethane, 45.2g caprolactam , 29.7g water, 0.25g triphenyl phosphite, join in the polycondensation reactor, pass into the air in the nitrogen replacement still. The temperature is raised to 180°C, the pressure is raised to 1.0MPa, and the reaction is kept for 2.0 hours; the pressure continues to rise to 1.7MPa, the temperature is raised to 200°C, and the reaction is made for 1 hour; the pressure is reduced to normal pressure, the temperature is raised to 260°C, and the reaction is continued for 30 minutes ; The temperature was lowered to normal temperature, vacuumized for 10 minutes, and the dimer acid type polyamide hot melt adhesive was obtained from the discharge. The measured melting point was 117.5° C. and the relative viscosity was 1.8 dL / g.

Embodiment example 2

[0046] 112g soybean oil-based dimer acid (97%), 24g 2-methyl adipic acid, 54g undecanedioic acid, 7.8g propionic acid, 39.5g2,4,4-trimethylhexamethylenediamine, 31.8g 2 , 2'-dimethylbenzidinediamine, 56.4g 8-capryllactam, 17.9g water, and 0.4g hypophosphoric acid were added to the polycondensation reactor, and the air in the reactor was replaced by nitrogen gas. The temperature is raised to 190°C, the pressure is raised to 1.2MPa, and the reaction is kept for 2.5 hours; the pressure continues to rise to 1.7MPa, the temperature is raised to 210°C, and the reaction is 1.2 hours; the pressure is reduced to normal pressure, the temperature is raised to 260°C, and the reaction is continued for 40 Minutes; the temperature was lowered to normal temperature, vacuumized for 12 minutes, and the dimer acid type polyamide hot melt adhesive was obtained from the discharge, the measured melting point was 98°C, and the relative viscosity was 1.3dL / g.

Embodiment example 3

[0048] 112g soy-based dimer acid (97%), 54.4g pimelic acid, 75.6g undecanedioic acid, 10.4g lauric acid, 41g hexamethylenediamine, 72.1g 2,2'-dimethyl-4,4 '-Diaminodiphenylmethane, 45.2g of caprolactam, 31.2g of water, and 0.5g of phosphoric acid were added to the polycondensation reactor, and nitrogen was introduced to replace the air in the reactor. The temperature is raised to 200°C, the pressure is raised to 1.3MPa, and the reaction is kept for 3 hours; the pressure is continued to rise to 1.7MPa, the temperature is raised to 220°C, and the reaction is continued for 1.3 hours; the temperature is lowered to normal pressure, and the temperature is raised to 260°C, and the reaction is continued for 50 Minutes; the temperature was lowered to normal temperature, vacuumized for 15 minutes, and the dimer acid type polyamide hot melt adhesive was obtained from the discharge. The measured melting point was 113°C and the relative viscosity was 1.6dL / g.

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Abstract

The invention relates to a soybean oil-based dimeric acid type polyamide hot melt adhesive and a preparation method thereof. Soybean oil-based dimeric acid, C6-C11 aliphatic dicarboxylic acid, C6-C11 aliphatic diamine, C13-C14 aromatic diamine, C6-C8 lactam, a molecular weight regulator, water and a catalyst are added into a reaction kettle for melt polycondensation action to generate the polyamide hot melt adhesive, and the prepared hot melt adhesive has the excellent physical and chemical performance of low melting point, solvent resistance, good viscosity and the like and can be used in the fields of clothes, electron, shoe industry and the like.

Description

1. Technical field [0001] The invention relates to a polyamide hot-melt adhesive and a preparation method thereof, in particular to a low-melting soybean oil-based dimer acid type polyamide and a preparation method thereof. 2. Technical background [0002] Polyamide hot-melt adhesive is a kind of hot-melt adhesive prepared by melting polycondensation of aliphatic dibasic acid and diamine. It has excellent chemical properties such as heat resistance, salt water resistance, and oil resistance, as well as good tensile properties. Excellent mechanical properties, widely used in automotive, electronics, clothing and other industries. A number of patents have been published at home and abroad to further improve its excellent performance. [0003] U.S. Patent No. 6,355,769 discloses a polydecanediamine hot melt adhesive synthesized with decanediamine, terephthalic acid, triphenyl phosphite, N-methylpyrrolidone, and pyridine. Its melting point is 310.6°C. Viscosity of 0.14dL / g, lo...

Claims

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Application Information

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IPC IPC(8): C09J177/00C08G69/36C08G69/04
Inventor 曾作祥李哲龙朱万育孙雨韩涛
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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