Nano-silver powder, manufacturing method and application thereof

A technology of nano silver powder and manufacturing method, applied in cable/conductor manufacturing, metal/alloy conductors, electrical components and other directions, can solve the problems of small electrode coverage, silver electrode erosion, etc., and achieve improved solder resistance, large specific surface area, The effect of improving electrode coverage

Active Publication Date: 2010-05-12
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electrode coverage is small, and the silver electrode is easily eroded by the S

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0048] Embodiment 1, a kind of nano silver powder (1kg), its production technique is as follows:

[0049] 1 Preparation of silver carbonate

[0050] Weigh 1575 grams of analytically pure silver nitrate (silver content of 1kg), modulate it into a silver nitrate solution with a molar concentration of 1.25mol / L with ion-exchanged water in a container, add dropwise anhydrous sodium carbonate solution, and adjust the pH value to 9~ 10. To obtain silver carbonate, use the siphon method to wash the silver carbonate to neutrality with ion-exchanged water.

[0051] 2 Preparation of reducing agent mixture

[0052] Measure 0.15L of hydrazine hydrate according to 0.1~1.2L / 1kg silver, and measure 0.12L of 5wt% polyvinyl alcohol aqueous solution (containing 6.5g of polyvinyl alcohol) according to 5~15g / 1kg silver, mix hydrazine hydrate and 5wt% polyvinyl alcohol The solution is stirred and mixed uniformly to obtain a mixed solution of reducing agent.

[0053] 3. Preparation of nano-silver ...

Example Embodiment

[0062] Embodiment two, a kind of nanometer silver powder (1kg), its production technique is as follows:

[0063] 1 Silver oxide preparation

[0064] Weigh 1575 grams of analytically pure silver nitrate (silver content of 1kg), prepare a silver nitrate solution with a molar concentration of 2.2 mol / L with ion-exchanged water in the container, add sodium hydroxide alkali solution dropwise, and adjust the pH value to 9~ 10. The silver oxide is prepared, and the silver oxide is washed with ion-exchanged water by the siphon method to neutrality.

[0065] 2 Preparation of reducing agent mixture

[0066] Measure 1.0L of glycerol according to 0.1~1.2L / 1kg silver, weigh 15g of rosin according to 5~20g / 1kg silver (dissolve in ethanol), stir and mix the glycerol and rosin solution evenly to obtain a mixed solution of reducing agent .

[0067] 3. Preparation of nano-silver powder by chemical reduction method

[0068] In the silver oxide prepared in the step 1 of silver oxide preparati...

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PUM

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Abstract

The invention relates to nano-silver powder used for DC electrode sizing agents and low-temperature bonding nano-silver paste, and a manufacturing method thereof. The physical properties of nano-silver powder are as follows: particle size distribution between 10 and 100 mu m, average particle size between 20 and 50 nm, specific surface area between 30 and 50 m2/g, and apparent density between 1.5 and 3.0 g/cm3. The nano-silver powder adopts a chemical reduction method and is prepared by adopting hydrazine hydrate, glycerine or triethanolamine to reduce silver compounds at 90 to 92 DEG C. The nano-silver powder manufactured by the method is applied to the DC electrode sizing agents sintered at 800 DEG C. When the nano-silver powder is applied to the nano-silver paste of SiC or GaN and other chips bonded at 260 to 270 DEG C, electrodes have the advantages of good weldability, high conductivity, stable electrical property, high bonding strength, high reliability and the like.

Description

technical field [0001] The invention relates to a compound with an average particle diameter of 20-50nm and a specific surface area of ​​30-50m 2 / g, bulk density is 1.5~3.0g / cm 3 nano silver powder. The use of the nano-silver powder: 1. The nano-silver powder is used as the silver electrode paste of the disc ceramic capacitor (DC), and the electrode coverage can reach 200cm 2 / g, excellent solderability. 2. The nano-silver powder is used as nano-silver paste for bonding chips at low temperature, bonding SiC or GaN chips to the surface of ceramics, after baking at 260 ° C to 270 ° C, the bonding force is > 20 MPa, and the tensile tension is not less than 40 MPa. Background technique [0002] Porcelain capacitors are a type of electronic components that consume a lot, among which, wafer capacitors (DC) are used the most. Solderable Ag conductor paste has the following characteristics: low metal content, Ag is usually: 52, 55, 60%, and the largest usage is 55% Ag conten...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B13/00H01G4/008
Inventor 陈峤贺昕李治宇陈斐吴松吴聪刘凤茹
Owner GRIKIN ADVANCED MATERIALS
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