Nano-silver powder, manufacturing method and application thereof
A technology of nano silver powder and manufacturing method, applied in cable/conductor manufacturing, metal/alloy conductors, electrical components and other directions, can solve the problems of small electrode coverage, silver electrode erosion, etc., and achieve improved solder resistance, large specific surface area, The effect of improving electrode coverage
Active Publication Date: 2010-05-12
GRIKIN ADVANCED MATERIALS
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The invention relates to nano-silver powder used for DC electrode sizing agents and low-temperature bonding nano-silver paste, and a manufacturing method thereof. The physical properties of nano-silver powder are as follows: particle size distribution between 10 and 100 mu m, average particle size between 20 and 50 nm, specific surface area between 30 and 50 m2/g, and apparent density between 1.5 and 3.0 g/cm3. The nano-silver powder adopts a chemical reduction method and is prepared by adopting hydrazine hydrate, glycerine or triethanolamine to reduce silver compounds at 90 to 92 DEG C. The nano-silver powder manufactured by the method is applied to the DC electrode sizing agents sintered at 800 DEG C. When the nano-silver powder is applied to the nano-silver paste of SiC or GaN and other chips bonded at 260 to 270 DEG C, electrodes have the advantages of good weldability, high conductivity, stable electrical property, high bonding strength, high reliability and the like.
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Property | Measurement | Unit |
Particle size distribution | 10.0 ~ 100.0 | nm |
Average particle size | 20.0 ~ 50.0 | nm |
Specific surface area | 30.0 ~ 50.0 | m²/g |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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