Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- UNIV OF SCI & TECH BEIJING
- Publication Date
- 2010-07-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the field of metal materials, and relates to a diamond-copper composite (Diamond-copper composites, DCC) and a preparation method thereof. Background technique
[0002] Diamond has excellent physical and chemical properties, and its thermal conductivity can reach up to 2200W.m -1 .K -1 , which is the highest thermal conductivity of all known substances in nature, its hardness is as high as 100GPa, and its thermal expansion coefficient is about 0.8-1.0×10 -6 K -1 . In addition, diamond also has a series of advantages such as stable chemical properties and high wear resistance. As an engineering material, copper has excellent electrical conductivity and high thermal conductivity, and its thermal conductivity is 400W m -1 .K -1 , the coefficient of thermal expansion is 17×10 -6 K -1 . Therefore, the double connected structure composite material (DCC, Diamond-Copper Composites) composed of diamond particles and copper has ...