Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction

A technology of copper-based composite materials and diamond particles, which is applied in the field of metal materials, can solve the problems of high production cost and low production efficiency, and achieve the effects of simple production equipment, improved thermal conductivity, and improved holding force

Inactive Publication Date: 2010-07-07
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the traditional production method can only produce samples with simple shapes, and the production effic

Method used

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  • Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction
  • Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction
  • Preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1: Preparation of diamond-copper composite parts at 1450°C

[0019] Artificial diamond particles with an average particle size of 110 μm and titanium powder with an average particle size of 45 μm were mixed according to a volume ratio of 1:3, and mixed on a roller ball mill for 8 hours. Put the mixed powder of diamond and titanium into an alumina crucible and compact it, cover it with enough mixed salt of NaCl and KCl (the mass ratio of NaCl and KCl is 58:42), put it into a vacuum furnace and heat it to 850°C And keep it warm for 1 hour, take out the crucible and dissolve and separate the diamond particles.

[0020] Add 1-3% by mass and 10% polyvinyl alcohol (PVA) aqueous solution into the surface-modified diamond powder, mix well and fill the mixed powder into the mold cavity, press pressure The pressure is 6KN, and the holding time is 2 minutes, and the pressed body is placed in a drying oven to dry for 4 hours to obtain a diamond porous preform. Since the r...

Embodiment 2

[0022] Example 2: Preparation of diamond-copper alloy composite parts at 1350°C

[0023] Artificial diamond particles with an average particle size of 110 μm and titanium powder with an average particle size of 45 μm were mixed according to a volume ratio of 1:3, and mixed on a roller ball mill for 8 hours. Put the mixed powder of diamond and titanium into an alumina crucible and compact it, cover it with enough mixed salt of NaCl and KCl (the mass ratio of NaCl and KCl is 58:42), put it into a vacuum furnace and heat it to 850°C And keep it warm for 1 hour, take out the crucible and dissolve and separate the diamond particles.

[0024] Add 1-3% by mass and 10% polyvinyl alcohol (PVA) aqueous solution into the surface-modified diamond powder, mix well and fill the mixed powder into the mold cavity, press pressure The pressure is 6KN, and the holding time is 2 minutes, and the pressed body is placed in a drying oven to dry for 4 hours to obtain a diamond porous preform. Since...

Embodiment 3

[0026] Example 3: Preparation of diamond-copper alloy composite parts at 1400°C

[0027] Artificial diamond particles with an average particle size of 110 μm and titanium powder with an average particle size of 45 μm were mixed according to a volume ratio of 1:3, and mixed on a roller ball mill for 8 hours. Put the mixed powder of diamond and titanium into an alumina crucible and compact it, cover it with enough mixed salt of NaCl and KCl (the mass ratio of NaCl and KCl is 58:42), put it into a vacuum furnace and heat it to 850°C And keep it warm for 1 hour, take out the crucible and dissolve and separate the diamond particles.

[0028] Add 1-3% by mass and 10% polyvinyl alcohol (PVA) aqueous solution into the surface-modified diamond powder, mix well and fill the mixed powder into the mold cavity, press pressure The pressure is 6KN, and the holding time is 2 minutes, and the pressed body is placed in a drying oven to dry for 4 hours to obtain a diamond porous preform. Since...

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Abstract

The invention relates to a preparation method of diamond particle reinforced copper-based composite material parts with high volume fraction, belonging to the field of metal materials. The preparation method is characterized in that the composite material comprises copper or copper alloy, diamond particles and an intermediate layer, wherein the volume fraction of the copper or the copper alloy is 32-45 percent, and the volume fraction of the diamond particles and the intermediate layer is 55-68 percent. The preparation method comprises the following steps of: firstly forming a TiC-Ti composite thin plating layer on the surface of the diamond by adopting a vacuum salt bath plating method, then adding an appropriate amount of caking agent into modified diamond powder and pressing into a porous prefabricated blank according to the shape of the parts; and finally putting the porous prefabricated blank and the copper or the copper alloy into a vacuum condition together for carrying out pressureless infiltration treatment to obtain the diamond-copper composite material parts with high volume fraction and high density. The invention has the advantages that the diamond-copper composite material parts with high volume fraction and the complex shape can be directly prepared, and the composite material parts have high density, even tissue distribution and low production cost, and can realize large-batch production.

Description

technical field [0001] The invention belongs to the field of metal materials, and relates to a diamond-copper composite (Diamond-copper composites, DCC) and a preparation method thereof. Background technique [0002] Diamond has excellent physical and chemical properties, and its thermal conductivity can reach up to 2200W.m -1 .K -1 , which is the highest thermal conductivity of all known substances in nature, its hardness is as high as 100GPa, and its thermal expansion coefficient is about 0.8-1.0×10 -6 K -1 . In addition, diamond also has a series of advantages such as stable chemical properties and high wear resistance. As an engineering material, copper has excellent electrical conductivity and high thermal conductivity, and its thermal conductivity is 400W m -1 .K -1 , the coefficient of thermal expansion is 17×10 -6 K -1 . Therefore, the double connected structure composite material (DCC, Diamond-Copper Composites) composed of diamond particles and copper has ...

Claims

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Application Information

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IPC IPC(8): C22C47/08C22C49/02B32B9/04C22C101/10C22C121/00
Inventor 何新波董应虎徐良任淑彬郭彩玉沈晓宇曲选辉
Owner UNIV OF SCI & TECH BEIJING
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