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High temperature-resistant heat-bonding enamelled wire paint and preparation method thereof

An enameled wire varnish and warming technology, applied in coatings, insulators, polyamide coatings, etc., can solve the problems of poor moisture resistance and refrigerant resistance, poor bonding strength, and low resin heat resistance, etc., to achieve Good adaptability, improved heat resistance, and low moisture absorption properties

Inactive Publication Date: 2010-09-01
广东省石油化工研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding strength of butyral resin is poor at high temperature, and epoxy resin needs to be heated by a strong current when bonding. Although aliphatic nylon has good bonding ability, its moisture resistance and refrigerant resistance are poor. Very poor, and the heat resistance of the resin itself is also low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation method of the high temperature-resistant thermal bonding wire enamel described in the present embodiment comprises the following steps:

[0027] (a) Add 10kg of n-butanol and 20kg of isopropanol to a reaction kettle with a stirrer and a condensing return pipe, and gradually and evenly add phenolic resin (thermosetting resin, developed by Wuhan Tigers Technology) within half an hour. Co., Ltd.) 70kg, stirring and heating at the same time, keeping at 90°C / 4h, to obtain a phenolic resin solution for use;

[0028] (b), in the reactor with agitator and condensing reflux pipe, add m-cresol 12kg, phenol 18kg, turn on the agitator to stir, heat after feeding, when the temperature reaches 80 ℃, in half an hour Gradually and evenly add 18 kg of modified copolymerized nylon hot melt adhesive (melting point is 140-150 ° C, relative viscosity is about 1.5), 4.5 kg of phenolic resin solution in step (a), 2,6-di-tert-butyl p-methyl Phenol 0.4kg, polyethylene wax 0.02k...

Embodiment 2

[0031] The preparation method of the high temperature-resistant thermal bonding wire enamel described in the present embodiment comprises the following steps:

[0032] (a), in the reactor with agitator and condensing reflux pipe, add 15kg of n-butanol and 15kg of isopropanol, gradually and evenly add phenolic resin within half an hour (provided by Wuhan Tegus Technology Development Co., Ltd. ) 70kg, stirring and heating at the same time, keeping at 100°C / 4h, to obtain a phenolic resin solution for use;

[0033] (b), in the reaction kettle with agitator and condensing reflux pipe, add m-cresol 15kg, phenol 15kg, turn on the agitator to stir, heat after feeding, when the temperature reaches 70 ℃, in half an hour Gradually and evenly add 20 kg of modified copolymerized nylon hot melt adhesive (melting point is 120-130 °C, relative viscosity is about 1.7), 5 kg of phenolic resin solution in step (a), 2,6-di-tert-butyl-p-cresol 0.5kg, 0.01kg of oleic acid amide, stir and heat at t...

Embodiment 3

[0036] The preparation method of the high temperature-resistant thermal bonding wire enamel described in the present embodiment comprises the following steps:

[0037] (a), in the reactor with agitator and condensing reflux pipe, add 15kg of n-butanol and 20kg of isopropanol, gradually and evenly add phenolic resin within half an hour (provided by Wuhan Taigusi Technology Development Co., Ltd. ) 65kg, stirring and heating at the same time, keeping at 80°C / 3h, to obtain a phenolic resin solution for use;

[0038] (b) In the reaction kettle with agitator and condensing reflux pipe, add 20kg of m-cresol and 10kg of phenol, start the agitator to stir, and heat after feeding. When the temperature reaches 60°C, in half an hour Gradually and evenly add 20kg of modified copolymerized nylon hot melt adhesive (melting point is 130-140°C, relative viscosity is about 2.0), 5.5kg of phenolic resin solution in step (a), 2,6-di-tert-butyl p-methyl Phenol 0.6kg, solid paraffin 0.03kg, stirri...

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Abstract

The invention discloses high temperature-resistant heat-bonding enamelled wire paint and a preparation method thereof. The high temperature-resistant heat-bonding enamelled wire paint consists of patient base resin such as modified co-polymerized nylon and phenolic resin, mixing dissolvent and assistant. The high temperature-resistant heat-bonding enamelled wire paint meets the requirement of heat-resistant condition more than 180 DEG C, the appearance of the finished product is brown thick liquid, the weight solid part is 18-28%, and the rotating viscosity is 800-2000mPa.s at 25 DEG C. The patient is used for the outer layer of a high temperature-resistant coil wire material, and can be solidified with polyesterimide base paint at the same furnace temperature.

Description

technical field [0001] The invention relates to a preparation method of wire enamelled varnish, in particular to a high-temperature-resistant heat-adhesive wire enameled enamel and a preparation method thereof. Background technique [0002] Thermal bonding enameled wire enamel is an important electrical insulation coating, which is used to coat the outer layer of composite coated enameled wire. It is generally made by repeatedly coating enameled wire enamel on the conductor with an enamelling machine and baking at high temperature. It is currently widely used in Manufacture of bobbinless coil wire. [0003] In recent years, with the rapid development of aerospace industry and microelectronics industry and the improvement of product design level, electrical equipment has developed in the direction of large capacity, high voltage, small size and light weight, and the coil will generate a lot of heat during use. , so the requirements for the heat resistance level of insulating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D177/00C09D161/06C09D7/14C09D7/06H01B17/62C09D7/47C09D7/80
Inventor 缪飞麦裕良兰芳李欢玲栾安博
Owner 广东省石油化工研究院
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