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Preparation method of CEM-3 copper clad plate with high heat conductivity

A technology of copper-clad laminates and high thermal conductivity, which is applied in the direction of chemical instruments and methods, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems of shortened life, large thermal expansion coefficient, and increased power consumption, and achieve the effect of improving heat dissipation

Active Publication Date: 2010-09-29
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It adopts epoxy resin / dicyandiamide curing system and uses aluminum hydroxide as filler, which has high peel strength, good insulation performance, excellent processability and low cost, but has low thermal conductivity and low heat resistance. Low, large thermal expansion coefficient in the Z-axis direction, etc., used in LED TVs, LED lighting, power substrates and other products, there are disadvantages such as poor heat dissipation, easy to cause product aging, shortened life, increased power consumption, and reduced reliability. CEM-3's thermal conductivity and high CTI performance provide a cost-effective copper clad laminate, which has become one of the research and development directions in the field of electronic technology.
[0005] High thermal conductivity CEM-3 composite-based copper-clad laminate is a new type of copper-clad laminate developed to meet the needs of LEDs. At present, there are no reports and production in China. There are only a few foreign companies such as Panasonic Electric and Sumitomo Electric. The company has such product introductions

Method used

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  • Preparation method of CEM-3 copper clad plate with high heat conductivity
  • Preparation method of CEM-3 copper clad plate with high heat conductivity
  • Preparation method of CEM-3 copper clad plate with high heat conductivity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: A kind of preparation method of CEM-3 copper-clad laminate

[0028] a. prepare core material resin, its component parts by weight are:

[0029] 90 parts of bisphenol A type epoxy resin, 10 parts of novolak type epoxy resin,

[0030] 30 parts of phenolic resin, 240 parts of filler Al2O3,

[0031] 10 parts of filler titanium dioxide, 20 parts of filler talcum powder

[0032] 4.5 parts of coupling agent KH-560 0.03 parts of curing accelerator 2-ethyl-4-methylimidazole,

[0033] b. The above materials are prepared into a resin solution for the core material with methyl ethyl ketone;

[0034] c. Impregnate the glass fiber paper with the above resin solution, and make it into a semi-cured state at a temperature of 130-210°C to make a core material bonding sheet.

[0035] d. Prepare the fabric resin matrix, its components (parts by weight) are:

[0036] 70 parts of bisphenol A type epoxy resin, 30 parts of brominated epoxy resin,

[0037] Nitrogen-containin...

Embodiment 2

[0042] Embodiment 2: A kind of preparation method of CEM-3 copper-clad laminate

[0043] a. prepare core material resin, its component parts by weight are:

[0044] 90 parts of bisphenol A type epoxy resin, 10 parts of novolak type epoxy resin,

[0045] 20 parts of phenolic resin, filler Al(OH) 3 40 copies,

[0046] Filler boron nitride 80 parts, coupling agent KH-560 1.5 parts,

[0047] Curing accelerator 2-ethyl-4-methylimidazole 0.4 parts

[0048] b. The above materials are prepared into a resin solution for the core material with methyl ethyl ketone;

[0049] c. Impregnate the glass fiber paper with the above resin solution, dry it at 130-210°C, and slice it to make core material;

[0050] d. prepare fabric resin, its component (weight part) is:

[0051] 70 parts of bisphenol A epoxy resin, 30 parts of brominated epoxy resin,

[0052] Nitrogen-containing novolak type phenolic resin 30 parts Al(OH) 3 40 copies,

[0053] 60 parts of aluminum nitride, 0...

Embodiment 3

[0057] Embodiment 3: A kind of preparation method of CEM-3 copper clad laminate

[0058] A. prepare core material resin, its component (weight part) is:

[0059] 100 parts of bisphenol A type epoxy resin, 25 parts of phenolic resin,

[0060] Filler Al(OH) 3 80 parts, 20 parts of filler aluminum nitride,

[0061] 120 parts of filler magnesium oxide, 2.5 parts of coupling agent KH-560;

[0062] 0.1 part of curing accelerator 2-ethyl-4-methylimidazole.

[0063] b. The above materials are prepared into a resin solution for the core material with methyl ethyl ketone;

[0064] c. Impregnate the glass fiber paper with the above resin solution, dry it at 130-210°C, and slice it to make core material;

[0065] d. prepare fabric resin, its component is:

[0066] 70 parts of bisphenol A type epoxy resin, 30 parts of brominated epoxy resin,

[0067] Nitrogen-containing novolak type phenolic resin 25 parts Mg(OH) 3 30 servings,

[0068] 40 parts of aluminum nitride, 0.2 pa...

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Abstract

The invention relates to a preparation method of a CEM-3 copper clad plate with high heat conductivity, which comprises the following processes and steps of: (1) preparing a core material: selecting epoxy resin / phenolic resin as a main curing agent, adding a coupling agent, padding and a curing accelerator and preparing into resin liquid for the core material with butanone, and soaking glass fiber paper into a semi-cured state with the core material glue to obtain the core material; (2) preparing a facing material: dissolving the epoxy resin / phenolic resin curing system with butanone, adding padding and preparing into resin liquid for the facing material with butanone, soaking glass fiber cloth into the resin liquid, and curing to obtain the facing material; and (3) proportioning and molding by laminating. The invention not only has the insulating property, the electrical properties, the mechanical properties and other basic properties of a general universal CEM-3 composite copper clad plate, but also has excellent heat conductivity, high CTI, higher heat resistance and excellent PCB (printed circuit board) processing performance. The invention is suitable for LED (Light Emitting Diode), vehicle systems, variable-frequency power sources and other products needing excellent heat conductivity, and can greatly improve the heat dispersion of electronic devices and improve the reliability of electronic products.

Description

technical field [0001] The invention is a preparation method of copper-clad laminate CEM-3, specifically a preparation method of composite base copper-clad laminate CEM-3 with high thermal conductivity and high tracking resistance index, and the product prepared by the invention is a printed circuit PCB (PCB) is a composite substrate of copper clad laminate. Background technique [0002] With the development of low-carbon economy, light-emitting diode (LED) has become the mainstream environmental protection and energy-saving light-emitting products, and its use is very wide, such as LED TV, LED landscape lighting, LED special lighting (miner's lamp, emergency light, etc.), LED car lighting , LED signal signs and so on. To maintain long life and high brightness of LED, it is necessary to solve the four key technologies of power supply, LED light source, heat dissipation and safety. The "difficult heat dissipation" of LED products has always been one of the core problems dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K1/03B32B15/04B32B17/04B32B27/38B32B27/42B32B27/20B32B37/00
Inventor 张记明
Owner SHAANXI SHENGYI TECH
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