Conductive Nb2O5-x target material for magnetron sputtering coating and production method thereof
A production method and target material technology, applied in the field of optoelectronic materials, can solve the problems of inefficient direct current magnetron sputtering coating and other problems, and achieve the effects of easier control of the production process, improved production efficiency, and guaranteed uniformity of the film layer
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Embodiment 1
[0023] Weigh Nb2O5 powder with a purity of 4N and an average particle diameter of 10 microns as 440 grams of main raw material, and add metal powder Nb powder with a weight ratio of 1% and a fineness of 250 mesh. Add 30% by weight of deionized pure water and 0.5% of triethanolamine to mix, and mix with a ball mill for 18 hours, add 1% of the total weight of polyvinyl alcohol organic binder, and ball mill for another 2 hours, and the slurry is spray-dried and granulated , that is, the target material with an average particle diameter of 100 microns, and a metal mold of 1 ton / CM 2 The green body with a diameter of 150 mm and a relative density greater than 50% is obtained by pressure molding, and the green body is kept in an air furnace at 400 degrees Celsius for 3 hours to remove organic additives, and the temperature is raised to 1450 degrees Celsius for sintering and compacting to obtain a ceramic semiconductor with a relative density of 98.5%. , the conductivity of the sinte...
Embodiment 2
[0025] Weigh 900 grams of Nb2O5 powder with a purity of 4N and an average particle diameter of 10 microns as the main raw material, and add 100 grams of metal powder Nb powder with a fineness of 250 mesh. Add 300 grams of deionized pure water and 5 grams of triethanolamine and mix them with a ball mill for 18 hours, add 10 grams of polyvinyl alcohol organic binder, ball mill for 2 hours, and spray the slurry to dry and granulate to obtain the average Target raw material with a particle size of 100 microns, metal mold 1 ton / CM 2 The green body with a diameter of 150 mm and a relative density greater than 50% is obtained by pressure molding, and the green body is kept in an air furnace at 400 degrees Celsius for 3 hours to remove organic additives, and the temperature is raised to 1450 degrees Celsius for sintering and compacting to obtain a ceramic semiconductor with a relative density of 98.5%. , the electrical conductivity of the sintered body is good, and the resistivity mea...
Embodiment 3
[0027] Weigh 900 grams of Nb2O5 powder with a purity of 4N and an average particle diameter of 10 microns as the main raw material, and add 100 grams of metal powder Nb powder with a fineness of 250 mesh. Add 300 grams of deionized pure water and 5 grams of triethanolamine, mix them with a ball mill for 18 hours, add 10 grams of polyvinyl alcohol organic binder, and ball mill them for 2 hours, and then spray dry and granulate the slurry to obtain the average Target raw material with a particle size of 100 microns, metal mold 1 ton / CM 2 The green body with a diameter of 150 mm and a relative density greater than 50% is obtained by pressure molding, and the green body is kept in an air furnace at 400 degrees Celsius for 3 hours to remove organic additives, and the temperature is raised to 1450 degrees Celsius for sintering and compacting to obtain a ceramic semiconductor with a relative density of 98.5%. , the electrical conductivity of the sintered body is good, and the resisti...
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