Method for performing rapid laser heating by using mask protection
A rapid heating and masking technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing the frequency of laser action and poor crystallization quality of thin films, so as to reduce the frequency of laser crystallization and optimize the laser crystallization process , The effect of destructive inhibition
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[0016] After the deposition of the amorphous silicon film is completed, a mixed gas of NH3 and SiH4 is introduced to deposit the silicon nitride film. The deposition pressure is 5Pa. The substrate deposition temperature was kept at 250° C., the deposition power was 400 W, and the deposition time was 60 minutes to form a silicon nitride mask layer.
[0017] Place the above-mentioned amorphous silicon film containing a silicon nitride protective layer in the cavity of the protective container 1, see figure 1 . A spacer 12 is built in the cavity of the container 1 , and the silicon wafer 4 of the amorphous silicon film is placed on the spacer 12 . The top of the container 1 is provided with a window 11 for the laser beam 3 to enter, the laser (not shown) is placed outside the container 1 , and the focusing lens 2 on it is placed above the window 11 . The laser beam reflected by the focusing mirror 2 is irradiated on the amorphous silicon thin film 4 on the spacer 12 . The lo...
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