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Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink

A technology of photosensitive resin and epoxy resin, which is applied in the field of solder resist materials, can solve the problems of insufficient chemical resistance and heat resistance, insufficient bending resistance, easy falling off, etc., achieve excellent heat resistance and improve heat resistance Effect

Active Publication Date: 2012-03-28
新东方油墨有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Photosensitive resin synthesis adopts bisphenol A type epoxy resin or bisphenol F type epoxy resin or hydroxymethyl bisphenol A type epoxy resin to completely replace the novolac epoxy resin or partially replace the product to synthesize the photosensitive resin. Although the bending resistance has been improved, the bending resistance is not enough, so it can only be applied to low-grade flexible boards.
[0006] Chinese patent document CN1390898A discloses a "dilute alkali developing photosensitive imaging solder resist ink", which uses a modified acrylate photosensitive oligomer. The disadvantage is that the chemical resistance and heat resistance are not enough, and it is easy to fall off when soldering
[0007] CN1971419A "Liquid photoimaging alkali developing electronic solder resist ink and its preparation method", the photosensitive resin of this invention is a phenolic epoxy acrylic resin, the advantage is good chemical resistance and heat resistance, the disadvantage is that the bending resistance is not enough, Cannot be used on flex board

Method used

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  • Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink
  • Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink
  • Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink

Examples

Experimental program
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Effect test

Embodiment 1

[0043] Add 200 grams of silicone-modified bisphenol F epoxy resin (epoxy equivalent: 200), 185 grams of diethylene glycol ethyl ether acetate into a three-necked flask, add 72 grams of acrylic acid, N,N-dimethylbenzyl 4 grams of ammonia, 4 grams of hydroquinone, heated to 100°C for 10 hours, then added 65 grams of tetrahydrophthalic anhydride and heated to 110°C for 5 hours to obtain an acid value of 60 mg KOH / g and a solid content of 65 % photosensitive resin (1).

Embodiment 2

[0045] Add 230 grams of silicone-modified bisphenol-A epoxy resin (epoxy equivalent 230) and 191 grams of diethylene glycol ethyl ether acetate into a three-necked flask, add 86 grams of methacrylic acid after the dissolution is complete, N,N- 4 grams of methylbenzylamine, 4 grams of hydroquinone, heated to 100°C for 10 hours, then added 65 grams of tetrahydrophthalic anhydride and heated to 110°C for 5 hours to obtain an acid value of 58 mg KOH / g, solid 66% photosensitive resin (2).

Embodiment 3

[0047] Add 230g of silicone-modified hydroxymethyl bisphenol A epoxy resin (epoxy equivalent 230) and 190g of diethylene glycol ethyl ether acetate into a three-necked flask, add 72g of acrylic acid after the dissolution is complete, N,N-dimethyl 4 grams of benzylamine, 4 grams of hydroquinone, heated to 100 ° C for 10 hours, then added 50 grams of maleic anhydride and heated to 110 ° C for 5 hours, the acid value was 55 mg KOH / g, and the solid content was 66%. Photosensitive resin (3).

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Abstract

The invention relates to a photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink, needing to solve the following technical problem that: the photosensitive resin not only has flexibility but also can solve chemical gold plating receptivity and soldering tin resistance; and the photosensitive resin is applied to preparing liquid photoimageable solder resist ink. The photosensitive resin uses organic silicon modified bisphenol A epoxy resin with the dosage of 10-60% and organic silicon modified methyl bisphenol A epoxy resin as raw materials; firstly, the raw materials are dissolved in a solvent with the dosage of 30-50%; polymerization inhibitor and catalyst with the respective dosage of 0.2-3% are added to react with the unsaturated monocarboxylicacid with the dosage of 5-30%; and the reactants thereof are re-reacted with the polyanhydride with the dosage of 5-30% so as to obtain the photosensitive resin.

Description

technical field [0001] The invention relates to a solder resist material used on a flexible circuit board (Flexible Printed Circuit Board in English, abbreviated as FPC, hereinafter referred to as FPC), specifically a photosensitive resin and its use in preparing liquid photosensitive solder resist ink. application. Background technique [0002] The prior art is used for solder resist materials on flexible circuit boards (the English is Flexible Printed Circuit Board, abbreviated as FPC, hereinafter referred to as FPC) (also can be used on rigid circuit boards), and the solder resist layer formed on the surface of FPC will It plays the role of "three defenses" (moisture-proof, anti-pollution, anti-corrosion, etc.) and "one resistance" (prevents splicing caused by welding) and has good flexibility. Its function: (1) to prevent the bridge between wires (or conductors, such as pads, etc.) decorative effect, etc. The successful development and application of bendable photosen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027C09D11/101C09D11/107
Inventor 林华君胡仕锬
Owner 新东方油墨有限公司