Flexible substrate MEMS technology-based electroencephalogram dry electrode array and preparation method thereof

A flexible substrate and electroencephalogram technology, applied in microstructure technology, technology for producing decorative surface effects, decorative art, etc., can solve the problem of limited fastness of solder joints, electrodes without connectors, and electrodes that cannot be connected And other problems, to achieve the effect of high mechanical strength, low impedance, high yield

Inactive Publication Date: 2012-09-05
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The size of the needle bottom of the three-dimensional electrode prepared by this method is small, and the electrode with silicon as the main body is easier to break; in addition, the three-dimensional dry electrode directly prepared does not have a corresponding connector, and the traditional welding method is easy to produce false welding , and the fastness of the solder joint is limited, so that the electrode cannot be well connected with the subsequent corresponding equipment

Method used

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  • Flexible substrate MEMS technology-based electroencephalogram dry electrode array and preparation method thereof
  • Flexible substrate MEMS technology-based electroencephalogram dry electrode array and preparation method thereof
  • Flexible substrate MEMS technology-based electroencephalogram dry electrode array and preparation method thereof

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Embodiment 1

[0038] Structural parameters of EEG dry electrode array: glass substrate, polydimethylsiloxane adhesive layer thickness 50 μm, total biological microelectrode thickness 55 μm, nickel electrode microneedle and circuit layer thickness 28 μm, line width 50 μm, microneedle length 200 μm , the needle tip ratio is 1:1, the thickness of the gold protective layer is 0.5 μm, it is assembled in 10 layers, the clamp is combined, and the diameter of the nylon screw is 1.5 mm.

[0039] Such as figure 1 As shown, the preparation process of this embodiment is as follows:

[0040] (1) Substrate treatment and preparation of polydimethylsiloxane adhesion layer

[0041] A glass sheet with a thickness of 2mm was used as the substrate 1, and the substrate was firstly treated: ultrasonically cleaned with calcium carbonate powder, acetone, alcohol and deionized water, and dried in an oven at 180°C for 3 hours. Then, a polydimethylsiloxane adhesive layer 2 with a thickness of 50 μm was coated on th...

Embodiment 2

[0057] Structural parameters of biological microelectrode array: glass substrate, polydimethylsiloxane adhesive layer thickness 200μm, total biological microelectrode thickness 100μm, nickel electrode microneedle and circuit layer thickness 48μm, line width 100μm, microneedle length 300μm, needle tip The ratio is 1:1.5, the thickness of the gold protective layer is 1μm, and it is assembled in 8 layers. The fixture is integral, and the diameter of the nylon screw is 2mm.

[0058] like figure 1 As shown, the preparation process of this embodiment is as follows:

[0059] (1) Substrate treatment and preparation of polydimethylsiloxane adhesion layer

[0060] A glass sheet with a thickness of 2mm was used as the substrate 1, and the substrate was firstly treated: ultrasonically cleaned with calcium carbonate powder, acetone, alcohol and deionized water, and dried in an oven at 180°C for 3 hours. Then a polydimethylsiloxane adhesive layer 2 with a thickness of 200 μm was coated on...

Embodiment 3

[0076] Structural parameters of biological microelectrode array: silicon substrate, polydimethylsiloxane adhesion layer thickness 100μm, total biological microelectrode thickness 120μm, nickel electrode microneedle and circuit layer thickness 68μm, line width 200μm, microneedle length 500μm, needle tip The ratio is 1:2, the gold protective layer is 1.5μm, and it is assembled in 4 layers. The clamp is combined, and the diameter of the nylon screw is 2.5mm.

[0077] like figure 1 As shown, the preparation process of this embodiment is as follows:

[0078] (1) Substrate treatment and preparation of polydimethylsiloxane adhesion layer

[0079] A silicon wafer with a thickness of 0.5 mm was used as the substrate 1, and the substrate was firstly treated by ultrasonic cleaning with deionized water, and drying in an oven at 180° C. for 3 hours. Then a polydimethylsiloxane adhesive layer 2 with a thickness of 100 μm was coated on the substrate at a rotation speed of 1000 rpm, and cur...

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Abstract

The invention relates to a flexible substrate MEMS technology-based electroencephalogram dry electrode array and a preparation method thereof, belonging to the technical field of micro electro mechanical system. The electrode array comprises a stationary fixture and a plurality of electroencephalogram dry electrodes fixed in the stationary fixture; wherein the electroencephalogram dry electrode comprises a metal electrode micro needle and a circuit layer as well as a second metal seed layer and a second polyimide layer which are arranged at the two sides thereof, the surface of the metal electrode micro needle is coated with an inertia metal layer, and a first polyimide layer is flexible substrate of electroencephalogram dry electrode. The invention has simple process and high yield; the position of electrode can be changed according to application requirement; metal is adopted as electrode main body, mechanical strength is high, resistance is small, imaging quality of flexible substrate is high, and biocompatibility is good; multilayer packaging of electrode is adopted and fixture is used for fixing, and the prepared electrode stereoscopic array is easy to fix and has good shielding characteristic.

Description

technical field [0001] The invention relates to an electrode in the technical field of micro-electromechanical systems and a preparation method thereof, in particular to an electroencephalogram dry electrode array based on flexible substrate MEMS technology and a preparation method thereof. Background technique [0002] Dry electrodes are mainly used for EEG measurement and can replace the existing wired EEG acquisition equipment based on wet electrodes. The dry electrode can directly pass through the stratum corneum of the skin to overcome the high impedance brought by the stratum corneum; it is less restricted by the environment and can perform fast and painless EEG signal acquisition. The development of EEG dry electrode preparation technology will greatly promote the application of EEG technology to the public, thereby improving and improving people's living standards. Dry electrodes are required to have a certain mechanical strength, good biocompatibility, low impedanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00A61B5/0478
Inventor 陈迪吴澄胡锐军陈景东陈翔
Owner SHANGHAI JIAO TONG UNIV
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