Method for enhancing radiation resistant characteristic of LDMOS (Laterally Diffused Metal Oxide Semiconductor)
An anti-radiation and characteristic technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems that affect the reliability of devices and circuits, increase electric fields, and reduce breakdown voltage of devices, so as to improve anti-radiation ability, improve radiation resistance, and reduce the effect of reinforcement costs
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[0017] In the preparation of the integrated circuit of the present invention, the materials used to form the trench isolation region and the drift region dielectric layer of the N-type and P-type LDMOS devices are different, so the process steps for the preparation of the N-type and P-type LDMOS transistor isolation regions and the drift region are separated. , the process is as follows:
[0018] image 3 (a)-(e) are the process flow and the cross-sectional schematic diagrams corresponding to each step of the method for preparing the isolation region and the drift region of the N-type and P-type LDMOS devices of the present invention.
[0019] 101---deposited silicon dioxide; 102---N well body region of P-type LDMOS transistor; 103---P well drift region of P-type LDMOS transistor; 104---P well of N-type LDMOS transistor Body region; 105---N well drift region of N-type LDMOS transistor; 106---photoresist; 107---nitride medium.
[0020] The specific process of the dielectric l...
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