Moulded-in-place high molecular thermal conductive composite material and preparation method thereof

A heat-conducting composite material and polymer technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of low temperature of heat-conducting paste and heat-conducting phase change materials, difficult to meet the use requirements, and decline in thermal conductivity. Achieve the effect of reducing application cost, safe and reliable use, and reducing thermal resistance

Inactive Publication Date: 2011-03-16
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thermally conductive polymer materials widely used at present are thermally conductive paste and thermally conductive phase change materials. Thermally conductive paste and thermally conductive phase change materials are generally realized by adding solid thermally conductive fillers to resins or paraffins. Due to the existence of small molecular components, the aging resistance is relatively low. Poor, in the course of use, after repeated heating and coo

Method used

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  • Moulded-in-place high molecular thermal conductive composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Accurately weigh 95g of silicone resin, 4g of curing agent, 0.99g of chloroplatinic acid-isopropanol complex as catalyst and 1,3,5,7-tetramethyl-1,3,5,7- Tetraethylcyclotetrasiloxane 0.01g, add the above-mentioned components into a double planetary power mixing mixer and stir for 30 minutes, add 300g of spherical A with an average particle diameter of 30 μm to the above mixture as alumina, stir for 30 minutes, and Vacuum stirring at -0.1MPa for 30 minutes to remove air bubbles;

[0033] Wherein, the silicone resin is a linear silicone resin, and its structural formula is: CH 2 =CH-Si(CH 3 ) 2 O[(CH 3 ) 2 SiO] 200 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is; CH 3 -Si(CH 3 ) 2 -O-[SiHCH 3 -O] 2 -[Si-(CH 3 ) 2 -O] 6 -Si(CH 3 ) 2 -CH 3 .

Embodiment 2

[0035] Accurately weigh 97g of silicone resin, 2.85g of curing agent, 0.1g of chloroplatinic acid-divinyltetramethylsiloxane complex as catalyst and 1,3,5,7-tetramethyl-1 , 0.05g of 3,5,7-tetraethylcyclotetrasiloxane, adding the above-mentioned components into a double planetary dynamic mixer and stirring for 40 minutes, adding 560g of spherical filler A with an average particle diameter of 60 μm in the above-mentioned mixture is Aluminum powder, stir for 40 minutes, add 240g of filler B with an average particle size of 10μm as copper powder, and stir in vacuum for 30 minutes under the condition of vacuum degree of -0.1MPa to remove air bubbles;

[0036] Wherein, the silicone resin is a linear silicone resin, and its structural formula is CH 2 =CH-Si(CH 3 )2 O[(CH 3 ) 2 SiO] 150 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is: CH 3 -Si(CH 3 ) 2 -O-[SiHCH 3 -O] 10 -[Si-(CH 3 ) 2 -O] 40 -Si(...

Embodiment 3

[0038] Accurately weigh 98g of silicone resin, 1.4g of curing agent, and 0.5g of catalyst. The catalyst is chloroplatinic acid-diethylphthalate complex, and the stabilizer is 1,3,5,7-tetramethyl Base-1,3,5,7-tetraethylcyclotetrasiloxane 0.1g, add the above components into a double planetary power mixer and stir for 50 minutes, add 770g of spherical particles with an average particle size of 40μm to the above mixture Filler A is zinc oxide, stirred for 50 minutes, added 330g of filler B with an average particle size of 5 μm, and vacuum stirred for 30 minutes under the condition of vacuum degree of -0.1MPa to remove air bubbles;

[0039] Wherein, the silicone resin is a linear silicone resin, and its structural formula is: CH 2 =CH-Si(CH 3 ) 2 O[(CH 3 ) 2 SiO] 200 (CH 3 ) 2 Si-CH=CH 2 ; The curing agent is a hydrogen-containing silicone oil curing agent, and its structural formula is: CH 3 -Si(CH 3 ) 2 -O-[SiHCH 3 -O] 30 -[Si-(CH 3 ) 2 -O] 68 -Si(CH 3 ) 2 -CH ...

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Abstract

The invention relates to a moulded-in-place high molecular thermal conductive composite material and a preparation method thereof. The thermal conductive composite material consists of a base resin and a thermal conductive filler in a weight ratio of 100:300-100:1,100, wherein the base resin consists of the following raw materials in percentage by weight: 95 to 99 percent of organic silicone resin, 1 to 4 percent of curing agent, 0.1 to 1 percent of catalyst and 0.01 to 0.1 percent of stabilizing agent; and the thermal conductive filler consists of the following components in percentage by weight: 70 to 100 percent of spherical filler A and 0 to 30 percent of filler B. The method comprises the following steps of: sequentially adding the organic silicone resin, the curing agent, the catalyst and the stabilizing agent into a stirrer, uniformly blending the raw materials to obtain the base resin, and blending the base resin and the thermal conductive filler in the weight ratio of 100:300-100:1,100, wherein the thermal conductive filler is prepared by uniformly stirring 70 to 100 percent of spherical filler A and 0 to 30 percent of filler B; and uniformly stirring, vacuumizing, defoaming and packing the mixture to obtain the moulded-in-place high molecular thermal conductive composite material.

Description

technical field [0001] The invention relates to a heat-conducting material, in particular to a polymer heat-conducting composite material capable of being formed on site and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] At present, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature. Every time the temperature of electronic components increases by 2°C, its reliability will decrease by 10%. Therefore, timely heat dissipation becomes an important factor affecting its service life. With the miniaturization and functional integration of electronic products, the density of devices on the substrate is increasing. In many cases, several devices of different heights share a heat sink. The interface between each device is becoming more and more complicated. The formability and adhesion requirements of thermal conductive materials ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K7/18C08K3/22C08K3/08C08K3/28C08K3/38C08K3/34C08K5/549C09K5/14
Inventor 石红娥王建斌陈田安
Owner YANTAI DARBOND TECH
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