Moulded-in-place high molecular thermal conductive composite material and preparation method thereof

Abstract

The invention relates to a moulded-in-place high molecular thermal conductive composite material and a preparation method thereof. The thermal conductive composite material consists of a base resin and a thermal conductive filler in a weight ratio of 100:300-100:1,100, wherein the base resin consists of the following raw materials in percentage by weight: 95 to 99 percent of organic silicone resin, 1 to 4 percent of curing agent, 0.1 to 1 percent of catalyst and 0.01 to 0.1 percent of stabilizing agent; and the thermal conductive filler consists of the following components in percentage by weight: 70 to 100 percent of spherical filler A and 0 to 30 percent of filler B. The method comprises the following steps of: sequentially adding the organic silicone resin, the curing agent, the catalyst and the stabilizing agent into a stirrer, uniformly blending the raw materials to obtain the base resin, and blending the base resin and the thermal conductive filler in the weight ratio of 100:300-100:1,100, wherein the thermal conductive filler is prepared by uniformly stirring 70 to 100 percent of spherical filler A and 0 to 30 percent of filler B; and uniformly stirring, vacuumizing, defoaming and packing the mixture to obtain the moulded-in-place high molecular thermal conductive composite material.

Description

technical field [0001] The invention relates to a heat-conducting material, in particular to a polymer heat-conducting composite material capable of being formed on site and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] At present, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature. Every time the temperature of electronic components increases by 2°C, its reliability will decrease by 10%. Therefore, timely heat dissipation becomes an important factor affecting its service life. With the miniaturization and functional integration of electronic products, the density of devices on the substrate is increasing. In many cases, several devices of different heights share a heat sink. The interface between each device is becoming more and more complicated. The formability and adhesion requirements of thermal conductive materials ...

AI Technical Summary

Problems solved by technology

[0003] The thermally conductive polymer materials widely used at present are thermally conductive paste and thermally conductive phase change materials. Thermally conductive paste and thermally conductive phase change materials are generally realized by adding solid thermally conductive fillers to resins or paraffins. Due to the existence of small molecular components, the aging resistance is relatively low. Poor, in the course of use, after repeated heating and cooling process of the device, the small molecule oil inside the system is easy to precipitate and volatilize, polluting the device, after the liquid component volatilizes for a long time, the powder gradually precipitates out of the system and falls off, resulting in thermal conductivity Decrease. Therefore, the use temperature of thermal paste and thermal phase change material is not high, and the service life is short, which is difficult to meet the use requirements

Images