Colloidal forming process method for preparing silicon nitride bonded silicon carbide composite ceramic

A composite ceramic and colloidal molding technology, applied in the field of engineering ceramics, achieves the effects of easy control, simple operation process and reduced production cost

Inactive Publication Date: 2011-04-13
BEIFANG UNIV OF NATITIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the colloidal molding process, the gel properties of natural polymers are used to realize the in-situ forming of large-sized and complex-shaped components of silicon nitride-silicon carbide com

Method used

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  • Colloidal forming process method for preparing silicon nitride bonded silicon carbide composite ceramic
  • Colloidal forming process method for preparing silicon nitride bonded silicon carbide composite ceramic
  • Colloidal forming process method for preparing silicon nitride bonded silicon carbide composite ceramic

Examples

Experimental program
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Example Embodiment

[0030] Example 1

[0031] 1~8wt% concentration agar deionized water solution (relative to solid powder 1wt%), 80.5wt% silicon carbide powder, 15wt% silicon powder, 4wt% alumina, 0.5wt% ferric oxide and 0.1wt% ammonium citrate (relative to Add solid powder) to deionized water, mix and ball mill for 24 hours to form a uniform slurry; heat and stir in a deionized water bath at 80°C to fully dissolve the agar in the slurry, vacuum to defoam for 10 minutes, and pour it into a beaker Place in a medium seal, this process is assisted by ultrasonic treatment; pour the hot slurry into a cold mold, place it at room temperature, and obtain a solidified wet body after demolding. After being dried in the shade for 24 hours, place it in an oven for heating and drying to obtain the desired Shape and size of the body. figure 1 It is the strength of the dry body containing different concentrations of agar gel.

Example Embodiment

[0032] Example 2

[0033] A 9wt% agar deionized aqueous solution (relative to solid powder 2wt%) was added to deionized water and heated at 45°C to dissolve it for use. 77.2wt% silicon carbide powder, 17.5wt% silicon powder, 0.3wt% ferric oxide, 4wt% alumina, 1wt% yttrium oxide, deionized water and 1wt% ammonium citrate (relative to solid powder) after 12 hours Ball mill, heat and stir to mix with the prepared agar solution, vacuum to remove bubbles to form a uniform slurry; vacuum to remove bubbles at 60℃, mold the slurry, cool and solidify for 20 minutes, demould, dry in the shade, and bake Dry to obtain a body of the desired shape and size. figure 1 It is the strength of the dry body containing different concentrations of agar gel.

Example Embodiment

[0034] Example 3

[0035] A gelatin deionized water solution (relative to solid powder 3wt%) with a concentration of 3wt% to 9wt% is added to deionized water and heated at 50°C to dissolve for use. 82.5wt% silicon carbide powder, 15.5wt% silicon powder, 2wt% yttrium oxide, deionized water and 0.5wt% ammonium citrate (relative to the solid powder) after 12 hours of ball milling, and mixed with the prepared gelatin solution by heating and stirring , Vacuum defoaming at 40°C to form a uniform slurry; slurry injection molding, cooling and solidifying for 30 minutes, demolding, drying in the shade, and drying to obtain a blank of the desired shape and size. figure 2 It is the strength of the dry body containing different concentrations of gelatin gel.

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Abstract

The invention belongs to the technical field of engineering ceramics and relates to a colloidal forming process method for preparing silicon nitride bonded silicon carbide composite ceramic. The colloidal forming process method comprises the following steps: a, adding silicon powder, silicon carbide powder, sintering additive, natural polymer and dispersing agent into deionized water, mixing the materials, and performing mixed ball milling to obtain a mixture slurry; b, in a heating state, defoaming the mixed slurry in vacuum and reinforcing the defoaming by auxiliary ultrasonic vibration; and c, injecting into a mould for curing and forming, drying for 1-3 days in a gloomy and cold environment, drying in an oven and demoulding to obtain a ceramic biscuit component which has the advantages of relatively high strength and smooth appearance. The invention has the advantages that the formed product has high density and is environmentally friendly, the working efficiency is greatly improved, the process operation is simple, the cost is low and the method is suitable for large-scale production.

Description

technical field [0001] The invention belongs to the technical field of engineering ceramics, and relates to a colloidal molding process method for preparing silicon nitride-bonded silicon carbide composite ceramics. Background technique [0002] Silicon nitride combined with silicon carbide ceramic materials usually use synthetic SiC particles to add silicon powder, and pass N at high temperature. 2 Gas, press 2N 2 +3Si→Si 3 N 4 Reaction, closely combined with SiC particles, this material is better than traditional silicon carbide materials in terms of chemical corrosion resistance, physical properties, mechanical strength and wear resistance; at the same time, the thermal conductivity of high temperature performance is also good, so it is obtained Wide range of applications, such as high temperature lining in the metallurgical industry, aluminum electrolytic cells in the non-ferrous industry, burner nozzles in the chemical industry, and kiln furniture for various industr...

Claims

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Application Information

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IPC IPC(8): C04B35/565C04B35/624C04B35/622
Inventor 耿桂宏罗绍华
Owner BEIFANG UNIV OF NATITIES
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