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Copper alloy material for electrical and electronic components, and manufacturing method therefof

A technology of electronic components and copper alloys, applied in the direction of conductive materials, conductive materials, electrical components, etc., can solve problems such as non-conductivity

Inactive Publication Date: 2011-06-29
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, NiSiCu and TiCu generally do not have conductivity above 50% IACS

Method used

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  • Copper alloy material for electrical and electronic components, and manufacturing method therefof
  • Copper alloy material for electrical and electronic components, and manufacturing method therefof
  • Copper alloy material for electrical and electronic components, and manufacturing method therefof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0175] Melt alloys (1a-36a, 1b-24b) containing the components shown in Tables 1 and 2, and the remainder consisting of Cu and unavoidable impurities in a high-frequency melting furnace, and cool them at a rate of 10-30K / sec. Speed ​​casting yielded an ingot with a thickness of 30 mm, a width of 100 mm, and a length of 150 mm.

[0176] After keeping the obtained ingot at a temperature of 930-970° C. for 0.5-1.0 hours, hot rolling is carried out to obtain a hot-rolled plate with a plate thickness t=12 mm, and both sides of the ingot are milled off by 1 mm to obtain a plate thickness t = 10 mm, and then finish processing to a plate thickness t=0.3 mm by cold rolling, and perform recrystallization heat treatment at a temperature of 700° C. or higher and 1025° C. or lower. The final product is produced by subjecting the prepared material to any of the following two procedures.

[0177] Step A: recrystallization heat treatment-aging heat treatment (at a temperature of 500-600°C for...

Embodiment 2

[0203] The copper alloy raw materials containing the components shown in Tables 3 and 4, and the remainder consisting of Cu and unavoidable impurities are melted in a high-frequency melting furnace, cast at a cooling rate of 10 to 30 K / s, and a thickness of An ingot of 30mm, width 100mm, and length 150mm.

[0204] There are many known documents that specify O (oxygen) in the raw material or material in Cu with Si added, but when an element with higher oxidizing property than Cu is added, if O is present, it will be oxidized before Cu, so Si as an added element The yield rate is not stable. Therefore, it is a well-known technique for those skilled in the art to regulate the O concentration in the raw material or material when adding an element whose oxidizing property is higher than Cu. Similarly, there are many known documents that specify H (hydrogen) together with O. H and O are often attached to the surface of the raw material in the state of moisture. If pre-treatment for...

Embodiment 3

[0233] An alloy containing the components shown in Table 5 and the remainder consisting of Cu and unavoidable impurities was melted in a high-frequency melting furnace, and cast at a cooling rate of 10 to 30 K / s to obtain a 160 mm wide, 30 mm thick, Ingots with a length of 180 mm. The cooling temperature is carried out under the condition that cracks and the like do not occur in the ingot.

[0234] After keeping the obtained ingot at a temperature of 1000° C. for 30 minutes, hot rolling is carried out to obtain a hot-rolled sheet with a thickness of t=12 mm, and each end of the two sides is milled off by 1 mm so that the thickness of the sheet is t=10 mm, and then After finishing by cold rolling to a plate thickness t=0.3 mm, recrystallization heat treatment was performed at a temperature in the range of 800 to 1025°C. The temperature of the recrystallization heat treatment was changed as described in Table 5 to Table 6 according to the addition amount of Co and the like. In...

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Abstract

Disclosed is a copper alloy material for electrical and electronic components that has a composition comprising 0.5-2.0 mass% Co, 0.1-0.5 mass% Si, and the remainder Cu and unavoidable impurities. The crystal grain diameter of the base material copper alloy is 3-35 mm, the particle diameter of a precipitate composed of Co and Si is 5-50 nm, and the density of the precipitate is 1108 to 11010 particles / mm2. The tensile strength of the copper alloy material is at least 550 MPa, and the conductivity is at least 50% IACS.

Description

technical field [0001] The present invention relates to components used in electrical and electronic equipment, such as connectors, terminal materials, etc., especially to electrical and electronic components such as connectors, terminal materials, and lead frames that are suitable for high-frequency relays and switches that require high conductivity or used in automobiles. Copper alloy material for components. Background technique [0002] So far, brass (C26000), phosphor bronze (C51910, C52120, C52100), beryllium bronze (C17200, C17530) and steel nickel silicon have been used in components for electrical and electronic equipment such as connectors, terminals, relays, and switches. Copper alloys such as copper alloys (hereinafter referred to simply as steel-nickel-silicon-copper, such as C70250). Here, (C×××××) refers to the type of copper alloy specified in CDA (Copper Development Association, Copper Development Association). [0003] In recent years, as electric current...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C9/00C22C9/02C22C9/04C22C9/05C22C9/10C22F1/08H01B1/02H01B13/00C22F1/00
CPCC22F1/08C22F1/00C22C9/10C22C9/06H01B1/023
Inventor 三原邦照松尾亮佑江口立彦
Owner FURUKAWA ELECTRIC CO LTD
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