MEMS (Micro Electro Mechanical System) microphone and pressure integration sensor, and manufacturing method thereof

Abstract

The invention relates to an MEMS (Micro Electro Mechanical System) microphone and pressure integration sensor and a manufacturing method thereof. The sensor provided by the invention comprises a first substrate and a second substrate, wherein the first substrate is provided with an induction film of a capacitance pressure sensing unit, a sensitive film of a microphone unit and a first bonding layer on the surface of the first substrate; the second substrate is provided with a dielectric layer between conductors, a conductor wiring layer positioned in the dielectric layer between the conductors and / or a second bonding layer on the surface of the second substrate; the second substrate and the first substrate are oppositely arranged and fixedly connected through the first bonding layer and the second bonding layer; and the patterns of the first bonding layer and the second bonding layer correspond to each other and are conductive materials. In the MEMS microphone and pressure sensor and the manufacturing method thereof provided by the invention, the capacitance pressure sensing unit and the microphone unit through the two substrates, thus the sensor and method provided by the invention are suitable for chip structures produced in a large scale and integrated with various MEMS sensors, are beneficial to the compatibility with an integrated circuit process, have the advantages that the standardization of a manufacturing process and a packaging process is enhanced, the volumes of devices are small, the signal-to-noise ratio performance is excellent, and the interference resistance is high.

Description

technical field [0001] The invention relates to a microelectronic mechanical system technology, in particular to a MEMS microphone and a pressure integrated sensor and a manufacturing method thereof. Background technique [0002] In recent years, various MEMS sensors have been used more and more in mobile phones and other portable electronic products, such as MEMS microphones, pressure sensors and gyroscopes, replacing traditional sensors with their miniaturization and thinness. In particular, the rapid development of smartphones has driven the market demand for various MEMS sensors, and the growing ecosystem of smartphone application software is largely due to MEMS sensors. [0003] MEMS microphones are miniature microphones made by etching pressure-sensing diaphragms on semiconductors through a microelectromechanical system process, and are commonly used in mobile phones, headphones, notebook computers, cameras, and automobiles. Driven by the requirement of compatibility ...

AI Technical Summary

Problems solved by technology

[0006] However, the problem is that in the above-mentioned traditional manufacturing methods of capacitive pressure sensors and microphone sensors, whether it is a pressure sensor chip or a microphone sensor chip, they are separated from the conductor connection chip or the signal processing circuit chip, and each chip is manufactured separately. Packaging process integration, whether it is a plastic package with a cavity cover or a metal shell package, the packaging process is more complicated, and it is not easy to be compatible with mature integrated circuit manufacturing technologies, and the device size is large, which also increases the cost. high

[0007] In addition, due to the obvious differences between the fabrication and packaging methods of various sensors, no integrated products have entered the market so far.

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