The invention relates to an MEMS (Micro Electro
Mechanical System)
microphone and pressure integration sensor and a manufacturing method thereof. The sensor provided by the invention comprises a first substrate and a second substrate, wherein the first substrate is provided with an induction film of a
capacitance pressure sensing unit, a sensitive film of a
microphone unit and a first bonding layer on the surface of the first substrate; the second substrate is provided with a
dielectric layer between conductors, a conductor wiring layer positioned in the
dielectric layer between the conductors and / or a second bonding layer on the surface of the second substrate; the second substrate and the first substrate are oppositely arranged and fixedly connected through the first bonding layer and the second bonding layer; and the patterns of the first bonding layer and the second bonding layer correspond to each other and are
conductive materials. In the
MEMS microphone and
pressure sensor and the manufacturing method thereof provided by the invention, the
capacitance pressure sensing unit and the
microphone unit through the two substrates, thus the sensor and method provided by the invention are suitable for
chip structures produced in a large scale and integrated with various
MEMS sensors, are beneficial to the compatibility with an
integrated circuit process, have the advantages that the
standardization of a manufacturing process and a packaging process is enhanced, the volumes of devices are small, the
signal-to-
noise ratio performance is excellent, and the
interference resistance is high.