Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof

A technology of LED encapsulation and silicone epoxy resin, applied in epoxy resin glue, epoxy resin coating, plastic/resin/wax insulator, etc. Excellent thermal stability and mechanical strength, meeting process and performance requirements

Active Publication Date: 2011-09-28
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Most of the packaging materials reported in the above-mentioned foreign patents use a curing system composed of cycloaliphatic epoxy resin, acid anhydride, and carboxylic acid curing agent, w

Method used

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  • Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
  • Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
  • Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] 10 grams of Epo-4, 2 grams of Unox 206, 0.5 grams of ethylene glycol, and 0.1 grams of p-methoxybenzenediazonium hexafluoroantimonate were mechanically stirred at room temperature for 30 minutes to form a uniform and transparent solution. The epoxy composition was coated on a glass slide, cured at 75°C for 30 minutes, and then heated to 100°C for 90 minutes to obtain a transparent cured product. Epoxy composition solution and product properties after curing are shown in Table 1 (light transmittance sees attached figure 1 ).

Embodiment 2

[0044] 10 grams of EPO-6, 3 grams of ERL-4221, 1 gram of diglycidyl ether, and 0.1 gram of triphenylthio-hexafluoroborate were mechanically stirred at room temperature for 30 minutes to form a uniform and transparent solution. The epoxy composition was coated on a glass slide, cured at 85°C for 30 minutes, and then gradually heated to 110°C for 100 minutes to obtain a transparent cured product. Epoxy composition solution and product properties after curing are shown in Table 1 (light transmittance sees attached figure 2 ).

Embodiment 3

[0046] 10 grams of EPO-3, 2 milliliters of cyclohexane, 0.1 grams of triphenylsulfur hexafluoroantimonate and 0.2 grams of benzophenone were mechanically stirred at room temperature for 30 minutes to form a uniform and transparent solution. The epoxy composition was coated on a glass slide, and after the cyclohexane volatilized, the sample was cured by ultraviolet light at room temperature for 5 minutes to obtain a transparent cured product. Epoxy composition solution and product properties after curing are shown in Table 1 (light transmittance sees attached image 3 ).

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PUM

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Abstract

The invention belongs to the technical field of light-emitting semiconductor device packaging materials, and relates to a silicon-containing epoxy resin composition for a light-emitting diode (LED) package and a preparation method thereof, in particular relating to a silicon-containing resin composition which has the advantages of low viscosity, ultraviolet curing, rapid low-temperature thermocuring, extremely high light transmittance and good thermal stability and mechanical strength and a preparation method thereof. The alicyclic epoxy resin packaging material is mainly characterized in that rapid curing is carried out at the low temperature, and the ultraviolet curing is adopted; before the curing, the viscosity is extremely low, and processing manufacturability is good; and after the curing, the light transmittance is extremely high, and the thermal stability and mechanical strength are good. The silicon-containing epoxy resin composition can be used for the LED packaging materials, and can also be used for paints, binders, integrated circuit package and epoxy vacuum pressure impregnated materials for motor insulation.

Description

technical field [0001] The invention relates to a packaging material for a light-emitting diode (LED), belonging to the field of packaging materials for light-emitting semiconductor devices. In particular, it relates to a silicon-containing epoxy resin composition which has low viscosity, can be cured by ultraviolet light, can also be thermally cured rapidly at a relatively low temperature, has extremely high light transmittance, excellent thermal stability and mechanical strength, and its Preparation. technical background [0002] In recent years, light-emitting diodes (LEDs), as a new generation of solid light sources, have the characteristics of energy saving, environmental protection, long service life and precise light frequency emission compared with traditional incandescent and fluorescent light sources, and have been widely used in lighting, radiation light sources and displays and other fields. LED devices usually need to be packaged with a transparent polymer, and...

Claims

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Application Information

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IPC IPC(8): C08G59/20H01L33/56C09D163/00C09J163/00H01L23/29H01B3/40
Inventor 王忠刚刘万双
Owner DALIAN UNIV OF TECH
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