Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof

A technology of LED encapsulation and silicone epoxy resin, applied in epoxy resin glue, epoxy resin coating, plastic/resin/wax insulator, etc. Excellent thermal stability and mechanical strength, meeting process and performance requirements
CN102199276AActive Publication Date: 2011-09-28DALIAN UNIV OF TECH
9 Cites 17 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
DALIAN UNIV OF TECH
Publication Date
2011-09-28

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention belongs to the technical field of light-emitting semiconductor device packaging materials, and relates to a silicon-containing epoxy resin composition for a light-emitting diode (LED) package and a preparation method thereof, in particular relating to a silicon-containing resin composition which has the advantages of low viscosity, ultraviolet curing, rapid low-temperature thermocuring, extremely high light transmittance and good thermal stability and mechanical strength and a preparation method thereof. The alicyclic epoxy resin packaging material is mainly characterized in that rapid curing is carried out at the low temperature, and the ultraviolet curing is adopted; before the curing, the viscosity is extremely low, and processing manufacturability is good; and after the curing, the light transmittance is extremely high, and the thermal stability and mechanical strength are good. The silicon-containing epoxy resin composition can be used for the LED packaging materials, and can also be used for paints, binders, integrated circuit package and epoxy vacuum pressure impregnated materials for motor insulation.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a packaging material for a light-emitting diode (LED), belonging to the field of packaging materials for light-emitting semiconductor devices. In particular, it relates to a silicon-containing epoxy resin composition which has low viscosity, can be cured by ultraviolet light, can also be thermally cured rapidly at a relatively low temperature, has extremely high light transmittance, excellent thermal stability and mechanical strength, and its Preparation. technical background

[0002] In recent years, light-emitting diodes (LEDs), as a new generation of solid light sources, have the characteristics of energy saving, environmental protection, long service life and precise light frequency emission compared with traditional incandescent and fluorescent light sources, and have been widely used in lighting, radiation light sources and displays and other fields. LED devices usually need to be packaged with a transparent polymer, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More