A high flame retardant high thermal conductivity composite material component and its manufacturing method

Abstract

The invention relates to a high-molecular composite material having performances of high heat conduction and high flame retardation, the invention is characterized in that the composite material does not contain any halogen or a non environmentally-friendly heavy metal fire retardant, the flame resistance is capable of reaching a UL94 V0 standard, simultaneously, the composite material has good heat conducting performance, the heat conduction coefficient is more than 0.5 W / m. DEG C. The composite material provided in the invention has good injection moulding performance, extruding performance and hot pressing performance. The composite material comprises the following basic components: 1) one or a plurality of metal hydroxides, such as aluminum hydroxide, magnesium hydroxide, zinc hydroxide and the like, wherein the weight content is 10-70%, 2) about 0.2%-60% of the weight content of expandable graphite flaky powder, the lamina size is more than 10 um, and the expandable coefficient is more than or equal to 20 times; 3) 15%-70% of the weight content of matrix resins, such as epoxy resin, organic silicone resin, phenolic resin, thermosetting polyester resin and thermoplastic resins of nylon 6, nylon 66, PBT, PP, HDP and the like. The composite material component of the invention can be directly used for radiators such as LED, electric appliances and electronic components, the heat can be radiated into colder environment so that the operating temperature of the electronic device can be reduced.

Description

technical field [0001] The present invention generally relates to a modified composite material, in particular to a composite material with high flame retardancy and high thermal conductivity which is easy to moldable or hot press or extrudable. Background technique [0002] With the high-speed and high-power operation of various electronic components, relatively high temperatures will be generated during the use and operation of the equipment, which may cause overheating of electronic components and damage their performance, resulting in reduced reliability, or even a substantial reduction lifetime of the entire system. Conventional engineering plastics, including thermoplastics and thermosetting plastics, have the advantages of good mechanical properties, chemical stability, and electrical insulation. They are widely used in daily electrical appliances and other fields, but because of their low thermal conductivity, they are poor conductors of heat. Not only can it not so...

AI Technical Summary

Problems solved by technology

[0007]2) The processing efficiency of metal parts is low. Generally, it needs to be cut or machined from bulk materials into the required complex shapes, requiring special machining equipment, and the unit cost Relatively high;

[0008]3) The density of metal materials is relatively high, usually greater than 2.4g / cm3, resulting in relatively bulky products;

[0009]4) Compared with plastic materials, metals are susceptible to corrosion;

[0010]5) Metal processing requires relatively high temperature and relatively large energy consumption

Publication No. CN101225234A describes a thermally conductive material with a fiber-reinforced or film-reinforced structure and a silicone resin as a matrix, which solves a type of interface heat conduction problem, and its material system does not have good flame retardancy

In addition, known thermally conductive composite materials often use a large amount of very expensive fillers, such as boron nitride with a content greater than 30% by weight, making the overall cost of the material very high

However, none of the above reports focused on the flame retardant performance of the material, and the overall performance of the material does not have high flame retardant characteristics.

And CN100497473 has described a kind of flame retardant molding composition that can be used for coating electronic device, adopts the epoxy resin system of organophosphorus salt flame retardant, can reach high flame retardant grade, but thermal conductivity is that conventional resin is thermally bad conductor

CN1605599A describes a class of high content of silica powder and flame retardants to obtain a class of epoxy resins with halogen-free and antimony-free high flame-retardant properties, and its thermal conductivity is typical of cured epoxy resin properties, low At 0.5 W / m.°C, the thermal conductivity of the material is still poor, so it is not suitable for the above-mentioned heat conduction applications

CN1238422C describes the use of a class of non-halogenated epoxy resins and phosphorus-containing compounds to obtain a class of halogen-free and antimony-free high flame-retardant compositions, which can be used for various types of laminates, but their thermal conductivity is still poor, not Applicable to the above occasions that require high thermal conductivity requirements

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