A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, carboxyl rubber adhesive, etc. It can solve the problems of unsatisfactory high-temperature bonding performance, unsatisfactory thermal oxidation stability, and unsuitability for large-area bonding. , to achieve high practical value, moderate viscosity and low brittleness

Inactive Publication Date: 2011-11-30
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyimide adhesives can generally be divided into the following categories: 1. Condensed polyimide adhesives, which are the earliest developed type of polyimide adhesives, but due to the formation of water molecules during the curing reaction of polyamic acid , is easy to cause defects, and is not suitable for large-area bonding; 2. Thermoplastic polyimide adhesive, which is a type of adhesive that can be heated and melted to bond materials, but its Tg is low, general

Method used

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  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof
  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof
  • A kind of high temperature resistant modified epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] Example 1

[0029] 0.1 mol (33.6 g) of 3,5-bis(4-aminophenoxy)benzoic acid and 300 mL of N,N-dimethylacetamide in a strong polar aprotic organic solvent were added to the polymerization flask and stirred Dissolve, add 0.1 mole (31.0 g) of 3,3',4,4'-tetracarboxylic acid diphenyl ether dianhydride powder, react at 0°C-10°C for 5-10 hours to obtain a transparent transparent PAA solution was added with 300 ml of toluene azeotropic dehydrating agent, followed by heating and azeotropic dehydration, until the azeotropic dehydration was complete, about 6 hours, then the reaction system was heated and concentrated to about 1 / 3, and the reaction system was stirred and precipitated in acetone at a high speed. The carboxyl group-containing polyimide CPI-1 powder was obtained, and the intrinsic viscosity was 0.62 dL / g (25° C., concentrated sulfuric acid).

[0030] 3,3',4,4'-tetracarboxylic acid benzophenone dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 2,2-bis[4-(3 ...

Example Embodiment

[0034] Example 2

[0035] TGDDM epoxy resin: 58.0 g

[0036] CTBN carboxy-terminated nitrile rubber: 6.75 g

[0037] CPI-4 powder: 1.0 g

[0038] Dicyandiamide curing agent: 4.0 g

[0039] 1,3-Diglycidyloxybenzene diluent: 30.25 g

[0040] The carboxyl group-containing polyimide modified epoxy adhesive is obtained by stirring the above components uniformly at room temperature. Its use effect can achieve the purpose of the invention.

Example Embodiment

[0041] Example 3

[0042] ES216 epoxy resin: 56.8 grams

[0043] CTBN carboxy-terminated nitrile rubber: 6.6 g

[0044] CPI-3 powder: 3.0 g

[0045] 2-Ethyl-4-methylimidazole curing agent: 1.8 g

[0046] Dicyandiamide curing agent: 2.15 grams

[0047] 2,2-bis(4-glycidyloxycyclohexyl)propane diluent: 15.2 g

[0048]Vinylcyclohexene Dioxide Diluent: 14.46 g

[0049] The carboxyl group-containing polyimide modified epoxy adhesive is obtained by stirring the above components uniformly at room temperature. Its use effect can achieve the purpose of the invention.

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Abstract

The invention relates to a high-temperature-resistant modified epoxy resin adhesive and a preparation method thereof. The high-temperature-resistant modified epoxy resin adhesive comprises the following formula components by weight percent: 55%-58% of epoxy resin, 1%-6% of carboxyl-containing polyimide powder, 3.8%-4% of curing agent, 28.7%-30.5% of diluent and 6.3%-6.8% of terminal carboxyl nitrile rubber. The formula components are mixed evenly to obtain the adhesive. According to the preparation method, carboxyl-containing polyimide is added in an epoxy resin substrate, thereby effectivelyimproving the strength of the adhesive and reducing the brittleness of the cured material of the adhesive; the preparation method has the advantages of simple process and low cost, and is convenient for operation; and the preparation method has a high practicable value for the development of the adhesive industry and has a wide application prospect in multiple fields, such as electronics, microelectronics and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin adhesives, in particular to a high-temperature-resistant modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin is an adhesive with good bonding performance, high bonding strength and wide bonding surface. It can be used with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) or non-metallic materials (such as Glass, ceramics, wood, plastic, etc.), and the bonding strength is very high, even exceeding the strength of the bonded material itself. In addition, it also has good processability and good stability. However, due to its low elongation, high brittleness, and poor fatigue resistance of the bonding parts, it is not suitable for use in structural parts. The brittleness of cured epoxy resin greatly limits its application. Therefore, improving the performance of epoxy resin adhesives has become one of the hotspots of s...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/08C09J113/00C08G73/10
Inventor 虞鑫海李恩徐亚新樊良子吴爽徐永芬
Owner DONGHUA UNIV
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