Preparation method of substrate-free thermal pad based on acrylic acid

Abstract

The invention discloses a preparation method of a substrate-free thermal pad based on acrylic acid. The preparation method comprises the following steps: mixing and pre-polymerizing a 2-ethylhexyl (meth)acrylate monomer and terpene resin to obtain a first prepolymer; mixing and pre-polymerizing a butyl (meth)acrylate monomer and / or ethylhexyl (meth)acrylate monomer and partial (meth)acrylic acid monomer to obtain a second prepolymer; mixing an N-hydroxymethyl acrylamide monomer and / or N-hydroxymethyl methyl acrylamide monomer, a methyl (meth)acrylate monomer, a styrene-butadiene block copolymer, the residual (meth)acrylic acid monomer, thermal fillers and a volatile organic solvent to obtain a monomer and thermal filler premix; mixing the first prepolymer, the second prepolymer and the monomer and thermal filler premix under vacuum to obtain a mixture; and carrying out polymerization after preparing the mixture into a pad. The thermal pad prepared by the method has the advantages of low thermal resistance, strong adhesiveness, good elasticity and easiness in removal after use.

Description

technical field [0001] The invention relates to an acrylic-based heat conduction patch, in particular to a method for preparing an acrylic-based substrate-free heat conduction patch. Background technique [0002] As electronic devices pack more powerful features into smaller components, rising temperatures can cause devices to slow down, devices to fail mid-operation, size and space constraints, and many other performance issues. Therefore, temperature control has become one of the crucial challenges in the design, that is, how to effectively remove more heat generated by higher power in the case of tight architecture and smaller and smaller operating space. Heat dissipation components are installed on the heating components to spread the heat. In order to conduct heat efficiently from a heat-generating component to a heat-radiating component, a pressure-sensitive adhesive sheet is generally used for fixing the heat-generating component and the heat-dissipating component. ...

AI Technical Summary

Problems solved by technology

Therefore, the thermal conductive material needs to have flexibility and adhesion to heat-generating parts and heat-dissipating parts, but too high viscosity will make it difficult to remove after use

[0003] There are mainly two types of thermal conductive sheets currently used, silicone and acrylic. No matter which one is used, how to ensure both good flexibility and excellent thermal conductivity, as well as good pressure sensitivity at working temperature Adhesiveness combined with good post-use removability is often a difficult balance

For example, some technologies use acrylate polymer micro-foaming method to improve flexibility. Although better shape-following performance is obtained, thermal resistance increases, thermal conductivity decreases, and high-temperature adhesive strength also decreases.

There is also a technology that introduces acrylic polymers with long-chain alkyl groups into thermally conductive materials to improve the ability to remove after use and obtain lower thermal resistance, but the resulting thermally conductive sheet has increased hardness and flexibility. decline

In addition, there are technologies that have obtained the balance of good thermal conductivity, hardness and adhesiveness of the material itself, but the elasticity is not enough. It needs to be compounded on a substrate with a certain strength to make a thermal conductive sheet, which in turn leads to an increase in thermal resistance.