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High-speed environment-friendly chemical copper plating solution

An electroless copper plating, environmental protection technology, applied in the field of electroless copper plating solution, can solve the problem of low copper plating speed of electroless copper plating solution, and achieve the effect of improving the chemical deposition speed

Inactive Publication Date: 2012-02-01
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention is to solve the technical problem of the low copper plating speed of the existing chemical copper plating solution, and provide a high-speed environment-friendly chemical copper plating solution

Method used

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  • High-speed environment-friendly chemical copper plating solution
  • High-speed environment-friendly chemical copper plating solution
  • High-speed environment-friendly chemical copper plating solution

Examples

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specific Embodiment approach 1

[0009] Specific embodiment one: the high-speed environment-friendly electroless copper plating solution of the present embodiment is made up of copper sulfate, sodium hypophosphite, carbamide hydrochloride, catalyst, combination complexing agent, combination stabilizer and water, sulfuric acid in the high-speed environment-friendly electroless copper plating solution The concentration of copper is 5g / L~15g / L, the concentration of sodium hypophosphite is 10g / L~40g / L, the concentration of carbamide hydrochloride is 1mg / L~20mg / L, and the concentration of catalyst is 0.5g / L~3g / L, the concentration of the combined complexing agent is 10g / L~40g / L, the concentration of the combined stabilizer is 5g / L~100mg / L, the pH value of the high-speed and environmentally friendly electroless copper plating solution is 9~14; the catalyst is nickel-containing , cobalt, and iron metal salts; the combined complexing agent is composed of aminodiacetic acid, dimethylhydantoin, and potassium sodium tar...

specific Embodiment approach 2

[0011] Embodiment 2: This embodiment differs from Embodiment 1 in that the concentration of copper sulfate is 8g / L˜12g / L. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0012] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the concentration of sodium hypophosphite is 12 g / L-35 g / L. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a high-speed environment-friendly chemical copper plating solution, which relates to a chemical copper plating solution and solves the technical problem of low copper plating speed of the conventional chemical copper plating solution. The high-speed environment-friendly chemical copper plating solution consists of copper sulfate, sodium hypophosphite, guanidine monohydrochloride, a catalyst, a combined coordination agent, a combined stabilizing agent and water, wherein the catalyst is metal salt containing nickel, cobalt and iron; the combined coordination agent consists of iminodiacetic acid, dimethyl hydantoin and potassium sodium tartrate, the mass ratio of the dimethyl hydantoin to the potassium sodium tartrate is 1:(2-3), and the mass ratio of the dimethyl hydantoin to the iminodiacetic acid is 1:(7-8); and the combined stabilizing agent consists of thiocarbamide and 2,2'-bipyridyl in the mass ratio of 1:(5-6). In the invention, the plating solution has the chemical deposition speed of 10 to 40 micrometers / hour, and can be used for chemically plating copper on the surfaces of matrixes such as printed circuit board holes, ceramics, plastics and the like.

Description

technical field [0001] The present invention relates to an electroless copper plating solution. Background technique [0002] Electroless copper plating solutions have been developed so far, and there are many types. The plating solution itself generally consists of copper salts, reducing agents, ligands, stabilizers, pH regulators and other additives. [0003] For the electroless copper plating solution, formaldehyde, sodium hypophosphite, sodium borohydride, dimethylaminoborane, hydrazine, etc. can be used as reducing agents for the electroless copper plating solution. Use potassium sodium tartrate, sodium citrate, sodium gluconate, triethanolamine, aminodiacetic acid, glycerin, glycine, EDTA disodium salt, dimethylhydantoin as ligands to prevent copper ions from being precipitated in the form of copper hydroxide . The most commonly used reducing agent is formaldehyde. However, formaldehyde is toxic and volatile, which has a serious impact on the health of workers and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
Inventor 黎德育李宁夏国锋朱振宇肖宁田栋郑振刘瑞卿
Owner HARBIN INST OF TECH
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