Process for preparing fluorine-containing high polymer high frequency circuit board material by hydrothermal method

A technology of high-frequency circuit boards and process methods, which is applied in the direction of circuit substrate materials, chemical instruments and methods, printed circuit components, etc., can solve the problems of high price and inability to meet the needs of high-frequency circuits, and achieve the goal of improving bonding performance Effect

Active Publication Date: 2014-03-26
YUNNAN INFINE NEO MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Fluorine-containing polymer high-frequency circuit boards are the hard cornerstone of the new generation of communication technology and information processing technology revolution, but domestic products cannot meet the needs of high-frequency circuits at all, and imported Rogers boards are expensive, so the research and development of fluorine-containing high-frequency circuit boards with independent intellectual property rights Polymer high-frequency circuit boards and new preparation technologies are of great significance to the domestic communication technology and information processing technology industries

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A. Mix 2.048L polytetrafluoroethylene emulsion (PTFE), 1.024L polyfluoroethylene propylene emulsion (FEP), and 3.926L tetrafluoroethylene-perfluoron-propyl vinyl ether copolymer emulsion (PFA) After mixing thoroughly, first add 897.4g zirconium nitrate Zr (NO 3 ) 4 and 434.4g calcium nitrate Ca (NO 3 ) 2 , then add 80g of diisopropylamine and 70g of isopropanol, and mix to obtain a mixed emulsion.

[0027] The concentration of the polytetrafluoroethylene emulsion (PTFE) is 50% (w), the concentration of the polyperfluoroethylene propylene emulsion (FEP) is 50% (w), tetrafluoroethylene-perfluoro-n-propyl vinyl ether copolymerization The concentration of the polymer emulsion (PFA) is 30% (w).

[0028] B. Put the mixed emulsion prepared in step A into a 10L high-pressure reactor, and the filling ratio is 70.5%. After heating up to 200°C at a heating rate of 1°C / min, react for 48 hours under a pressure of 4Mpa to obtain a polymer package Substances coated with nanoparti...

Embodiment 2

[0036] A. Mix 1.982L polytetrafluoroethylene emulsion (PTFE), 1.038L polyfluoroethylene propylene emulsion (FEP), and 3.980L tetrafluoroethylene-perfluoron-propyl vinyl ether copolymer emulsion (PFA) After mixing thoroughly, first add 1.1164kg of barium nitrate Ba (NO 3 ) 2 and 1.4538kg orthobutyl titanate C 16 h 36 o 4 Ti, add 90g diisopropylamine and 80g 3-isooctyl mercaptopropionate (IOMP) again, mix to obtain mixed emulsion.

[0037] The concentration of the polytetrafluoroethylene emulsion (PTFE) is 50% (w), the concentration of the polyperfluoroethylene propylene emulsion (FEP) is 50% (w), tetrafluoroethylene-perfluoro-n-propyl vinyl ether copolymerization The concentration of the polymer emulsion (PFA) is 30% (w).

[0038] B. Put the mixed emulsion prepared in step A into a 10L high-pressure reactor, and the filling ratio is 72.6%. After heating up to 180°C at a heating rate of 0.5°C / min, react for 36 hours under a pressure of 5Mpa to obtain a polymer package Subs...

Embodiment 3

[0046] A. Mix 1.920L polytetrafluoroethylene emulsion (PTFE), 1.047L polyfluoroethylene propylene emulsion (FEP), and 4.030L tetrafluoroethylene-perfluoron-propyl vinyl ether copolymer emulsion (PFA) After mixing thoroughly, first add 1.3802kg of calcium nitrate Ca (NO 3 ) 2 , 1.4305kg butyl orthotitanate C 16 h 36 o 4 Ti and 1.418kg zirconium nitrate Zr(NO 3 ) 4 , then add 100g of diisopropylamine and 90g of alkyl mercaptan, and mix to obtain a mixed emulsion.

[0047] The concentration of the polytetrafluoroethylene emulsion (PTFE) is 50% (w), the concentration of the polyperfluoroethylene propylene emulsion (FEP) is 50% (w), tetrafluoroethylene-perfluoro-n-propyl vinyl ether copolymerization The concentration of the polymer emulsion (PFA) is 30% (w).

[0048] B. Put the mixed emulsion prepared in step A into a 10L high-pressure reactor, and the filling ratio is 73.4%. After heating up to 220°C at a heating rate of 1.5°C / min, react for 24 hours under a pressure of 6.5...

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Abstract

The invention relates to a process for preparing a fluorine-containing high polymer high frequency circuit board material by a hydrothermal method, which belongs to the high frequency circuit substrate material field. The method comprises the following steps: uniformly mixing a polytetrafluoroethylene emulsion (PTFE), a fluoroethylenepropylene emulsion (FEP) and a polyfluoroalkoxy emulsion (PFA), adding salts, then adding a molecule guiding agent and a molecular weight regulator, uniformly mixing, adding in a reaction vessel for performing hydrothermal reaction to complete high-molecular secondary polymerization, acquiring a substance of dielectric inorganic compound nanoparticles coated with high-molecular, filtering, washing, drying, removing end group, sintering, rolling, cladding copper to obtain the high frequency circuit board material with different dielectric constants finally. The prepared high frequency circuit board is capable of satisfying each basic index of the high frequency circuit board, and has the advantages of adjustable dielectric constant, low loss, good mechanical property and the like; the dielectric constant can be adjusted by the circuit board according to the generated dielectric inorganic compound content, the range of the dielectric constant is 2-35 which can satisfy the different requirements.

Description

technical field [0001] The invention relates to a preparation method of a high-frequency circuit board material, in particular to a process method for preparing a fluorine-containing high-polymer high-frequency circuit board material by a hydrothermal method, and belongs to the field of high-frequency circuit board materials. Background technique [0002] Fluorinated high-frequency circuit boards refer to high-frequency copper-clad circuit boards produced by compounding fluorinated polymers with other materials, such as ceramics, glass fiber cloth, and non-woven fabrics. [0003] In the high-speed signal transmission lines of printed circuit board wires, they can be divided into two categories: one is high-frequency signal transmission electronic products, which are related to radio electromagnetic waves, which transmit signals with sine waves products, such as radar, radio and television, mobile phones, microwave communications, and optical fiber communications; the other i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/18C08L27/18C08L27/12H05K1/03
Inventor 周涛赵蜀春
Owner YUNNAN INFINE NEO MATERIAL
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