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Heat resistant polyamide composite and applications thereof

A technology of polyamide composition and polyamide resin, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor dimensional stability, large molding shrinkage rate and linear expansion rate, etc., and achieve low molding shrinkage rate and high formability Excellent, high initial whiteness effect

Active Publication Date: 2012-03-14
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This resin composition has high mechanical strength and high reflectance, but has a problem of poor dimensional stability due to high molding shrinkage and linear expansion
World Patent No. WO 03 / 085029 discloses polyamide resins for light-emitting diode reflective brackets using 1,9-diaminononane as the diamine component, but these polyamide resins cannot sufficiently prevent reflectivity during LED assembly and reflow processes. Problems degraded by heating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention is described below through specific embodiments, but is not limited thereto. In Examples and Comparative Examples, measurements and evaluations of various physical property values ​​were performed by the following methods.

[0038] [Number of terminal amino groups]

[0039] Take 0.5g of polymer, add 45ml of phenol and 3ml of anhydrous methanol, and heat to reflux. Using thymol blue as indicator, titrate the obtained sample solution with 0.01N hydrochloric acid aqueous solution to determine the number of terminal amino groups.

[0040] [number of terminal carboxyl groups]

[0041] Take 0.5g polymer, add o-cresol 50ml, reflux to dissolve, add 400μl formaldehyde solution quickly after cooling, and titrate the obtained sample solution with 0.1N potassium hydroxide methanol solution to determine the number of terminal carboxyl groups.

[0042] [relative viscosity η 相对 ]

[0043] Dissolve 0.5g of polyamide resin in 50ml of 96.5% concentrated sulfuric ...

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PUM

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Abstract

The invention discloses a heat resistant polyamide composite and applications thereof. The composite comprises the following components by weight percent: 40%-90% of heat resistant polyamide resin, 5%-35% of mineral fiber A, 0-35% of mineral filler B, 0.1%-1% of light stabilizer, 0.1%-1% of flow modifier and 0.1%-1% of antioxidant. The heat resistant polyamide resin of which concentration ratio of amino end groups to carboxyl end groups is 0.1-0.8, as well as the irregular glass fiber of which thickness-breadth ratio is 2-6, the mineral filler B and the flow modifier, is selected to prepare the heat resistant polyamide composite; and the composite has high original brightness and reflectivity, excellent heat resistance, good formability and good dimensional stability and can be used to prepare the reflection supports of light sources such as the backlights, vehicle headlights, instrument panels and illuminating implements of liquid crystal displays such as portable phones, computers, televisions and the like.

Description

technical field [0001] The invention relates to a heat-resistant polyamide composition and its application, in particular to a heat-resistant polyamide composition suitable for a reflective bracket for LEDs. Background technique [0002] LED is a light-emitting device formed by mounting an electroluminescent semiconductor module on a substrate (reflective bracket) and encapsulating it with epoxy resin or silica gel. It has various excellent characteristics, such as its small size and light weight. Therefore, it can be applied to various lighting equipment; it has a service life of up to 100,000 hours; its color is bright and conspicuous, it shows excellent visibility, and it consumes little power. In order to obtain the above-mentioned advantages, not only precision molding but also good heat resistance are required for the reflection bracket. Especially in terms of reflected light performance, it is required to obtain a stable high reflectivity, especially after the assemb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K13/04C08K7/14C08K7/10C08K7/08C08K3/22H01L33/56H01L33/60
CPCC08K3/22C08K7/04C08K7/14C08K2003/2241C08K2003/2296H01L33/60C08L77/06C08K7/08C08K7/10C08K13/04
Inventor 易庆锋姜苏俊麦杰鸿蒋智强龙杰明严峡宁凯军蔡彤旻
Owner KINGFA SCI & TECH CO LTD
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