The present application relates to the technical field of
LED packaging material, and particularly relates to a white resin composition for
LED packaging, a preparation method and application thereof. According to weight parts, the raw materials for preparing the resin composition include: 100 parts of
epoxy resin, 0.1-5 parts of first
antioxidant, 0.1-5 parts of second
antioxidant, 120-170 parts of curing agent, 0.1-5 parts of catalyst, 600-1300 parts of
inorganic filler, 150-600 parts of white
pigment, 1-10 parts of
release agent, and 0.1-2 parts of whitening agent; the first
antioxidant includes hindered
phenolic antioxidant; the second antioxidant includes
phosphorus-
hydrogen bond-containing
phosphinate antioxidant; and the
release agent includes polyether-modified dimethylsiloxane. The obtained composition has
high reflectivity, heat discoloration resistance and good de-runner workability, and can meet the packaging requirements of LED support.