Electrode for realizing ohmic contact with p-type ZnS (zinc sulfide) quasi-one-dimensional nanometer material and preparation method for electrode
A technology of nanomaterials and ohmic contacts, applied in nanotechnology, circuits, electrical components, etc., can solve problems such as low electron affinity, high surface state density, and difficulty in forming ohmic contacts, and achieve maturity, reliability, easy control, and preparation The effect of simple process
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Embodiment 1
[0024] The Ag-doped ZnS nanobelts synthesized by chemical vapor deposition were uniformly dispersed on SiO with a thickness of 300 nm. 2 On the n-type heavily doped Si wafer, the photoresist was evenly spin-coated, and the four-electrode electrode pattern was photoetched. figure 1 SEM image of the device.
[0025] Using the electron beam evaporation method, the condition is a vacuum of 1×10 -5 Pa, the deposition rate is 0.01nm per second, first deposit a 1nm thick Cu film on the photoetched electrode pattern, and then deposit a 60nm thick Au film to obtain a Cu / Au composite electrode. Using the KEITHLEY 4200 semiconductor characteristic test system, the Ag-doped ZnS nanoribbon volt-ampere characteristic curve is obtained through the two-electrode and four-electrode test methods, as shown in figure 2 shown, from figure 2 From the curve shown, it can be seen that the resistivity of the nanoribbon measured by the two methods is basically the same, and the calculated resistiv...
Embodiment 2
[0029] Ag-doped ZnS nanobelts synthesized by chemical vapor deposition method were uniformly dispersed on SiO with a thickness of 300 nm. 2 On the n-type heavily doped Si wafer, the photoresist was evenly spin-coated, and the four-electrode electrode pattern was photoetched.
[0030] Using the electron beam evaporation method, the condition is a vacuum of 1×10 -3 Pa, the deposition rate is 1nm per second. First deposit a 10nm thick Cu film on the photoetched electrode pattern, and then deposit a 60nm thick Au film to obtain a composite electrode of Cu(10nm) / Au(60nm). Using the KEITHLEY 4200 semiconductor characteristic test system, the Ag-doped ZnS nanoribbon volt-ampere characteristic curve is obtained through the two-electrode and four-electrode test methods, as shown in Figure 5 shown, from Figure 5 From the curve shown, it can be seen that the resistivity of the nanoribbon measured by the two methods is basically the same, and the calculated resistivity of the contact ...
Embodiment 3
[0034] Ag-doped ZnS nanobelts synthesized by chemical vapor deposition method were uniformly dispersed on SiO with a thickness of 300 nm. 2 On the n-type heavily doped Si wafer, the photoresist was evenly spin-coated, and the four-electrode electrode pattern was photoetched.
[0035] Using the electron beam evaporation method, the condition is a vacuum of 1×10 -4Pa, the deposition rate is 0.3nm per second, first deposit 4nm thick Cu on the photoetched electrode pattern, and then deposit 60nm thick Au to obtain a Cu(4nm) / Au(60nm) composite electrode. Using the KEITHLEY 4200 semiconductor characteristic test system, the Ag-doped ZnS nanoribbon volt-ampere characteristic curve is obtained by two-electrode and four-electrode test methods, such as Figure 8 As shown, it can be seen from the curve that the resistivity of the nanoribbon measured by the two methods is basically the same, and the calculated resistivity of the contact between the electrode and the ZnS material is 5 ord...
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