Cutting line solidified with mixed grinding materials of diamond and cubic boron nitride and method for manufacturing cutting line

Abstract

The invention provides a cutting line solidified with mixed grinding materials of diamond and cubic boron nitride and a method for manufacturing the cutting line. The cutting line comprises a metal steel wire solidified with grinding materials. The cutting line is characterized in that the grinding materials are the mixed grinding materials of diamond and cubic boron nitride, the mixed grinding materials of diamond and cubic boron nitride are solidified onto the metal steel line by means of electronickelling, the particle diameter of the grinding materials ranges from 5mum to 75mum, and the diameter of the diamond is not larger than 1.5mm. The method for manufacturing the cutting line includes removing oil and rust of the metal steel wire; solidifying the mixed grinding materials of diamond and cubic boron nitride onto the metal steel line by means of electronickelling; and forming the cutting line. A diamond grinding material is combined with a cubic boron nitride grinding material, the diamond and the cubic boron nitride are used for cutting alternately when the cutting line is used for cutting hard and brittle materials, and cutting capacity and cutting efficiency of the cutting line are improved. In addition, the cutting line can be more effectively applied to cutting off crystal silicon, slicing the crystal silicon and slicing sapphire by means of regulating the proportion of the diamond and the cubic boron nitride.

Description

technical field [0001] The invention belongs to the technical field of cutting processing, and relates to a cutting wire for superabrasives that can be widely used in the cutting processing of hard and brittle materials such as ceramic materials, silicon crystals, gemstones, etc. Abrasive cutting wire and method of making the same. Background technique [0002] With the development of solar photovoltaic industry and LED energy-saving technology, non-metal hard and brittle materials such as silicon crystal and sapphire are more and more widely used. Cutting is the key process of these hard and brittle materials, and its main technical requirements are: high cutting efficiency, low cutting cost, narrow slit, small surface damage, and no pollution. [0003] At present, electroplated diamond cutting wires or electroplated cubic boron nitride cutting wires are usually used to cut and process these hard and brittle materials. Both electroplated diamond cutting wires and electrop...

AI Technical Summary

Problems solved by technology

But they also have their own limitations. The main problem of the cutting line with diamond as the cutting abrasive is: due to the poor thermal stability of diamond, it is 600-850°C in the air, and the cutting slit is narrow and the cutting fluid is cooled. In the case of poor effect, due to the high temperature generated by high-speed grinding, it is easy to oxidize or graphitize the surface of the diamond abrasive, and the hardness of the diamond decreases, resulting in rapid wear, thereby reducing the service life of the diamond cutting wire

[0004] The main problem of the cutting line with cubic boron nitride as cutting abrasive is that although the thermal stability of cubic boron nitride abrasive is very good and can withstand the grinding temperature of 1200-1400 ℃, the hardness of cubic boron carbide is higher than that of diamond Low abrasive, which wears out faster when cutting harder materials such as sapphire

In addition, cubic boron nitride is easy to react with water at a higher grinding temperature, which accelerates the wear of cubic boron nitride abrasives

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