Preparation method of ceramic thermistor

Abstract

The invention discloses a method for preparing a ceramic thermister. The method comprises the following steps: firstly, more than two metal oxides of manganese, copper, silicon, cobalt, iron and nickel are intensively mixed to form ceramic oxide powder; secondly, the obtained ceramic oxide powder is mixed in glycerol and 1-10% PVA (Polyvinyl Acetate) to form a slurry which is then printed to a substrate through a screen printing technology to form a thin film, and the thin film is subjected to tabletting process and demoulding process after solvent is completely volatilized; and lastly, demoulded ceramic thermister flake blanks are sintered and compacted in 1000-1300 high temperature, so as to form a room temperature finished product through cooling. The method adopting the technical scheme has the remarkable advantages that the ceramic thermister flakes in micron thickness can be prepared by combining the screen printing technology, the ceramic tabletting technology and the sintering technology; on one hand, an effective method for batch preparation of sheet resistors is provided; and on the other hand, the sheet resistors have the advantages of controllable thickness, uniform density, good reliability and high finished product ratio.

Description

Technical field [0001] The invention relates to a novel manufacturing method of a ceramic thermistor. Background technique [0002] There are currently three completely different ways to prepare the fine structure of general ceramics. The first is the mechanical process or chemical etching process represented by cutting and pressing ceramics, the second is the injection and mold loss technology using ceramic powder processing, and the third is the method of physical and chemical growth. In general experiments, no matter what kind of cutting process (including blade cutting, ultrasonic cutting, laser cutting and lamination cutting, etc.) is adopted, it is already very difficult to realize the preparation of infrared detector ceramic thermistor sheets with a thickness of less than 20μm. Difficult; and the smaller the size, the lower the yield of processing. Although chemical etching processes (including dry etching and wet etching) can etch ceramic wafers, due to the anisotropy o...

AI Technical Summary

Problems solved by technology

In addition, it is easy to cause deformation of the required sheet when removing the mold

In addition, a film with a thickness of 10 μm can be obtained by various physical and chemical growth methods, but the morphology and properties are not ideal. The reason is that when the film thickness increases to more than 5 μm, it is easy to form cracks on the surface.

Although it is possible to achieve the preparation of 10μm thick flakes by direct compression, it cannot guarantee the thickness of the flakes and the uniformity of density distribution

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