Preparation method of high-heat-conduction thermal-plasticizing inorganic substance composition and heat-dissipation part manufactured by method

A technology of thermoplastic composition and inorganic substances, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of high price and impossibility of popularization, and achieve the effects of reducing production costs, ensuring production, and efficiently conducting heat

Active Publication Date: 2012-07-25
东莞市兆科电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Diamond is the best heat dissipation material in the natural heat dissipation material system - 1500W / m.k ~ 2500W / m.k is unmatched by other materials, but the only disadvantage is that it is expensive and cannot be popularized. The second is that graphite materials can replace it in the heat dissipation system Other heat dissipation materials, it is second only to CVD (Chemical Vapor Deposition) diamond with a thermal conductivity of 400W / m.k~1500W / m.k, which has a higher heat dissipation advantage than gold, silver, copper and other metal objects

Method used

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  • Preparation method of high-heat-conduction thermal-plasticizing inorganic substance composition and heat-dissipation part manufactured by method
  • Preparation method of high-heat-conduction thermal-plasticizing inorganic substance composition and heat-dissipation part manufactured by method

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specific Embodiment 1

[0040] The present invention discloses a highly thermally conductive inorganic thermoplastic composition, which is prepared from 51wt% of component A, 29wt% of polyester polyphenylene sulfide (polymer resin-plastic) and 20wt% of functional additives Component A contains 70wt% graphite (aspect ratio of 7000-100000), 10wt% graphite (aspect ratio of 1000-7000) and 20wt% graphite (aspect ratio of 10-1000), The functional additive component C contains 15wt% maleic anhydride grafted PS (Polystyrene, polystyrene plastic), 4wt% phosphorus flame retardant, 0.5wt% antioxidant 1010, 0.5wt% antioxidant Agent 168.

[0041] The production process is as follows: first, put the graphite in the above ingredients in a blast drying oven at 125°C for 2 hours, and put the polyphenylene sulfide in a blast drying oven at 120°C for 2 hours, and then put the weighed raw materials Put it in the internal mixer, turn on the temperature and mix for 5 minutes, then enter the twin-screw extruder for mixing...

specific Embodiment 2

[0043] A high thermal conductivity inorganic thermoplastic composition disclosed by the present invention is made of 51wt% of component A, 29wt% of polyester PET (polymer resin-plastic) and 20wt% of functional additives, wherein Component A contains 70wt% silicon carbide (the aspect ratio is 7000-100000), 10wt% silicon carbide (the aspect ratio is 1000-7000) and 20wt% silicon carbide (the aspect ratio is 10-1000), The functional auxiliary component C includes 9wt% of the halogen flame retardant decabromodiphenylethane, 3wt% of antimony trioxide, 6wt% of maleic anhydride grafted Poe (ethylene and octane with metallocene catalyst) ene to achieve in-situ polymerized thermoplastic elastomer), 1wt% oleamide, 1wt% antioxidant 245.

[0044] The production process is as follows: first put the silicon carbide in the above ingredients in a blast drying oven at 125°C for 5 hours, at the same time, put the polyester PET in a blast drying oven at 120°C for 5 hours, and then weigh the Put ...

specific Embodiment 3

[0046] A high thermal conductivity inorganic thermoplastic composition disclosed by the present invention is made of 88wt% component A, 10wt% polyester (polymer resin-plastic) and 2wt% functional additive component C , where component A contains 30wt% carbon fiber (aspect ratio of 7000-100000), 60wt% graphite (aspect ratio of 1000-7000) and 10wt% graphite (aspect ratio of 10-1000), where The functional auxiliary component C contains 0.5wt% of antioxidant 1010, 0.5wt% of antioxidant 626, and 1wt% of aluminate coupling agent.

[0047] The production process is as follows: first, put the graphite and carbon fiber in the above ingredients in a blast drying oven at 90°C for 8 hours, and at the same time, put the polyester in a blast drying oven at 105°C for 8 hours, and then weigh the The raw materials are put into the internal mixer and mixed at the temperature for 18 minutes, and then enter the twin-screw extruder. The carbon fiber is added through the side feeding part of the tw...

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Abstract

The invention discloses a preparation method of a high-heat-conduction thermal-plasticizing inorganic substance composition and a heat-dissipation part manufactured by the method. The high-heat-conduction thermal-plasticizing inorganic substance composition is prepared by a component A, a component B and a component C, wherein the component A consists of 51wt%-88wt% of one or more inorganic substances with high heat conduction performance, the component B consists of 10wt% to 38wt% of one or more plastics with good processing properties, and the component C consists of 2wt% to 20wt% of a function additive. The preparation method comprises the following steps that: firstly, the configured component A and the configured component B are dried; secondly, the dried components A, B and C are mixed or internally mixed and then are preprocessed to manufacture raw materials; the manufactured raw materials are fed into an extruder, and fibrous heat-conduction inorganic substances are added from a side feeding part to perform modified processing and then are extruded into strips through a multiple-hole die; and fourthly, the materials extruded into strips are subjected to die-surface sized dicing or brace cooling sized dicing, thereby manufacturing the high-heat-conduction thermal-plasticizing inorganic substance composition. According to the invention, the normal service life and work performance of a chip of an electronic product are ensured, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electronic appliances, more specifically, the invention relates to a kind of inorganic powder with high thermal conductivity and its fiber as the main body, composite thermoplastic plastic and functional additives to make the inorganic matter thermoplastic, so that it is configured into A method for preparing a thermally plasticized inorganic compound with high thermal conductivity and a heat dissipation component manufactured by the method. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) related products are regarded as one of the important products affecting the future, especially LED lamp lighting has made a significant contribution to energy conservation and environmental protection, but heat dissipation is a major factor that limits the lighting intensity and life of LED lamps. LED lamps are 80% more energy efficient than traditional incan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08L23/06C08L25/06C08L67/00C08L77/00C08L81/02C08L71/12C08L69/00C08L55/02C08K13/02C08K13/04C08K3/04C08K3/08C08K3/22C08K3/28C08K3/38C08K3/34C08K7/06H01L33/64
Inventor 廖志盛
Owner 东莞市兆科电子材料科技有限公司
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