Light-transparent heat insulating film, its preparation method and application

A thin film and hollow sphere technology, which is applied in building components, buildings, windows/doors, etc., can solve the problems of limited application, mechanical performance and light transmission performance, and achieve simple preparation process, no pollution of raw materials, and inhibition of inorganic-organic heterogeneity. The effect of phase interface

Active Publication Date: 2012-08-01
INST OF PROCESS ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In recent years, the development of organic-inorganic composite technology has provided us with new ideas, using the complementary advantages of organic and inorganic properties to achieve the goal, but the disadvantage is that the improvement of certain properties of composite materials is often obtained at the expense of other properties. , such as the thermal insulation performance of the material is improved while the mechanical performance and/or light transmission performance is greatly reduced, etc.
[0005] In the patent of publication number CN 101585954, the hollow spheres of monodisperse silica are dispersed in the matrix of high molecular polyme

Method used

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  • Light-transparent heat insulating film, its preparation method and application
  • Light-transparent heat insulating film, its preparation method and application
  • Light-transparent heat insulating film, its preparation method and application

Examples

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Effect test

Embodiment 1

[0043] 0.5g SiO with a hollow size of 375nm 2 Hollow sphere with a wall thickness of 40nm dispersed in 100mL toluene solution containing 10mL KH550, refluxed at 110°C for 5h, separated after the solution is cooled, washed with ethanol three times, and then dispersed to a solution containing 4mL hydrochloric acid (1M) In 20mL ethanol solution, stirred for 3h, separated and washed, and finally dried at 80℃ for later use. Disperse part of the modified hollow sphere powder particles into the aqueous polyurethane emulsion (mass fraction 28%) to make the modified hollow sphere powder particles The mass is 0.25% of the mass of the waterborne polyurethane, mechanically stirred until the emulsion is slightly sticky, coated on the surface of the flat glass and then cast into a film. After 12 hours, it is baked at 35°C for 24 hours to obtain a composite film product. After testing, the thermal conductivity of the film is 0.05419W / mK, and the visible light region transmittance is over 80%. ...

Embodiment 2

[0045] 0.5g SiO with a hollow size of 375nm 2 Spherical powder with a wall thickness of 40nm dispersed in 100mL toluene solution containing 10mL KH570, refluxed at 110°C for 5h, separated after cooling the solution, washed three times with ethanol, dried at 80°C, and then dispersed to 35mL ethanol , Add 1g methyl methacrylate and a little azoisobutyronitrile to N 2 Protected and refluxed at 75℃ for 12h. The product was washed with acetone three times, and finally dried at 80℃ for later use. Part of the modified hollow sphere powder was dispersed into the aqueous polyurethane emulsion (mass fraction 28%) to make the modified hollow sphere powder The mass of the particles is 0.25% of the mass of the water-based polyurethane, mechanically stirred until the emulsion is slightly sticky, and coated on the surface of the flat glass to be cast into a film. After 12 hours, the particles are dried at 35°C for 24 hours to obtain a composite film product. After testing, the thermal conducti...

Embodiment 3

[0047] Take SiO with a hollow size of 200nm and a wall thickness of 20nm 2 The hollow spherical particles are additives, and the others are the same as in Example 1. After testing, the thermal conductivity of the film is 0.05513W / mK, and the transmittance in the visible light region is over 80%.

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Abstract

The invention relates to a light-transparent heat insulating film, its preparation method and application. The light-transparent heat insulating film comprises resin matrix and modified SiO2 hollow microsphere particles uniformly dispersed in the resin matrix, wherein the modified SiO2 hollow microsphere particles are water-soluble positively charged submicron SiO2 hollow microsphere particles, and the resin matrix is waterborne polyurethane latex or acrylic resin emulsion. The invention further provides the preparation method and application of the light-transparent heat insulating film. According to the invention, the advantages of simple preparation process, easy obtainment of matrix material, low dose of additives, low cost, and no volatile organics are achieved; the green, environmental protection, and energy-saving requirements are satisfied; the obtained product has low thermal conductivity, high visible light transmissivity, and low ultraviolet light transmissivity, and can beused as ideal glass coating for building, automobile, aerospace and other industries with the effect of heat insulation and light transmittance.

Description

Technical field [0001] The invention relates to the technical field of composite polymer material application, in particular to a light-transmitting heat insulation film and a preparation method and application thereof. Background technique [0002] Petroleum and coal resources are becoming less and less, and the importance of energy saving and emission reduction has received wide attention. Reducing production energy consumption and reducing waste gas emissions is a principle that each of our companies and even everyone must follow. Building energy accounts for more than 30% of total energy consumption. Building energy conservation is therefore an important part of energy saving and emission reduction. An important part of building energy consumption is the energy consumption caused by cooling and cooling in summer and heating and insulation in winter, in order to reduce Building energy consumption, in addition to the need to improve energy conversion equipment, the most import...

Claims

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Application Information

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IPC IPC(8): C08L75/04C08L33/00C08K9/06C08K9/04C08K7/26C08J5/18C03C17/32E06B3/30
Inventor 陈运法廖玉超武晓峰岳仁亮
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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