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Method for fabricating microlens array beam shaper by femtosecond laser enhanced chemical etching

A microlens array and femtosecond laser technology, applied in the field of femtosecond laser Wiener processing and laser optics, can solve the problem of difficult to achieve high filling ratio microlens array processing, not suitable for batch preparation of large-area microlens arrays, long-term response etc. to achieve high-efficiency beam shaping, good surface morphology, and high processing efficiency

Active Publication Date: 2014-10-15
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in comparison, the microlens array is simple to process, easy to operate, and relatively easy to implement.
[0003] Previous microlens array processing methods include photoresist melting method, ion exchange method, microjet printing method, laser direct writing technology, etc. Among them, photoresist melting method is difficult to realize the processing of microlens array with high filling ratio; ion exchange method It is usually used in the preparation of two-dimensional planar microlens arrays, and this process requires long-term reaction in a high-temperature environment; the microjet printing method is similar to the photoresist melting method, and the microlens arrays produced by it have a difficult fill factor. More than 80%; laser direct writing technology can prepare microlens arrays of any shape, but its processing materials are limited to photoresist, and the processing efficiency is low, which is not suitable for batch preparation of large-area microlens arrays

Method used

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  • Method for fabricating microlens array beam shaper by femtosecond laser enhanced chemical etching
  • Method for fabricating microlens array beam shaper by femtosecond laser enhanced chemical etching
  • Method for fabricating microlens array beam shaper by femtosecond laser enhanced chemical etching

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Experimental program
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Effect test

Embodiment 1

[0027] The specific implementation steps of this embodiment are as follows:

[0028] Step 1. Select quartz glass as the sample material, and the size of the quartz glass sample is 15×15×2mm 3 ;

[0029] Step 2. Select an ultrashort pulse laser with a pulse width of 30 fs and a wavelength of 800 nm, focus it on the surface of a quartz glass sample fixed on a three-dimensional precision mobile platform through a microscopic objective lens, and the numerical aperture of the microscopic objective lens is 0.5;

[0030] Step three, refer to figure 2 a, Adjust the arrangement of the pulse action points according to the desired microlens array shape. The moving speed of the three-dimensional precision mobile platform is 3000um / s, and the arrangement of the pulse action points is a rectangle. The black solid circles represent the pulse action points. The distance between adjacent pulse action points is as follows figure 2 Shown in a are L x =40um,L y =60um, control femtosecond l...

Embodiment 2

[0034] The specific implementation steps of this embodiment are as follows:

[0035] Step 1. Select quartz glass as the sample material, and the size of the quartz glass sample is 15×15×1mm 3 ;

[0036] Step 2. Select an ultrashort pulse laser with a pulse width of 50 fs and a wavelength of 800 nm, focus it on the surface of a quartz glass sample fixed on a three-dimensional precision mobile platform through a microscopic objective lens, and the numerical aperture of the microscopic objective lens is 0.5;

[0037] Step three, refer to figure 2 b. Adjust the arrangement of the pulse action points according to the desired microlens array shape. The moving speed of the three-dimensional precision mobile platform is 4000um / s, and the arrangement of the pulse action points is a triangle. The black solid circles represent the pulse action points. The distance between adjacent pulse action points is as follows figure 2 Shown as L in b x =60um, control femtosecond laser single p...

Embodiment 3

[0041] The specific implementation steps of this embodiment are as follows:

[0042] Step 1. Select quartz glass as the sample material; the size of the quartz glass sample is 15×15×1mm 3 ;

[0043] Step 2. Select an ultrashort pulse laser with a pulse width of 50 fs and a wavelength of 800 nm, focus it on the surface of a quartz glass sample fixed on a three-dimensional precision mobile platform through a microscopic objective lens, and the numerical aperture of the microscopic objective lens is 0.4;

[0044] Step three, refer to figure 2 c. Adjust the arrangement of the pulse action points according to the desired microlens array shape. The moving speed of the three-dimensional precision mobile platform is 4000um / s, and the arrangement of the pulse action points is hexagonal. The black solid circle represents the pulse action point , the distance between adjacent pulse action points is as follows figure 2 Shown as L in c x =60um, control femtosecond laser single pulse en...

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Abstract

The invention discloses a method for preparing a microlens array beam shaper through femtosecond laser reinforced chemical etching. The method comprises the steps of: selecting quartz glass a sample material, carrying out surface processing through femtosecond laser to obtain a microlens array dead hole; and placing a hydrogen fluoride solution in the processed microlens array dead hole for carrying out auxiliary etching to complete the preparation of the microlens array beam shaper. A microlens array is prepared by using femtosecond laser reinforced chemical etching, and the advantage of controllable morphology of the prepared microlens array is obtained, wherein the morphology of a microlens can be controlled through reasonable arrangement of laser pulse acting points, and the focus length of the microlens can be controlled through a laser parameter. The method can realize high-efficiency processing of a high packing ratio and large-area microlens array; and the prepared microlens array can simply and conveniently realize space light intensity uniform distribution of a gauss beam.

Description

technical field [0001] The invention relates to the fields of femtosecond laser Wiener processing and laser optics, in particular to a method for preparing a microlens array beam shaper by using femtosecond laser enhanced chemical etching. The beam energy is redistributed to be as uniform as possible. Background technique [0002] In the practical application field of laser, such as laser processing of materials, laser-driven inertial confinement nuclear fusion, etc., it is often required to have a laser beam with uniform spatial distribution of light intensity, but usually the energy directly emitted from the laser is in a Gaussian distribution. The Gaussian beam, so the laser beam shaping device is needed to shape the intensity of the Gaussian beam to a uniform distribution. At present, there are many methods of beam shaping, such as aspheric lens group shaping system, microlens array shaping system, diffractive optical element shaping system and liquid crystal spatial li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B27/09
Inventor 杨青陈烽卢静赵玉龙王先华刘贺炜
Owner XI AN JIAOTONG UNIV
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