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Heating solidification type dual-component epoxy pouring sealant and preparation method thereof

A technology for heating, curing and potting glue, applied in the field of potting glue, can solve the problems of increasing the use process, less inorganic filler content, and filler sinking, etc., and achieves the effect of prolonging the storage period, improving thermal conductivity, and being difficult to deposit.

Active Publication Date: 2013-01-09
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The added substances mainly include inorganic fillers, but if the content of inorganic fillers is too much, the viscosity of the epoxy potting adhesive will increase greatly, thereby affecting its fluidity and permeability; in addition, the storage period of the epoxy potting adhesive will be shortened, resulting in a large amount of fillers. Sinking, increase the use process
The content of inorganic filler is small, and the overall performance of epoxy potting adhesive is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0055] The invention provides a method for preparing a heat-curable two-component epoxy potting adhesive, which comprises the following steps:

[0056] 70-130 parts by weight of epoxy resin, 0-25 parts by weight of diluent, 0-15 parts by weight of toughening agent, 0-3 parts by weight of silicone defoamer, 0-3 parts by weight of pigment and 150-280 parts by weight of the first inorganic filler are mixed to obtain component A;

[0057] Mixing 70-150 parts by weight of acid anhydride, 1-15 parts by weight of wetting and dispersing agent and 150-280 parts by weight of the second inorganic filler to obtain component B;

[0058] Heat component A and component B separately, and after mixing evenly, a heat-curable two-component epoxy potting adhesive is obtained.

[0059] According to the present invention, first, component A is prepared from epoxy resin, first inorganic filler, diluent, toughening agent, silicone defoamer and pigment.

[0060] According to the present invention, i...

Embodiment 1

[0079] Mix 120 grams of bisphenol A type epoxy resin E-51, 15 grams of 1,4-butanediol diglycidyl ether, 8 grams of polyurethane toughening agent and 1.5 grams of silicone defoamer and stir until uniform, the mixer speed The stirring time is 2000 rpm and 30 minutes. Then add 2.5 grams of carbon black and 190 grams of active silicon micropowder while stirring, continue to stir for 30 minutes, after mixing evenly, vacuum defoaming to obtain A component. Store component A in an airtight, dry environment with a temperature lower than 25°C.

[0080]97 grams of methyl hexahydrophthalic anhydride and 15 grams of wetting and dispersing agent were mixed and stirred at a stirring speed of 1500 rpm for 15 minutes until uniformly mixed. Then add 200 grams of active silica powder while stirring, continue stirring for 30 minutes, after mixing evenly, vacuum defoaming to obtain component B. Store component B in an airtight, dry environment with a temperature lower than 25°C.

[0081] Take ...

Embodiment 2

[0084] Mix 50 grams of bisphenol A type epoxy resin E-51, 70 grams of bisphenol F epoxy resin Epikate-235, 15 grams of 1,4-butanediol diglycidyl ether, 18 grams of polyurethane toughener and 1.5 grams of organic The silicon defoamer is mixed and stirred until uniform, the speed of the stirrer is 2000 rpm, and the stirring time is 30 minutes. Then add 2 grams of carbon black, 65 grams of active silica powder, 50 grams of calcium carbonate and 60 grams of active aluminum hydroxide while stirring, and continue stirring for 30 minutes. After mixing evenly, vacuum defoaming to obtain component A. Store component A in an airtight, dry environment with a temperature lower than 25°C.

[0085] 98 grams of methyl tetrahydrophthalic anhydride and 15 grams of wetting and dispersing agent were mixed and stirred at a stirring speed of 1500 rpm for 15 minutes until uniformly mixed. Then add 100 grams of active silicon micropowder and 100 grams of calcium carbonate while stirring, continue s...

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Abstract

The invention provides a heating solidification type dual-component epoxy pouring sealant which comprises an A component and a B component. The A component comprises the following ingredients of, by weight, 70-130 parts of an epoxy resin, 150-280 parts of a first inorganic filler, 0-25 parts of a dilution agent, 0-15 parts of a toughening agent, 0-3 parts of an organosilicon antifoaming agent and 0-3 parts of pigment; and the B component comprises the following ingredients of, by weight, 70-150 parts of acid anhydride, 150-280 parts of a second inorganic filler and 0-15 parts of a wetting dispersing agent. The preparation method of the sealant includes respectively preparing the A component and the B component, then, respectively heating the A component and the B component, and evenly mixing the A component and the B component to obtain the heating solidification type dual-component epoxy pouring sealant. The heating solidification type dual-component epoxy pouring sealant is good in comprehensive performance and fluidity and long in storage period.

Description

technical field [0001] The invention relates to the field of potting glue, in particular to a heating-curing two-component epoxy potting glue and a preparation method thereof. Background technique [0002] Epoxy resin refers to organic polymer compounds containing two or more epoxy groups in the molecule. Epoxy resin has excellent dielectric properties, mechanical properties, adhesive properties and corrosion resistance, small curing shrinkage rate and linear expansion coefficient, stable size of the cured product, good manufacturability, and excellent comprehensive performance. Due to the flexibility and diversity of formulation design of epoxy resin materials, it is widely used in the field of electronic devices. [0003] The epoxy potting adhesive prepared with epoxy resin as the main component can effectively strengthen the integrity of electronic devices, improve the resistance of electronic devices to external shocks and vibrations, and maintain the insulation of elec...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/04C09J163/00C09J11/04C09K3/10
Inventor 曾亮黄友根李鸿岩鹿芝蒋大伟彭勇殿李继鲁赵洪涛
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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