Super-hard abrasive brazing tool distributing technology
A technology of superhard abrasives and fabrics, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of difficult uniformity of brushing, uneven thickness, poor adaptability, etc., to achieve small influence of artificial factors, stable quality, Produce consistent results
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Embodiment 1
[0059] Take a conventional brazed diamond saw blade cloth with an outer diameter of 110mm as an example. The specific fabric process is as follows:
[0060] ① Select the base material of the saw blade as 65Mn, stamp the base, and chamfer.
[0061] ② Clean the surface of the saw blade substrate to ensure that there is no grease and impurities.
[0062] ③ Brush thick adhesive with a width of 5mm on the outer end of the saw blade. The adhesive is pressure sensitive adhesive.
[0063] ④ Sprinkle diamond abrasives. The diamond particle size is 50 / 60 mesh.
[0064] ⑤ Sprinkle the mixed particle size solder with a particle size of 50 mesh to 80 mesh. The solder is a nickel-based solder whose composition is nickel-chromium-iron-silicon. The content percentage is: nickel 84%~85%, chromium 4%~5%, iron 6.5%~7.5%, silicon 4%~5%.
[0065] ⑥ Spray thin adhesive on the cloth area of the saw blade to fix the diamond and solder.
[0066] ⑦ Clean the surface of the semi-finished produ...
Embodiment 2
[0069] Take copper-based solder brazing special-shaped curved surface hand grinding wheel F20 as an example. The specific fabric process is as follows:
[0070] ① Process the F20 substrate of the special-shaped curved surface hand grinding wheel according to the requirements.
[0071] ② Clean the surface of the grinding wheel to ensure that there is no grease and impurities.
[0072] ③ Evenly brush a layer of thick adhesive on the outer surface of the grinding wheel. It is prepared by pressure-sensitive adhesive and acetone in a volume ratio of 2:3.
[0073] ④ Sprinkle the diamond abrasive with a particle size of 40 / 50 mesh.
[0074] ⑤ Copper-based solder with a particle size of 60 mesh, and its thickness can reach the height of diamond. Copper-based solder, its composition is copper-tin-titanium, the content percentage is: copper 60%~65%, tin 20%~27%, titanium 16%~26%.
[0075] ⑥ Spray thin adhesive to fix. It is prepared by pressure-sensitive adhesive and acetone in a ...
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