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Composite hybrid organic silicon LED (Light Emitting Diode) packaging material, preparation method and applications thereof

A technology of LED packaging and silicone, applied in electrical components, circuits, semiconductor devices, etc., can solve the optical properties such as poor uniformity of silicone packaging materials, insufficient blending, transmittance and refractive index of silicone packaging materials It can solve the problems of non-uniform dispersion, increase cross-linking density, and enhance mechanical properties.

Active Publication Date: 2013-03-27
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Doping nano-silica or titanium dioxide into organic silicon packaging materials by chemical or physical blending alone can improve the mechanical properties and UV aging resistance of LED packaging materials, but with the increase of the amount of nanoparticles , Insufficient blending of nanoparticles and other raw materials leads to the deterioration of the uniformity of the silicone packaging material, which significantly reduces the optical properties of the silicone packaging material such as transmittance and refractive index

Method used

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  • Composite hybrid organic silicon LED (Light Emitting Diode) packaging material, preparation method and applications thereof
  • Composite hybrid organic silicon LED (Light Emitting Diode) packaging material, preparation method and applications thereof
  • Composite hybrid organic silicon LED (Light Emitting Diode) packaging material, preparation method and applications thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] (1) Mix 120g of diphenyldimethoxysilane, 25g of γ-(methacryloxy)propyltrimethoxysilane, 6g of nano-silica (120±10nm), 0.80g of dibutyldilauric acid Put tin, 10 g of distilled water and 150 g of tetrahydrofuran into a reactor equipped with a stirrer, a condensing reflux tube and a thermometer, mix and stir evenly, then condense and reflux at 50°C for 9 hours, and remove water and tetrahydrofuran by rotary evaporation at 80°C for 1 hour to obtain Silica phenyl silicone complex hybrid with a vinyl content of 0.57%;

[0027] (2) Take 100 g of the silica phenyl organosilicon complex hybrid in step (1), 0.20 mg of dichlorobis(triphenylphosphine) ((PPh 3 ) 2 Cl 2 ) coordinated platinum complex, 1.60g of hydrogen-containing organopolysiloxane (type 202, industrial grade, hydrogen content 1.5%) were placed in an open container, stirred evenly at room temperature, and then placed at 90°C After reacting under vacuum for 5 hours, the composite hybrid silicone LED packaging mater...

Embodiment 2

[0029] (1) Mix 15g of phenyltrimethoxysilane, 1.50g of vinyltriethoxysilane, 0.91g of nano silicon dioxide (7~40nm), 0.10g of dibutyl tin diacetate, 1.50g of distilled water and 20g of toluene Put it into a reactor equipped with a stirrer, a condensing reflux tube and a thermometer, mix and stir evenly, then condense and reflux for 6 hours at 65°C, and remove water and toluene by rotary evaporation at 70°C for 2 hours to obtain vinyl content of 1.90%. Silica phenyl silicone complex hybrid;

[0030] (2) Take 10g of silica phenyl organosilicon complex hybrid in step (1), 10g of vinyl polysiloxane (SiVi-300, 300mPa s, vinyl mole fraction is 1.92%, Zhejiang Xinan Chemical Industry Co., Ltd. company), 0.01mg tetrahydrofuran as solvent H 2 PtCl 6 (The mass fraction of the solute is 0.2%) and 9.00g of hydrogen-containing polysiloxane (202 type, industrial grade, hydrogen content of 0.18%) are placed in an open container, stirred evenly at room temperature, and reacted under vacuum ...

Embodiment 3

[0032] (1) Mix 75.50g of diphenyldiethoxysilane, 21.50g of vinyl tri-tert-butoxysilane, 5.95g of nano-silica (400±10nm), 0.40g of stannous octoate, 7.2g of distilled water and 110g of n- Put butanol into a reactor equipped with a stirrer, a condensing reflux pipe and a thermometer, mix and stir evenly, then condense and reflux at 60°C for 7 hours, and remove water and n-butanol by rotary evaporation at 85°C for 30 minutes to obtain a vinyl content of 2.75% silica phenyl silicone complex hybrid;

[0033] (2) Take 50g of silica phenyl organosilicon composite hybrid in step (1), 10g of vinyl polysiloxane (SiVi-1000, 1000mPa·s, vinyl mole fraction is 0.8%, Zhejiang Xinan Chemical Industry Co., Ltd. company), 0.06mg isopropanol as solvent H 2 PtCl 6 (The mass fraction of the solute is 0.3%) and 4.20g of hydrogen-containing polysiloxane (202 type, industrial grade, hydrogen content of 0.54%) are placed in an open container, stirred evenly at room temperature, and reacted under vac...

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Abstract

The invention discloses a composite hybrid organic silicon LED (Light Emitting Diode) packaging material, preparation method and applications thereof. The composite hybrid organic silicon LED packaging material is prepared by uniformly mixing 10-100 parts of silicon dioxide phenyl organic silicon composite hybrid, 0-48 parts of vinyl polysiloxane, 0.00001-0.0002 part of catalyst A and 1.6-32 parts of hydrogen-containing polysiloxane, and reacting for 1-8 hours under the vacuum condition of 80-110 DEG C. According to the composite hybrid organic silicon LED packaging material provided by the invention, not only is the preparation method simple, the raw materials are environment-friendly and easily available, and the packaging material has the advantages of high refractive index, high transmissivity, and high mechanical strength to meet the requirements of LED packaging. The prepared composite hybrid organic silicon LED packaging material is mainly used for high-power LED and LED with white light.

Description

technical field [0001] The invention relates to an LED packaging material, in particular to a composite hybrid organosilicon LED packaging material and a preparation method and application thereof. Background technique [0002] LED packaging materials include epoxy resin, polycarbonate, polymethyl methacrylate, silicone and other high-transparency materials, among which polycarbonate and polymethyl methacrylate are used as LED outer lens materials, epoxy and organic Silicon is mainly used as an encapsulation material. Epoxy resin has become the mainstream material for LED packaging because of its excellent adhesion, electrical insulation, sealing and dielectric properties, relatively low cost, flexible formula, and high production efficiency. However, with the continuous improvement of LED power and the development of white LEDs, higher requirements are placed on LED packaging materials, such as high refractive index, high transmittance, high thermal conductivity, UV and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K3/36C08G77/20C08G77/06H01L33/56
Inventor 刘伟区韩敏健闫振龙
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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