Preparation method of micro-nanometer mixed stuffing/liquid silicon rubber heat-conductive composite material

A heat-conducting composite material and liquid silicone rubber technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems that affect the improvement of the thermal conductivity of materials, the limited amount of heat-conducting fillers, and the fillers are prone to agglomeration and settlement.

Inactive Publication Date: 2013-04-03
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Silicone rubber is a special synthetic rubber with silicon-oxygen bonds as the main chain, while ordinary rubber has a structure of carbon-carbon bonds as the main chain. Due to its special structure, it has low temperature resistance, high temperature resistance, and High voltage, radiation resistance, ozone aging resistance, physiological inertness, weather resistance, high air permeability, and excellent chemical inertness to lubricating oil and other media. In addition, the operating temperature range (-50°C~300°C) is wide and the elasticity is good , Good resistance to tracking and electric erosion, especially after its surface is polluted, it still has good hydrophobicity; but the thermal conductivity of unfilled silicone rubber is very poor, and the thermal conductivity is generally only 0.165 W/(m.k), The thermal conductivity can be improved by filling with thermally conductive fillers. Th

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Weigh 1.16 parts by mass of multi-walled carbon nanotubes with an average tube diameter of 30 nm and an average tube length of 50 μm after high-temperature drying and add them to 100 parts by mass of component A of two-component liquid silicone rubber and stir them for 8 hours to make them evenly mixed ;

[0019] Add 10 parts by mass of alumina with an average particle size of 3 μm dried at high temperature to the above mixed solution and stir for 10 hours to make it evenly mixed;

[0020] Add 5 parts by mass of component B of the two-component liquid silicone rubber to the above mixture, and stir rapidly to make it evenly mixed.

[0021] The mixed solution was injected into the mold, a 30V DC electric field was applied with an electric field strength of 2000V / cm, and it was cured at room temperature for 24 hours. After drying, a thermally conductive silicone rubber composite material was obtained.

[0022] The thermal conductivity of pure silicone rubber and sample 1 ...

Embodiment 2

[0024] Weigh 2 parts by mass of electrospun metal nanowires with an average diameter of 200nm after high-temperature drying and add them to 100 parts by mass of component A of the two-component liquid silicone rubber and fully stir for 10 hours to make them evenly mixed;

[0025] Add 10 parts by mass of high-temperature dried zinc oxide with an average particle size of 10 μm to the above mixed solution and stir for 5 hours to make it evenly mixed;

[0026] Add 6 parts by mass of component B of the two-component liquid silicone rubber into the above mixture, and stir rapidly to make it evenly mixed.

[0027] The mixed solution was injected into the mold, and an AC electric field with a voltage of 120V and a frequency of 50Hz was applied with an electric field strength of 4000V / cm, cured at room temperature for 24 hours, and dried to obtain a thermally conductive silicone rubber composite material.

[0028] The thermal conductivity of sample 2 was tested with a thermal conductiv...

Embodiment 3

[0030] Weigh 3 parts by mass of multi-walled carbon nanotubes with an average tube diameter of 30 nm and an average tube length of 50 μm dried at high temperature, and add them to 100 parts by mass of component A of two-component liquid silicone rubber and stir well for 10 hours to make them evenly mixed ;

[0031] Add 15 parts by mass of silicon nitride with an average particle size of 10 μm dried at high temperature to the above mixed solution and stir for 10 hours to make it evenly mixed;

[0032] Add 8 parts by mass of component B of the two-component liquid silicone rubber to the above mixture, and stir rapidly to make it evenly mixed.

[0033] The mixed solution was injected into the mold, and a 50V DC electric field was applied with an electric field strength of 6000V / cm, cured at room temperature for 24 hours, and dried to obtain a thermally conductive silicone rubber composite material.

[0034] The thermal conductivity of sample 3 was tested with a thermal conductiv...

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PUM

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Abstract

The invention discloses a preparation method of a micro-nanometer mixed stuffing/liquid silicon rubber heat-conductive composite material. The preparation method is characterized in that the solidified two-component liquid silicon rubber is taken as a substrate; micro-scale heating conductive particles are taken as connecting points; under an external electric field action, the nanofiber heat conductive stuffing with high length-diameter ratio is oriented to a connecting line, so that the effective heat conductive chain is formed in the silicon rubber substrate, and the heat conductive silicon rubber composite material with anisotropic heat conduction is prepared. The high heat-conductive composite material is excellent in the heat-conductive performance, low in the heat-conductive stuffing dosage, good in mechanical property, simple in the preparation technology and low in cost.

Description

technical field [0001] The invention relates to a method for preparing a heat-conducting polymer composite material. Specifically, the cured liquid silicone rubber is used as a matrix, and micron-sized heat-conducting particles are used as connection points. line, thereby forming an effective heat conduction chain in the silicone rubber matrix, and preparing a thermally conductive silicone rubber composite material with anisotropic thermal conductivity, which belongs to the technical field of polymer composite materials. Background technique [0002] With the rapid development of microelectronics integration technology, the assembly density has increased rapidly, the operating frequency of electronic components has increased sharply, and the heat generated has also increased; for every 2°C increase in the temperature of electronic components, their reliability will decrease by 10%, 50 The life at ℃ is only one-sixth of that at 25℃ (Macromolecules, 1996, 29 (10): 3376-3383); ...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K7/00C08K3/04C08K7/06C08K3/22C08K3/34C08K3/28C08K3/38C08J3/28C09K5/14
Inventor 朱琳沈湘黔马洁谢冬生
Owner JIANGSU UNIV
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