Oligomer, polyimide film/fiber containing oligomer and preparation method of polyimide film/fiber containing oligomer

Abstract

The invention discloses an oligomer with the following structure as shown in the specification, wherein R represents any one of the following structures as shown in the specification, and the molecule of the oligomer is respectively 392, 408 and 424. The invention further discloses polyimide film / fiber containing the oligomer and a preparation method of the polyimide film / fiber containing oligomer. The structure of the oligomer not only comprises an amido bond, and the molecular weight is small, so that the oligomer can enter spaces among polyimide macromolecular chains and forms a hydrogen bond, the mutual action force of polyimide macromolecular chains is enhanced, the degree of orientation is increased, the mechanical property and the thermal tensile property of the obtained film / fiber are improved, the heat resistance is not influenced, and the contradiction between the high performance and the excellent machinability of materials is also solved. The preparation method disclosed by the invention is mature and the industrial production is easy to carry out.

Description

technical field [0001] The invention belongs to the technical field of oligomer and polyimide polymer materials and their preparation, and in particular relates to an oligomer and a polyimide film or fiber containing an oligomer and a preparation method thereof. Background technique [0002] Polyimide (Polyimide) is a class of high-performance polymers characterized by imide rings. It has good chemical stability, thermal stability, mechanical strength, electrical properties and radiation resistance, and is widely used in Electronic appliances, aerospace and other high-tech fields. At present, high-performance polyimide materials mainly include polyimide films and fibers. Since general high-performance polyimide materials are insoluble and infusible, the preparation process of the obtained film or fiber usually adopts a two-step method, that is, firstly, the solution is used to synthesize the polyamic acid stock solution of the polyimide precursor, and then the polyamic acid...

AI Technical Summary

Problems solved by technology

For example, CN101200822 discloses that by molecular design, a benzimidazole-containing structure is introduced into the polyimide macromolecular chain structure unit, and there are still compounds that can be combined with the imide ring after thermal imidization of the macromolecular chain structure. The carbonyl group forms the hydrogen proton of the intermolecular hydrogen bond to enhance the interaction force between the polyimide macromolecular chains, thereby significantly improving the tensile strength of the polyimide fiber (increased by 67%), but unfortunately Not only did it lead to a sharp decline in its thermal stretchability, but the elongation at break of the fiber also dropped by 34%.

Longbo Luo et al. (J Polym Res (2012) 19:9783) disclose the introduction of diamine containing amide groups in pyromellitic dianhydride / 4,4'-diaminodiphenyl ether diamine polyimide system Monomer 4,4-diaminobenzoanilide, but the results show that although the tensile strength of the polyimide film has increased by 85%, the elongation at break has decreased by 49%

[0004] Although adding small molecular compounds to the polymer system is a common method to improve the processability of polymer materials (that is, the high fluidity of the small molecular compounds themselves can play a plasticizing role to improve the stretchability of the blended materials. performance purpose), but unfortunately, the existing technology often improves the stretchability of the blended material at the same time as the selected small molecular compound does not match the polymer system, and brings polymer materials Decrease in mechanical strength, heat resistance, etc.

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