Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder

An epoxy resin, modified technology, applied in the field of environmental protection board, can solve the problems of brittleness, poor impact resistance and stress cracking ability, limitation, non-environmental protection, etc., to achieve good toughness, good strength, good water and heat resistance The effect of acid and alkali corrosiveness

Active Publication Date: 2015-05-13
BEIJING JIAOTONG UNIV +1
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The raw material of the base plate of traditional wood products is wood, which needs to cut down forest resources, which will cause soil erosion and affect the balanced development of the natural environment and ecology. It is not environmentally friendly and cannot effectively save energy and reduce emissions.
[0003] With the rapid development of global electronic technology, industrial waste and domestic waste continue to be produced, resulting in a large amount of circuit board waste and leftovers in the global electronic waste and electronic industry production fields. Some studies have broken waste circuit boards into powder and then added them to bond However, most of the adhesives currently used are aldehyde-based adhesives such as phenolic resins, which are harmful to human health and the natural environment; some of the non-formaldehyde adhesives used have poor heat resistance and water resistance. Can not meet the use requirements
Thereby limiting the recycling of waste circuit board powder
[0004] As an adhesive with less environmental pollution, epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in coatings, adhesives, electronic packaging materials, etc. Brittle, poor resistance to impact and stress cracking, which limits its application

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder
  • Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder

Examples

Experimental program
Comparison scheme
Effect test

preparation example

[0023] Preparation example: preparation method of dimethyldichlorosilane modified epoxy resin

[0024] The method comprises the steps of:

[0025] Dissolve 1 mole of epoxy resin (EO 15-20, molecular weight 2000-3000) in toluene, slowly add 5-15 moles of dimethyldichlorosilane to the toluene solution dissolved in epoxy resin until no Until a large amount of aerosol is generated; 2) Let the solution continue to react for 1 hour. The whole reaction process is stirred by a stirring device. After the dimethyldichlorosilane and epoxy resin are fully absorbed, use triethylamine to absorb the HCl generated during the reaction. 3) After the reaction is completed, wash the solution several times with distilled water to remove the quaternary ammonium salt, then distill under reduced pressure to remove the toluene to obtain a dimethyldichlorosilane-modified epoxy resin.

Embodiment 1

[0026] Embodiment 1: The environmentally friendly board synthesized by using dimethyldichlorosilane modified epoxy resin and waste circuit board powder of the present invention includes the following components by weight ratio: 25 parts obtained in the preparation example. Epoxy resin, 75 parts waste circuit board powder. Practice has proved that the material mixed with each component under this formula can produce qualified environmental protection boards synthesized by using dimethyldichlorosilane modified epoxy resin and waste circuit board powder.

Embodiment 2

[0027] Embodiment 2: The environmentally friendly board synthesized by using dimethyldichlorosilane modified epoxy resin and waste circuit board powder of the present invention includes the following components by weight ratio: 20 parts of dimethyldichlorosilane modified Epoxy resin, 80 parts waste circuit board powder. Practice has proved that the material mixed with each component under this formula can produce qualified environmental protection boards synthesized by using dimethyldichlorosilane modified epoxy resin and waste circuit board powder.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides environment-friendly plate material compounded by waste circuit board non-metallic powder. The components of the environment-friendly plate material comprise, by weight, 15-25 parts of dimethyl dichloride silane modified epoxy resin and 70-80 parts of recovered waste circuit board powder. The environment-friendly plate material is good in strength, toughness, water-proof and heat-proof performance, corrosion-proof performance, environment-friendly performance and the like, and capable of being used as replacements for traditional building and decoration purpose plate material. 3-5 parts of hexamethylenetetramine curing agent, 3-5 parts of gamma-aminopropyl triethoxy silane coupling agent, 3-5 parts of dispersant and 1-2 parts of zinc stearate further can be added to the environment-friendly plate material, the compounded plate material is enabled to have better strength, processability, hot-water-resistance and gloss.

Description

technical field [0001] The invention relates to the field of environment-friendly boards, in particular to an environment-friendly board synthesized by utilizing waste metal powder of waste circuit boards. Background technique [0002] The raw material of the base plate of traditional wood products is wood, which needs to cut down forest resources, resulting in soil erosion, affecting the balanced development of the natural environment and ecology, not environmentally friendly and unable to effectively save energy and reduce emissions. [0003] With the rapid development of global electronic technology, industrial waste and domestic waste continue to be produced, resulting in a large amount of circuit board waste and leftovers in the global electronic waste and electronic industry production fields. Some studies have broken waste circuit boards into powder and then added them to bond However, most of the adhesives currently used are aldehyde-based adhesives such as phenolic ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/14C08L101/00C08L63/00C08G59/50
Inventor 段武彪王洋刘博张言超陈熙东郭建平
Owner BEIJING JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap