Preparation dedicated binder of microbeam analysis standard sample and blending method thereof
A standard technology for sample preparation and analysis, applied in the field of adhesives, can solve the problems of no relevant records found in patent searches, inability to carry out bonding operations, and no commercial adhesives, etc., to achieve good conductivity and moderate solidification speed , The effect of improving the yield of the preparation
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Embodiment 1
[0054] (1) drop into the reaction vessel with a volume fraction of 92% ethyl α-cyanoacrylate, and transfer into hydroquinone with a volume fraction of 2%, stir to make it fully mixed;
[0055] (2) add the metal soap stabilizer calcium stearate of 2% volume fraction in mixed solution, stir;
[0056] (3) add the styrene-butadiene rubber that adds 3% volume fraction again, stir;
[0057] (4) Add 1% volume fraction of terpene resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;
[0058] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 8 minutes, so the time used for the whole preparation process is 30 seconds.
[0059] Use this binder to embed Ti-Si alloy samples. The specific embedding process is to put the broken microbeam analysis standard sample raw material into a special...
Embodiment 2
[0061] (1) drop into the reaction vessel with a volume fraction of α-ethyl cyanoacrylate of 72%, and transfer into an organic copper salt polymerization inhibitor with a volume fraction of 2%, stir to make it fully mixed;
[0062] (2) Add 1% volume fraction of organotin stabilizer to the mixed solution and stir evenly;
[0063] (3) add the epoxy resin toughening agent that adds 3% volume fraction again, stir;
[0064] (4) Add an appropriate amount of 20% volume fraction of ultrafine carbon powder conductive particles, and stir evenly to form a conductive colloid;
[0065] (5) Add 2% volume fraction of hydrogenated rosin resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;
[0066] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 6 minutes, so the time used for the whole pr...
Embodiment 3
[0069] (1) drop into the reaction vessel with a volume fraction of 61% α-ethyl cyanoacrylate, and transfer into a volume fraction of 2% organic copper salt polymerization inhibitor, stir to make it fully mixed;
[0070] (2) Add 1% volume fraction of organotin class stabilizer organotin carboxylate to the mixed solution, stir evenly;
[0071] (3) add the epoxy resin toughening agent that adds 3% volume fraction again, stir;
[0072] (4) adding an appropriate amount of 30% volume fraction of refined calcium powder, and stirring evenly to form a conductive colloid;
[0073] (5) Add 3% volume fraction of rosin resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;
[0074] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 6 minutes, so the time used for the whole deployment proce...
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