Preparation dedicated binder of microbeam analysis standard sample and blending method thereof

A technology for sample preparation and analysis standards, applied in the field of adhesives, which can solve the problems of no relevant records found in patent searches, no commercialized adhesives, and inability to perform bonding operations, achieving good electrical conductivity and moderate solidification speed. , the effect of improving the yield of the preparation

Active Publication Date: 2013-06-05
BAOSHAN IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The adhesive used to fix the sample in the copper tube needs to meet various requirements: good adhesion to ensure that the sample will not fall off during subsequent processing and testing; Severe charge accumulation will affect the observation of the sample; the stability should be good, and the properties will not change due to the injection of the electron beam; the solidification rate should be appropriate, if the sample is bonded too fast, the binder will not fully infiltrate the sample. If it is solidified, there will be holes. If it is too slow, the adhesive will flow out of the copper pipe quickly due to the good fluidity of the adhesive, and the bonding operation will not be possible.
[0017] At present, there is no commercial adhesive that meets the above requirements on the market, and no relevant records have been found in patent searches

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] (1) drop into the reaction vessel with a volume fraction of 92% ethyl α-cyanoacrylate, and transfer into hydroquinone with a volume fraction of 2%, stir to make it fully mixed;

[0055] (2) add the metal soap stabilizer calcium stearate of 2% volume fraction in mixed solution, stir;

[0056] (3) add the styrene-butadiene rubber that adds 3% volume fraction again, stir;

[0057] (4) Add 1% volume fraction of terpene resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;

[0058] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 8 minutes, so the time used for the whole preparation process is 30 seconds.

[0059] Use this binder to embed Ti-Si alloy samples. The specific embedding process is to put the broken microbeam analysis standard sample raw material into a special...

Embodiment 2

[0061] (1) drop into the reaction vessel with a volume fraction of α-ethyl cyanoacrylate of 72%, and transfer into an organic copper salt polymerization inhibitor with a volume fraction of 2%, stir to make it fully mixed;

[0062] (2) Add 1% volume fraction of organotin stabilizer to the mixed solution and stir evenly;

[0063] (3) add the epoxy resin toughening agent that adds 3% volume fraction again, stir;

[0064] (4) Add an appropriate amount of 20% volume fraction of ultrafine carbon powder conductive particles, and stir evenly to form a conductive colloid;

[0065] (5) Add 2% volume fraction of hydrogenated rosin resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;

[0066] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 6 minutes, so the time used for the whole pr...

Embodiment 3

[0069] (1) drop into the reaction vessel with a volume fraction of 61% α-ethyl cyanoacrylate, and transfer into a volume fraction of 2% organic copper salt polymerization inhibitor, stir to make it fully mixed;

[0070] (2) Add 1% volume fraction of organotin class stabilizer organotin carboxylate to the mixed solution, stir evenly;

[0071] (3) add the epoxy resin toughening agent that adds 3% volume fraction again, stir;

[0072] (4) adding an appropriate amount of 30% volume fraction of refined calcium powder, and stirring evenly to form a conductive colloid;

[0073] (5) Add 3% volume fraction of rosin resin tackifier to the above-mentioned colloid, stir at the same time, adjust the viscosity of the colloid to be suitable for embedding operation;

[0074] The time used in the whole deployment process is controlled within 1 / 10 of the setting time of the adhesive. The solidification time of the prepared adhesive is 6 minutes, so the time used for the whole deployment proce...

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PUM

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Abstract

The invention provides a preparation dedicated binder of a microbeam analysis standard sample. The preparation dedicated binder of a microbeam analysis standard sample comprises components with the following volume fraction: alpha-ethyl cyanoacrylate, the volume fraction of the alpha-ethyl cyanoacrylate is more than 50%, tackifier, the volume fraction of the tackifier is 1-5%; stabilizer, the volume fraction of the stabilizer is 1-5%, flexibilizer, the volume fraction of the flexibilizer is 1-5%, and polymerization inhibitor, the volume fraction of the polymerization inhibitor is 1-5%. Simultaneously, the invention further provides a blending method of the preparation dedicated binder of a microbeam analysis standard sample, a throwing sequence is as following: the alpha- ethyl cyanoacrylate, the polymerization inhibitor, the stabilizer, the flexibilizer, and the tackifier, blended using time is controlled within one tenth of a binder solidification time. The preparation dedicated binder of the microbeam analysis standard sample possesses appropriate liquidity, solidification speed, and good electroconductibility in the meantime, solves an embedding problem of the microbeam analysis standard sample in the preparation process, so that an embedding rate of finished products is effectively improved.

Description

technical field [0001] The invention relates to a binder, in particular to a binder for standard sample embedding and a compounding method of the special binder. Background technique [0002] Microbeam analysis is an important means of modern material detection and research. It mainly uses electron beams as energy injection sources to stimulate the surface or subsurface of the sample to emit specific physical signals, and use these signals for morphology observation, element detection, and failure analysis. and other micro-area material analysis work. In the current work of materials, especially metal material mechanism research, new product development, quality control, defect identification and process improvement, the detection results of microbeam analysis have become an indispensable means and basis. [0003] Modern micro-beam analysis technology mainly uses secondary electrons, backscattered electrons, Auger electrons, transmitted electrons, cathodoluminescence and ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/04C09J9/02C09J11/08C09J11/06C09J11/04G01N1/36
Inventor 胡莹陈圣刘俊亮丁晨
Owner BAOSHAN IRON & STEEL CO LTD
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