DNA biosensor and preparation method thereof
A biosensor, sensor technology, applied in semiconductor/solid-state device manufacturing, instruments, scientific instruments, etc., can solve the problems that affect the wide application of biosensors, reduce sensor sensitivity, low hybridization efficiency, etc., achieve good electrical performance parameters, shorten detection time time, the effect of improving sensitivity
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Embodiment 1
[0035] In this example, see figure 1 , a DNA biosensor, composed of an organic thin film transistor and a DNA molecular probe 6, the DNA molecular probe 6 is used as a recognition element, and the organic thin film transistor is used as a sensor transducer to convert the biological signal detected by the DNA molecular probe 6 into Easy-to-detect electrical signals. The organic thin film transistor is composed of a substrate (1), a gate electrode (2), an insulating layer (3), an organic semiconductor layer (4) and a source-drain electrode (5). The bottom (1) has a gate electrode (2) and an insulating layer (3) in sequence, and the organic semiconductor layer (4) is a P-type organic semiconductor material or an N-type organic semiconductor material; on the insulating layer (3) there is an organic semiconductor layer ( 4) Form the active layer, and then make two source-drain electrodes (5) on the organic semiconductor layer (4) to form a bottom-gate-top contact structure; apply a...
Embodiment 2
[0049] This embodiment is basically the same as Embodiment 1, especially in that:
[0050] In this example, see Figure 4 , making two source-drain electrodes 5 on the insulating layer 3, and then making an organic semiconductor layer 4 on the insulating layer 3 in the channel region between the two source-drain electrodes 5 and between the two source-drain electrodes 5 to form a carrier injection layer , forming a bottom gate bottom contact structure. In this example, a structure similar to that of Example 1 was adopted to prepare a DNA biosensor with the same function. Wherein the substrate 1 , the gate electrode 2 and the insulating layer 3 are prepared using the materials related to the first embodiment. The preparation process of insulating layer 3 is to remove heat and oxidize a layer of SiO 2 In addition, magnetron sputtering can also be used to deposit a layer of N on the silicon substrate substrate 1 2 o 5 、TiO 2 , AlN 3 、Si 3 N 4 、 Ta 2 o 5 And other relat...
Embodiment 3
[0056] This embodiment is basically the same as Embodiment 1, especially in that:
[0057] In this example, see Figure 5 , there are two layers of organic semiconductor layers 4 on the insulating layer 3 to form a double-layer active layer, that is, on the organic semiconductor layer 4, continue to make the organic semiconductor layer 4 of the second layer, and then on the organic semiconductor layer 4 of the second layer Two source-drain electrodes 5 are fabricated to form a bottom-gate-top contact structure, and DNA molecular probes 6 are fixed on the upper surface of the second organic semiconductor layer 4 . Specifically: In this embodiment, see Figure 5 Compared with the first embodiment, this embodiment is special in that: the P-type semiconductor material of the organic semiconductor layer 4 is composed of two materials of pentacene (pentacene) and copper phthalocyanine (CuPc), and two organic semiconductor layers 4 are constructed. A two-layer active layer is forme...
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