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Resin composition for insulation film, and insulation film and circuit board containing same

A resin composition and composition technology, applied in the direction of printed circuit components, etc., can solve problems such as inability to meet advanced applications, and achieve the effects of good dielectric properties and fast cross-linking reaction

Active Publication Date: 2013-09-25
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the rapid development of communication and broadband application technology, as well as the popularization of cloud computing and the expansion of high-speed transmission applications, the materials used in existing traditional printed circuit boards (such as FR-4 grades) can no longer meet advanced applications. Especially high frequency printed circuit board needs

Method used

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  • Resin composition for insulation film, and insulation film and circuit board containing same
  • Resin composition for insulation film, and insulation film and circuit board containing same
  • Resin composition for insulation film, and insulation film and circuit board containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 20 g of polybutadiene-styrene-divinylbenzene terpolymer resin (Ricon 257) was dissolved in 180 g of toluene to prepare a 10% toluene solution. Add 100g epoxy resin (HP-6000), 6g di-tert-butylhydroquinone (DTBHQ), 15g polyphenylene ether modified cyanate ester resin (BTP- 6020S), 50g of spherical silica (Suzuki Grease B-6C) as an inorganic filler, 10g of hydrotalcite (inorganic filler), 4g of elongation adhesive (ethacure 100), 0.5g of tetraphenylboron tetrabenzene Base phosphine (catalyst) and 0.008g cobalt naphthoate (catalyst), 2g dicumyl peroxide (DCP) and 3g di-tert-butyl peroxide (perbutyl D). Then, 200 g of 10 wt% Ricon 257-containing toluene solution was added to the aforementioned reaction flask to prepare a dispersed resin composition.

Embodiment 2

[0036] 30 g of polybutadiene-styrene-divinylbenzene terpolymer resin (Ricon 257) was dissolved in 170 g of toluene to prepare a 15% toluene solution. Add 100g epoxy resin (PB-3600), 2g di-tert-butyl hydroquinone (DTBHQ), 30g polyphenylene ether modified cyanate ester resin (BTP-6020S), and 100g as inorganic in a 1000ml reaction flask. Filled spherical silica (Suzuki Grease B-6C), 10g hydrotalcite powder (inorganic filler), 4g refining extension adhesive (ethacure 100), 0.5g tetraphenyl boron tetraphenyl phosphine (catalyst) and 0.008g cobalt naphthoate (catalyst), 2g dicumyl peroxide (DCP) and 3g di-tert-butyl peroxide (perbutyl D). Then, 200 g of 15 wt% Ricon 257-containing toluene solution was added to the aforementioned reaction flask to prepare a dispersed resin composition.

Embodiment 3

[0038] 40 g of polybutadiene-styrene-divinylbenzene terpolymer resin (Ricon 257) was dissolved in 160 g of toluene to prepare a 20% toluene solution. Add 100g epoxy resin (NC-3000), 6g di-tert-butyl hydroquinone (DTBHQ), 45g polyphenylene ether modified cyanate ester resin (BTP-6020S), 120g as inorganic Filled spherical silica (Suzuki Grease B-6C), 10g hydrotalcite powder (inorganic filler), 4g refining extension adhesive (ethacure 100), 0.5g tetraphenyl boron tetraphenyl phosphine (catalyst) and 0.008g cobalt naphthoate (catalyst), 2g dicumyl peroxide (DCP) and 3g di-tert-butyl peroxide (perbutyl D). Then, 200 g of 20 wt% Ricon 257-containing toluene solution was added to the aforementioned reaction flask to prepare a dispersed resin composition.

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Abstract

The invention provides a resin composition for an insulation film, and the insulation film and a circuit board containing the same. The resin composition comprises: (A) 100 parts by weight of epoxy resins; (B) 20 to 100 parts by weight of a polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone; (D) 5 to 50 parts by weight of a polyphenylene ether modified cyanate ester resin; and optionally containing at least one of the following components: (E) an inorganic filler, (F) a refined extending sealing agent and (G) a catalyst. By containing the specific components and proportions, the resin composition can achieve high heat resistance, low dielectric constant and low dissipation factor, and is halogen-free, and thus the resin composition can be applied in a protection film of a printed circuit board, an insulating protection film of an electronic building brick or a resin insulation film of a lead frame.

Description

Technical field [0001] The present invention relates to a resin composition, especially a resin composition applied to an insulating film. Background technique [0002] In response to the world's environmental protection trends and green laws and regulations, halogen-free is the current environmental trend of the global electronics industry. Countries around the world and related electronics manufacturers have successively formulated the mass production schedule of halogen-free electronic products for their electronic products. After the implementation of the EU’s Restriction of Hazardous Substances (RoHS), substances containing lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or Its components. Printed Circuit Board (PCB) is the basis of electronic and electrical products. Halogen-free focuses on printed circuit boards. International organizations h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08L25/10C08L79/04C08L71/00C08K5/13C08K5/375C08K5/18C08K5/3492C08K5/14H05K1/02
Inventor 谢镇宇余奕飞
Owner ELITE MATERIAL
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