A kind of thermosetting resin composition and prepreg and laminated board made of it
A technology of resin composition and prepreg, which is applied in the field of thermosetting resin composition and the prepreg and laminate made by using it, which can solve the problems of heat resistance, water absorption, mechanical properties, flammability, toughness, etc., and achieve high modulus The effect of volume, high toughness and low water absorption
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Synthetic example
[0036] Put biphenol aldehyde, n-butanol and NaOH aqueous solution into the reaction bottle in proportion, stir and react at 70~80°C for 1 hour; then, cool down to 40°C, slowly add a certain proportion of allyl chloride dropwise, and raise the temperature to 70~80°C after the addition. Continue to react at 80°C for 4~6h; the reaction product is treated with suction filtration, evaporation, washing, filtration, and concentration to obtain a tan viscous liquid, that is, biphenyl novolac allyl ether.
[0037] Put the biphenyl phenolic allyl ether into the reaction bottle, pass through the nitrogen protection, raise the temperature to 190~200°C, and keep strictly <205°C, and react for 4 hours under this condition to obtain the biphenyl allyl phenolic compound.
Embodiment 1
[0039] Use 55 parts of biphenyl-type allylphenolic compound prepared in the synthesis example, 45 parts of 4,4'-diphenylmethane bismaleimide resin, react at 150°C for 60 minutes to prepare a prepolymer, and add an appropriate amount of acetone Dissolve; Stir and mix evenly to obtain a glue with a solid content of 62%;
[0040] Immerse the above glue solution with E glass fiber cloth, and bake in an oven at 160°C for 5 minutes to make a prepreg.
[0041] Place a piece of copper foil on the upper and lower sides of the above prepreg, and put them in a vacuum hot press to press to obtain a copper clad laminate. The specific pressing process is pressing at a pressure of 1.5Mpa and a temperature of 220° C. for 4 hours.
[0042] The properties of the obtained copper-clad laminates are shown in Table 1.
Embodiment 2
[0044]Using 45 parts of biphenyl-type allyl phenolic compound prepared in the synthesis example, 55 parts of 4,4'-diphenylmethane bismaleimide resin, and reacting at 150°C for 40 minutes to prepare a prepolymer, adding an appropriate amount of acetone Dissolve; Stir and mix evenly to obtain a glue solution with a solid content of 62%.
[0045] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.
[0046] The properties of the obtained copper-clad laminates are shown in Table 1.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More